Replacement contacts
View Patent ↗The present disclosure describes a method of forming a replacement contact. For example, the replacement contact can include a metal with one or more first sidewall surfaces and a top surface. A first dielectric can be formed to abut the one or more first sidewall surfaces of the metal. A second dielectric can be formed over the first dielectric and the top surface of the metal. An opening in the second dielectric can be formed. A metal oxide structure can be selectively grown on the top surface of the metal, where the metal oxide structure has one or more second sidewall surfaces. One or more spacers can be formed to abut the one or more second sidewall surfaces of the metal oxide structure. Further, the metal oxide structure can be removed.
1. A method of forming a replacement contact, the method comprising:
forming a first metal in a first dielectric, wherein the first metal comprises a top surface;
forming a metal oxide structure, with one or more sidewall surfaces, over the first metal;
forming one or more spacers abutting the one or more sidewall surfaces of the metal oxide structure;
forming a second dielectric abutting the one or more spacers to cover the first dielectric; and
forming an opening in the metal oxide structure to expose a portion of the top surface of the first metal.
2. The method of claim 1 , wherein the metal oxide structure comprises hafnium oxide (HfO 2 ), zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ), cerium oxide (CeO 2 ), titanium oxide (TiO2), or aluminum oxynitride (AlON).
3. The method of claim 1 , wherein the forming the opening in the metal oxide structure comprises etching the metal oxide structure with a selective dry etch process.
4. The method of claim 1 , wherein the forming the opening in the metal oxide structure comprises etching the metal oxide structure with a selective wet etch process.
5. The method of claim 1 , further comprises:
depositing a stack of one or more layers in the opening over the portion of the top surface of the first metal and the one or more spacers; and
depositing a second metal over the stack to fill the opening.
6. The method of claim 5 , wherein the first metal and the second metal comprise the same metal or different metals.
7. The method of claim 1 , wherein the forming the metal oxide structure comprises selectively growing the metal oxide structure with an Area-Selective Atomic Layer Deposition (AS-ALD) process.
8. The method of claim 1 , wherein the forming the metal oxide structure comprises growing the metal oxide structure with an Area-Selective CVD (AS-CVD) process.
9. The method of claim 1 , wherein the one or more second sidewall surfaces of the metal oxide structure are substantially vertical.
10. A method of forming a replacement contact, the method comprising:
forming a first metal in a first dielectric, wherein the first metal comprises an exposed top surface;
forming, over the first dielectric, a self-assembled monolayer to expose the top surface of the first metal;
growing a metal oxide structure over the first metal, wherein the metal oxide structure comprises one or more first sidewall surfaces;
removing the self-assembled monolayer;
forming one or more spacers abutting the one or more first sidewall surfaces of the metal oxide structure;
forming a second dielectric abutting the one or more spacers, wherein the second dielectric covers the first dielectric; and
removing the metal oxide structure to expose a portion of the top surface of the first metal.
11. The method of claim 10 , wherein the self-assembled monolayer comprises alkylsilane or octadecyltrichlorosilane.
12. The method of claim 10 , wherein the one or more second sidewall surface of the metal oxide structure are substantially vertical.
13. The method of claim 10 , wherein the removing the metal oxide structure comprises removing the metal oxide structure with a selective dry etch process or a wet etch process.
14. The method of claim 10 , further comprises:
depositing a stack of one or more layers over the portion of the top surface of the first metal and the one or more spacers; and
depositing a second metal over the stack, wherein the second metal is substantially aligned to the first metal.
15. The method of claim 10 , wherein the metal oxide structure comprises hafnium oxide (HfO 2 ), zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ), cerium oxide (CeO 2 ), titanium oxide (TiO2), or aluminum oxynitride (AlON).
16. A method of forming a replacement contact, the method comprising:
depositing, in a first dielectric, a metal that comprises an exposed top surface;
forming a metal oxide structure, with one or more sidewall surfaces, over the metal;
forming a second dielectric that abuts the metal oxide structure and covers the first dielectric; and
removing the metal oxide structure to expose the top surface of the metal with a selective etch process.
17. The method of claim 16 , wherein the metal oxide structure comprises hafnium oxide (HfO 2 ), zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ), cerium oxide (CeO 2 ), titanium oxide (TiO2), aluminum oxynitride (AlON), or any combination thereof.
18. The method of claim 16 , wherein the forming the metal oxide structure comprises growing the metal oxide structure with an Area-Selective Atomic Layer Deposition (AS-ALD) process or an Area-Selective CVD (AS-CVD) process.
19. The method of claim 16 , wherein the forming the metal oxide structure comprises:
forming a self-assembled monolayer (SAM) over the first dielectric;
forming an opening in the top surface of the metal;
forming the metal oxide structure in the opening; and
removing the SAM.
20. The method of claim 16 , further comprises:
depositing a stack of one or more layers over the top surface of the metal; and
depositing an other metal over the stack, wherein the other metal is substantially aligned to the metal.