Methods of preparing articles by electrodeposition and additive manufacturing processes

1. A method of forming an article with an electrodeposited coating, the method comprising:

preparing an electroplatable assembly by an additive manufacturing method selected from the group consisting of three-dimensional printing, selective laser sintering, sintering laser melting, fused deposition modeling, and stereolithography, the electroplatable assembly comprising a preform for the article and a thief and/or a shield, which are joined by direct contact or by respective sections of framework, wherein the preform and the thief and/or the shield are oriented relative to each other; and

forming the electrodeposited coating on at least a portion of a surface of the preform by electrodepositing a composition comprising one or more elements onto the preform.

2. The method of claim 1 , wherein the electrodepositing the composition comprises contacting at least a portion of the electroplatable assembly with an electrolyte comprising one or more electroplatable species of metal ions.

3. The method of claim 2 , wherein the contacting at least the portion of the electroplatable assembly with the electrolyte comprises flowing the electrolyte over or against at least the portion of the surface of the preform.

4. The method of claim 3 , wherein the flowing comprises:

agitation;

pumping electrolyte through one or more non-conductive tubes; or

pumping the electrolyte through one or more passages within a section of framework of the respective sections of framework and/or the shield.

5. The method of claim 3 , wherein the article produced has a percent thickness variation (PTV) that is less than 100%.

6. The method of claim 1 , wherein one or more of the preform, a section of framework of the respective sections of framework, the thief, or the shield comprises a non-conductive material.

7. The method of claim 6 , wherein the preform the section of framework, and/or the thief is subject to electroless plating prior to the electrodepositing of the composition onto the preform.

8. The method of claim 7 , wherein the non-conductive material is a polymer.

9. The method of claim 8 , wherein the polymer comprises: polyetherimide, polyetherketoneketone (PEKK), polyether ether ketone (PEEK), nylon, polyvinyl alcohol (PVA), acrylonitrile butadiene styrene (ABS), polycarbonate (PC), polylactic acid (PLA), PC/ABS, wood fiber, polyphenylsulfone (PPSU) or a combination thereof.

10. The method of claim 6 , wherein the preform and/or the thief comprise the non-conductive material, and wherein the non-conductive material incorporates a catalyst for electroless plating.

11. The method of claim 1 , wherein one or more of the preform, a section of the respective sections of framework, or the thief comprises a conductive material that comprises:

one or more metals;

a non-conductive polymer and one or more metals, graphite particles, graphite fibers, metal plated graphite particles or metal plated carbon fibers;

a conductive polymer and one or more metals, graphite particles, graphite fibers, metal plated graphite particles, or metal plated carbon fibers; or

a conductive polymer.

12. The method according to claim 1 , wherein the electrodeposited coating comprises a structurally and/or compositionally modulated material that comprises a plurality of layers with wavelengths between about 1 nm and about 250 nm.

13. The method of claim 1 , wherein the electrodeposited coating comprises a plurality of first layers and second layers arranged as alternating first and second layers.

14. The method of claim 13 , wherein the plurality of alternating first layers and second layers comprises four or more alternating first and second layers.

15. The method of claim 1 , further comprising separating the article from the respective sections of framework, the thief, and the shield following the electrodepositing.

16. The method of claim 1 , wherein preparing the electroplatable assembly comprises:

preparing the preform for the article, the thief and/or the shield;

wherein the preform, the thief, and/or the shield is prepared by the additive manufacturing method;

wherein the preform, the thief, and/or the shield each comprise a mating interface that permits assembly of the preform with the thief and/or the shield into the electroplatable assembly in which the preform is oriented relative to the thief and/or the shield; and

forming the electroplatable assembly comprising joining the preform and the thief and/or the shield to each other and/or to the respective sections of framework, which comprise corresponding mating interfaces that correspond to the mating interfaces, wherein the preform is oriented relative to the thief and/or the shield, which are oriented with respect to each other in the electroplatable assembly.

17. The method of claim 16 , wherein preparing the electroplatable assembly comprises:

preparing a preform-thieve-assembly in which the preform is joined and oriented relative to the thief by the respective sections of framework, wherein the preform-thieve-assembly comprises the mating interface;

preparing the shield which comprises an additional mating interface; and

forming the electroplatable assembly comprising joining the preform-thieve-assembly and the shield to each other and/or to the respective sections of framework.

18. The method of claim 16 , wherein preparing the electroplatable assembly comprises:

preparing a preform-shield-assembly in which the preform is joined and oriented relative to the shield by a section of the respective sections of framework, wherein the preform-shield-assembly comprises the mating interface;

preparing the thief which comprises an additional mating interface; and

forming the electroplatable assembly comprising joining the preform-shield-assembly and the thief to each other and/or to the respective sections of framework.

19. The method of claim 13 , wherein the electrodeposited coating further comprises one or more additional layers between a first layer and a second layer of the plurality of alternating first and second layers.

20. The method of claim 1 , wherein the electroplatable assembly comprises:

a plurality of thieves that comprises the thief; and/or

a plurality of shields that comprises the shield,

wherein the preform and each thief of the plurality of thieves and/or each shield of the plurality of shields is oriented relative to each other.