Method for making a seam-sealable non-magnetic lid and package

1. A method for making a seam-sealable non-magnetic lid, the method comprising:

forming a lid substrate from a blank consisting of molybdenum;

depositing an adhesion layer onto the lid substrate;

forming a copper seed layer on the adhesion layer;

forming a palladium solder base layer on the copper seed layer; and

coupling a gold/tin solder preform to the palladium solder base layer.

2. The method of claim 1 further comprising at least one of back sputtering, chemically etching, or mechanically etching the lid substrate prior to sputtering the adhesion layer.

3. The method of claim 1 further comprising vacuum baking the lid substrate prior to attaching the gold/tin solder preform.

4. The method of claim 1 wherein depositing the adhesion layer comprises depositing one or more materials selected from the group consisting of titanium, tantalum, and chromium.

5. The method of claim 1 further comprising tack welding the gold/tin solder preform to the solder base layer.

6. The method of claim 1 wherein forming the lid substrate comprises one of stamping and drawing the lid substrate to one of a concave shape and a stepped shape.

7. The method of claim 1 further comprising depositing the adhesion layer onto opposing surfaces of the lid substrate.

8. The method of claim 1 further comprising forming the palladium solder base layer to surround all surfaces of the lid substrate.

9. A method for making a non-magnetic hermetic package comprising:

providing a package body comprising non-magnetic walls and a metallic non-magnetic seal ring disposed on a sealing edge of the non-magnetic walls;

bonding a component within an interior cavity defined by the non-magnetic walls of the package body;

providing a metallic non-magnetic lid comprising a gold/tin solder preform coupled to a lid substrate consisting of molybdenum, the metallic non-magnetic lid further comprising an adhesion layer, a palladium base solder layer, and a copper seed layer positioned between the adhesion layer and the palladium solder base layer; and

seam sealing the gold/tin solder preform to the metallic non-magnetic seal ring.

10. The method of claim 9 further comprising hermetically sealing the component within the interior cavity.

11. The method of claim 9 further comprising fabricating the metallic non-magnetic lid by:

shaping a blank consisting of molybdenum into the lid substrate;

depositing the adhesion layer onto the lid substrate;

sputtering the copper seed layer onto the adhesion layer;

applying the palladium solder base layer onto the copper seed layer via one of an electroplating technique and a sputtering technique; and

tack welding the gold/tin solder preform to the palladium solder base layer.

12. The method of claim 9 further comprising applying electrical current to a surface of the lid substrate and to the metallic non-magnetic seal ring to locally reflow the gold/tin solder preform together with the metallic non-magnetic seal ring.

13. The method of claim 9 further comprising enclosing clean dry air within the interior cavity.

14. The method of claim 13 further comprising enclosing the clean dry air at a dew point less than about −40° C., a relative humidity of 0%, and a particulate concentration of less than about 10,000 ppm.

15. The method of claim 9 further comprising seam sealing the gold/tin solder preform to the metallic non-magnetic seal ring within a dry air glove box.

16. The method of claim 9 further comprising locally heating the gold/tin solder preform to seam seal the metallic non-magnetic lid to the metallic non-magnetic seal ring and create a fillet extending up over an outer edge of the metallic non-magnetic lid.

17. A method of manufacturing a metallic, non-magnetic lid that is seam-sealable onto a package, the method comprising:

providing a substrate consisting of molybdenum; and

depositing an adhesion layer, a copper seed layer, and a palladium solder base layer sequentially onto at least one surface of the substrate, wherein depositing each layer is accomplished by using one of physical vapor deposition, chemical vapor deposition, and electroplating.

18. The method of claim 17 further comprising attaching a gold/tin solder preform to the palladium solder base layer.

19. The method of claim 18 further comprising depositing the palladium solder base layer to surround all surfaces of the substrate.

20. The method of claim 18 further comprising vacuum baking the lid prior to attaching the gold/tin solder preform.

21. The method of claim 17 wherein depositing the adhesion layer comprises sputtering one of titanium, tantalum, and chromium.

22. The method of claim 17 further comprising depositing each of the adhesion layer, the copper seed layer, and the palladium solder base layer such that each layer surrounds the substrate.

23. The method of claim 17 further comprising depositing a gold strike layer between the copper seed layer and the palladium solder base layer.