Porous fin as compliant medium to form dislocation-free heteroepitaxial films
View Patent ↗A method for forming a heteroepitaxial layer includes forming an epitaxial grown layer on a monocrystalline substrate and patterning the epitaxial grown layer to form fins. The fins are converted to porous fins. A surface of the porous fins is treated to make the surface suitable for epitaxial growth. Lattice mismatch is compensated for between an epitaxially grown monocrystalline layer grown on the surface and the monocrystalline substrate by relaxing the epitaxially grown monocrystalline layer using the porous fins to form a relaxed heteroepitaxial interface with the monocrystalline substrate.
1. A semiconductor device, comprising:
a porous fin formed on a monocrystalline substrate;
a hydrogenated surface formed on the porous fin; and
an epitaxial monocrystalline layer formed on the hydrogenated surface, the epitaxial monocrystalline layer including a material other than a material of the monocrystalline substrate and forming a relaxed heteroepitaxial interface with the monocrystalline substrate wherein a thickness of the porous fin and a thickness of the epitaxial monocrystalline layer include a thickness ratio configured to relax strain in the epitaxial monocrystalline layer.
2. The semiconductor device as recited in claim 1 , wherein the epitaxial monocrystalline layer includes laterally grown portions to form a continuous layer of the epitaxial monocrystalline layer between the porous fins.
3. The semiconductor device as recited in claim 2 , wherein the epitaxial monocrystalline layer includes a vertically grown portion of the epitaxially grown monocrystalline layer to form a thicker layer.
4. The semiconductor device as recited in claim 1 , wherein the device includes a transistor, diode or laser.
5. The semiconductor device as recited in claim 1 , wherein the epitaxial monocrystalline layer is free of dislocation defects.
6. The semiconductor device as recited in claim 1 , wherein the porous fins include one of porous silicon, porous Ge, or a porous III-V material.
7. The semiconductor device as recited in claim 1 , wherein a porosity of the porous fins is greater than about 40%.
8. The semiconductor device as recited in claim 1 , wherein a thickness ratio between the porous fin and an epitaxial monocrystalline layer is between about 2:1 to about 1:5.
9. A semiconductor device, comprising:
a porous fin formed on a monocrystalline substrate, wherein the porous fins include one of porous silicon, porous Ge, or a porous III-V material;
a hydrogenated surface formed on the porous fin; and
an epitaxial monocrystalline layer formed on the hydrogenated surface, the epitaxial monocrystalline layer including a material other than a material of the monocrystalline substrate and forming a relaxed heteroepitaxial interface with the monocrystalline substrate.
10. A semiconductor device, comprising:
a porous fin formed on a monocrystalline substrate;
a hydrogenated surface formed on the porous fin; and
an epitaxial monocrystalline layer formed on the hydrogenated surface, the epitaxial monocrystalline layer including a material other than a material of the monocrystalline substrate and forming a relaxed heteroepitaxial interface with the monocrystalline substrate, wherein the semiconductor device includes a transistor, diode or laser.