Compact opto-electronic modules and fabrication methods for such modules
Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
1. An optoelectronic module comprising:
an optoelectronic device embedded in a semiconductor substrate mounted on a printed circuit board;
outer sidewalls of the optoelectronic module laterally surrounding the semiconductor substrate and in direct contact with sides of the semiconductor substrate and the printed circuit board, wherein the outer sidewalls of the optoelectronic module are composed of a material that is non-transparent to light emitted by or detectable by the optoelectronic device;
a cover glass disposed directly on the semiconductor substrate including the optoelectronic device and in direct contact with the semiconductor substrate: and
a module cover disposed over the cover glass, and including a lens or diffuser on a surface of a transparent section of the module cover, wherein
the outer sidewalls of the optoelectronic module serve as a spacer that contacts a surface of the printed circuit board on which the semiconductor substrate is mounted and that also contacts an opposing surface of the module cover, wherein the opposing surface of the module cover faces towards the printed circuit board on which the semiconductor substrate is mounted, and wherein the non-transparent material of the outer sidewalls of the optoelectronic module is overmolded directly onto a top surface of the cover glass and near edges of the cover glass.
2. The optoelectronic module of claim 1 , wherein the outer sidewalls of the optoelectronic module are composed of a vacuum injected material.
3. The optoelectronic module of claim 1 , wherein the outer sidewalls of the optoelectronic module are composed of a UV or thermally-cured polymer material containing a non-transparent filler material.
4. The optoelectronic module of claim 1 , wherein the optoelectronic device includes:
a light detecting element.
5. The optoelectronic module of claim 1 , further including an adhesive underfill between the semiconductor substrate and the printed circuit board on which it is mounted.