Patent Assignment
Reel/Frame 049222/0062
Change of Name
Recorded: 2019-02-08
Pages: 8
Assignor
HEPTAGON MICRO OPTICS PTE. LTD.
Executed: 2018-02-05
Assignee
AMS SENSORS SINGAPORE PTE. LTD.
7000 ANG MO KIO AVENUE 5, #05-00, SINGAPORE, 569877, SINGAPORE
Covered Properties
(101)
Wafer-Level Fabrication of Optical Devices with Front Focal Length Correction
Method for Wafer-Level Manufacturing of Objects and Corresponding Semi-Finished Products
Opto-Electronic Modules, in Particular Flash Modules, and Method for Manufacturing the Same
Opto-Electronic Module for Emitting Light of Variable Intensity Distribution
Manufacture of Truncated Lenses, of Pairs of Truncated Lenses and of Corresponding Devices
Illumination System
Wristwatch Including an Integrated Pulse Oximeter or Other Modules That Sense Physiological Data
Sensor System With Active Illumination
Micro-Optical Orientation Sensor and Related Methods
Optical Assembly Including Passive Optical Elements Having Alignment Features
Modules Having Multiple Optical Channels Including Optical Elements at Different Heights Above the Optoelectronic Devices
Cameras Having an Optical Channel That Includes Spatially Separated Sensors for Sensing Different Parts of the Optical Spectrum
Application:
15/082,681 →
Publication:
US 2016/0292506
Cameras Having a Rgb-Ir Channel
Application:
15/082,776 →
Publication:
US 2016/0295133
Wafer-Level Optical Modules and Methods for Manufacturing the Same
Image Sensor Modules Including Primary High-Resolution Imagers and Secondary Imagers
Optical Encoder System
Optoelectronic Module with Low- and High-Power Illumination Modes
Optoelectronic Modules Operable to Collect Distance Data via Time-of-Flight and Triangulation
Concealed Optoelectronic Module
Structured-Stereo Imaging Assembly Including Separate Imagers for Different Wavelengths
Optoelectronic Modules Having Features for Reducing the Visual Impact of Interior Components
Application:
15/304,269 →
Publication:
US 2017/0047487
Wafer-Level Manufacture of Devices, in Particular of Optical Devices
Manufacture of Optical Elements by Replication and Corresponding Replication Tools and Optical Devices
Optoelectronic Modules Including Hybrid Arrangements of Beam Shaping Elements, and Imaging Devices Incorporating the Same
Techniques for Reducing Distortion of Optical Beam Shaping Elements
Optoelectronic Modules Operable to Distinguish Between Signals Indicative of Reflections from an Object of Interest and Signals Indicative of a Spurious Reflection
Application:
15/325,811 →
Publication:
US 2017/0135617
Optical Ranging System Having Multi-Mode Light Emitter
Optoelectronic Device Including Event-Driven Photo-Array and Method for Operating the Same
Application:
15/363,120 →
Publication:
US 2017/0153107
Power Savings Through Refresh Control for Distance Sensing Devices
Quantum Dot Film Based Demodulation Structures
Optoelectronic Systems and Method for Operating the Same
Compact Opto-Electronic Modules and Fabrication Methods for Such Modules
Transceiver Module Including Optical Sensor at a Rotationally Symmetric Position
Determining Spectral Emission Characteristics of Incident Radiation
Compact, Power-Efficient Stacked Broadband Optical Emitters
Optical Element Stack Assemblies
Manufacture of Optical Light Guides
Application:
15/522,423 →
Publication:
US 2017/0336543
Optical Pattern Projection
Apparatus for Producing Patterned Illumination Using Arrays of Light Sources and Lenses
Optoelectronic Module for Spectral and Proximity Data Acquisition
Application:
15/558,209 →
Publication:
US 2018/0073924
Image Sensor Module with Auto Focus Control
Optoelectronic Module Operable for Distance Measurements
Methods of Attaching Surfaces Together by Adhesives, and Devices Including Surfaces Attached Together by Adhesives
Time-Of-Fight Pixel Including in-Pixel Buried Channel Transistors
Pinned Photodiode Pixels Including Current Mirror-Based Background Light Suppression, and Imaging Devices Including the Same
Optoelectronic Modules Including an Optical System Tilted with Respect to a Focal Plane
Optoelectronic Module Including Lens Barrel Comprising Flanges and Adhesive Thereon and Resting Directly on a Cover Glass
Optical Ranging Systems Including Optical Cross-Talk Reducing Features
Light Conversion Modules Having a Laser Diode Light Conversion Assembly and Long Pass Filter Reflecting Light Back to the Light Conversion Assembly
Optoelectronic Modules Having a Silicon Substrate, and Fabrication Methods for Such Modules
Optoelectronic Modules Including Optoelectronic Device Subassemblies and Methods of Manufacturing the Same
Optical and Optoelectronic Assemblies Including Micro-Spacers, and Methods of Manufacturing the Same
Optical Modules Including Focal Length Adjustment and Fabrication of the Optical Modules
Projecting a Structured Light Pattern Onto a Surface and Detecting and Responding to Interactions with the Same
Projecting a Structured Light Pattern Onto a Surface and Detecting and Responding to Interactions with the Same
Time of Flight-Based Systems Operable for Ambient Light and Distance or Proximity Measurements
Compact Optoelectronic Modules
Optoelectronic Modules Including Overmold Supporting an Optical Assembly
Generating a Distance Map Based on Captured Images of a Scene
Generating a Disparity Map Based on Stereo Images of a Scene
Application:
15/745,146 →
Publication:
US 2019/0012789
Generating a Disparity Map Based on Stereo Images of a Scene
Application:
15/745,150 →
Publication:
US 2018/0213201
Intelligent Illumination Systems Using Modulated Light
Generating a Merged, Fused Three-Dimensional Point Cloud Based on Captured Images of a Scene
Optical Modules Including Customizable Spacers for Focal Length Adjustment and/or Reduction of Tilt, and Fabrication of the Optical Modules
Illumination Assembly for 3D Data Acquisition
Generating a Disparity Map Having Reduced Over-Smoothing
Optical Assemblies Including a Spacer Adhering Directly to a Substrate
Illumination Modules for Translating Light
Wafer-Level Optical Device Having Light Guide Properties
Imaging Devices Having Autofocus Control
Optoelectronic Modules for the Acquisition of Spectral and Distance Data
Optoelectronic Modules Operable to Collect Spectral Data and Distance Data
Molded Circuit Substrates
Application:
15/766,943 →
Publication:
US 2018/0302990
Demodulation Pixel Devices, Arrays of Pixel Devices and Optoelectronic Devices Incorporating the Same
Optical Crosstalk Calibration for Ranging Systems
Electrical-Contact Assemblies
Application:
15/769,893 →
Publication:
US 2018/0315911
Athermal Optical Assembly
Optical Device
Enhanced Distance Data Acquisition
Optical Element Stack Assemblies
Acquisition of Distance Data with Optical Ranging Systems
Thermally Tunable Optoelectronic Modules
Optoelectronic Modules and Methods for Manufacturing the Same
Opto-Electronic Modules and Methods of Manufacturing the Same and Appliances and Devices Comprising the Same
Accurate Positioning and Alignment of a Component During Processes Such as Reflow Soldering
Optoelectronic Module with Customizable Spacers
Assembly of Wafer Stacks
Optoelectronic Systems
Application:
15/999,249 →
Publication:
US 2019/0107627
Optoelectronic Module Having Dual Encapsulation With Opening for Receiving an Optical Assembly
Three-Dimensional Imaging Using Frequency Domain-Based Processing
Optoelectronic Modules Having Features for Improved Alignment and Reduced Tilt
Semiconductor Devices
Optoelectronic Modules Having Fluid Permeable Channels and Methods for Manufacturing the Same
Application:
16/071,320 →
Publication:
US 2020/0066957
Multi-Mode Illumination Module and Related Method
Optoelectronic Modules and Methods for Operating the Same
Thin Optoelectronic Modules with Apertures and Their Manufacture
Illumination Modules and Optoelectronic Systems
Optoelectronic Module Assembly and Manufacturing Method
Thin Optoelectronic Modules with Apertures and Their Manufacture
Optoelectronic Modules With Alignment Spacers and Methods for Assembling the Same
Microlens Array Diffusers
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 7, 2014
From: RUDMANN, HARTMUT; MALUCK, MATTHIAS; BIETSCH, ALEXANDER; ROENTGEN, PETER
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 032839/0814 →
Assignment of Assignor's Interest
May 7, 2014
From: RIEL, PETER; RUDMANN, HARTMUT; ROSSI, MARKUS
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 032840/0010 →
Assignment of Assignor's Interest
Jan 21, 2015
From: RUDMANN, HARTMUT; ROSSI, MARKUS; KROMHOF, RENE
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 034774/0319 →
Assignment of Assignor's Interest
Jan 22, 2015
From: ROSSI, MARKUS
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 034789/0856 →
Assignment of Assignor's Interest
Jun 8, 2015
From: RUDMANN, HARTMUT; SOECHTIG, JURGEN; SPRING, NICOLA; BIETESCH, ALEXANDER
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 035856/0001 →
Assignment of Assignor's Interest
Oct 28, 2015
From: MEITAV, OHAD
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 036898/0986 →
Assignment of Assignor's Interest
Mar 18, 2016
From: GEIGER, JENS; WESTENHOFER, SUSANNE
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 038020/0488 →
Assignment of Assignor's Interest
Apr 5, 2016
From: RUDMANN, HARTMUT; ROENTGEN, PETER
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 038195/0143 →
Assignment of Assignor's Interest
Apr 7, 2016
From: ALASIRNIO, JUKKA; SENN, TOBIAS; ROSSI, MARKUS; RUDMANN, HARTMUT
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 038852/0142 →
Assignment of Assignor's Interest
Apr 18, 2016
From: RUDMANN, HARTMUT; ENGELHARDT, KAI; TIAN, YIBIN
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 038308/0777 →
Assignment of Assignor's Interest
Jun 2, 2016
From: ROSSI, MARKUS
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 038788/0695 →
Assignment of Assignor's Interest
Jun 3, 2016
From: DAHLMANN, GERALD
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 038802/0426 →
Assignment of Assignor's Interest
Aug 18, 2016
From: BUETTGEN, BERNHARD
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 039475/0071 →
Assignment of Assignor's Interest
Sep 21, 2016
From: GEIGER, JENS; SPRING, NICOLA; LENART, ROBERT; HALLAL, BASSAM
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 039809/0123 →
Assignment of Assignor's Interest
Oct 20, 2016
From: ALASIRNIÖ, JUKKA; SENN, TOBIAS; MEITAV, OHAD; DORON, MOSHE
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 040077/0378 →
Assignment of Assignor's Interest
Oct 20, 2016
From: FRIESE, CHRISTOPH
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 040077/0110 →
Corrective Assignment to Correct the Second Inventor Execution Date Previously Recorded at Reel: 040077 Frame: 0378. Assignor(S) Hereby Confirms the Assignment.
Jan 13, 2017
From: ALASIRNIÖ, JUKKA; SENN, TOBIAS; MEITAV, OHAD; DORON, MOSHE
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 041366/0452 →
Assignment of Assignor's Interest
Mar 29, 2017
From: OGGIER, THIERRY; DESCHLER, MATHIAS; KALOUSTIAN, STÉPHANE
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 041783/0128 →
Assignment of Assignor's Interest
Apr 6, 2017
From: DIAS, DANIEL; KETTUNEN, VILLE; ROSSI, MARKUS
To: HEPTAGON OY
Reel/Frame 041887/0360 →
Assignment of Assignor's Interest
Apr 17, 2017
From: HEPTAGON OY
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 042029/0601 →
Change of Name
Nov 11, 2024
From: HEPTAGON MICRO OPTICS PTE. LTD.
To: AMS SENSORS SINGAPORE PTE. LTD.
Reel/Frame 069337/0882 →
Change of Name
Nov 11, 2024
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 069337/0965 →
Change of Name
Feb 5, 2025
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 070112/0514 →
Assignment of Assignor's Interest
Feb 13, 2025
From: AMS-OSRAM ASIA PACIFIC PTE. LTD.
To: FOCUSLIGHT SINGAPORE PTE. LTD.
Reel/Frame 070205/0557 →
Change of Name
Nov 3, 2025
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 073476/0659 →