Thin optoelectronic modules with apertures and their manufacture
The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.
1. An optical device comprising a substrate member;
one or more active optical components operable to emit or sense light of a particular range of wavelengths;
a clear encapsulation material translucent to light of the particular range of wavelengths;
an opaque coating material opaque for light of the particular range of wavelengths, the opaque coating defining at least one aperture associated with the one or more active optical components;
an opaque wall structure made of an opaque encapsulation material opaque to light of the particular range of wavelengths, wherein the opaque wall structure includes at least one wall having a first end adjacent to the substrate member and a second end opposite to the first end and wherein a cut is present in the second end of the wall; and
a spectral filter layer made of a spectral filter layer material wherein the cut is at least partially filled by the spectral filter layer material
wherein the one or more active optical components are attached to the substrate member, and
wherein the clear encapsulation material establishes an overmold for the one or more active optical components.
2. The optical device according to claim 1 , comprising one or more passive optical components made of the clear encapsulation material.
3. The optical device according to claim 1 , wherein a thickness of the substrate member in a first region in which the opaque wall structure abuts the substrate member is smaller than a thickness of the substrate member in a second region encircled by the first region.
4. The optical device according to claim 1 , comprising a resilient encapsulation material establishing an overmold for the one or more active optical components, wherein the clear encapsulation material establishes an overmold for the resilient encapsulation material.
5. The optical device according to claim 1 , wherein the opaque wall structure comprises at least one wall exhibiting an L-shape in a cross-section.
6. The optical device according to claim 1 , wherein the opaque wall structure comprises at least one wall exhibiting substantially a T-shape in a cross-section.
7. The optical device according to claim 1 , wherein the substrate member is opaque to light of the particular range of wavelengths, and wherein the optical device comprises an enclosure which is light-tight for light of the particular range of wavelengths with the exception of the at least one aperture, the enclosure comprising at least a portion of the substrate member, at least a portion of the opaque wall structure and at least a portion of the opaque coating material, and wherein the one or more active optical components are located inside the enclosure.
8. An optical device comprising:
a substrate member;
one or more active optical components operable to emit or sense light of a particular range of wavelengths;
a clear encapsulation material translucent to light of the particular range of wavelengths;
an opaque coating material opaque for light of the particular range of wavelengths, the opaque coating defining at least one aperture associated with the one or more active optical components;
an opaque wall structure made of an opaque encapsulation material opaque to light of the particular range of wavelengths, the opaque wall structure includeing a cut in a top portion of the opaque wall strucute; and
a spectral filter layer made of a spectral filter layer material, wherein the cut is at least partially filled by the spectral filter layer material;
wherein said spectral filter layer is translucent for the light of the particular range of wavelengths emitted or sensed by the one or more active optical components,
wherein the one or more active optical components are attached to the substrate member, and
wherein the clear encapsulation material establishes an overmold for the one or more active optical components.