IP Library Assignment 069337/0882
Patent Assignment
Reel/Frame 069337/0882

Change of Name

Recorded: 2024-11-11 Pages: 3
Assignor
HEPTAGON MICRO OPTICS PTE. LTD.
Executed: 2018-04-30
Assignee
AMS SENSORS SINGAPORE PTE. LTD.
7000 ANG MO KIO AVENUE 5, #02-00, SINGAPORE, 569877, SINGAPORE
Covered Properties (17)
Mems Microphone Modules and Wafer-Level Techniques for Fabricating the Same
Patent: 9,826,316 →
Application: 14/894,059 →
Publication: US 2016/0112808
Compact Camera Module Arrangements That Facilitate Dam-and-Fill and Similar Encapsulation Techniques
Patent: 9,826,131 →
Application: 15/024,133 →
Publication: US 2016/0241749
Stacks of Arrays of Beam Shaping Elements Including Stacking, Self-Alignment and/or Self-Centering Features
Patent: 9,977,153 →
Application: 15/116,599 →
Publication: US 2016/0349414
Optical Encoder System
Application: 15/127,660 →
Publication: US 2018/0172483
Structured-Stereo Imaging Assembly Including Separate Imagers for Different Wavelengths
Application: 15/300,997 →
Publication: US 2017/0034499
Optoelectronic Modules Including Hybrid Arrangements of Beam Shaping Elements, and Imaging Devices Incorporating the Same
Application: 15/318,025 →
Publication: US 2017/0108699
Quantum Dot Film Based Demodulation Structures
Application: 15/419,273 →
Publication: US 2017/0222076
Optoelectronic Systems and Method for Operating the Same
Application: 15/447,341 →
Publication: US 2017/0257366
Time-Of-Fight Pixel Including in-Pixel Buried Channel Transistors
Application: 15/596,136 →
Publication: US 2017/0338274
Light Emitter and Light Detector Modules Including Vertical Alignment Features
Application: 15/675,955 →
Publication: US 2017/0343889
Mems Microphone Modules and Wafer-Level Techniques for Fabricating the Same
Application: 15/788,267 →
Publication: US 2018/0295453
Optoelectronic Module Having Dual Encapsulation With Opening for Receiving an Optical Assembly
Application: 15/999,848 →
Publication: US 2020/0127156
Thin Optoelectronic Modules with Apertures and Their Manufacture
Application: 16/073,418 →
Publication: US 2019/0051762
Illumination Modules and Optoelectronic Systems
Application: 16/074,262 →
Publication: US 2020/0064521
Optoelectronic Module Assembly and Manufacturing Method
Application: 16/086,868 →
Publication: US 2019/0088801
Optoelectronic Modules With Alignment Spacers and Methods for Assembling the Same
Application: 16/093,840 →
Publication: US 2019/0081187
Illumination Assembly for 3D Data Acquisition
Application: 16/935,641 →
Publication: US 2020/0348456
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 25, 2015
From: GEIGER, JENS; ROSSI, MARKUS; RUDMANN, HARTMUT
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 037140/0483 →
Assignment of Assignor's Interest Aug 23, 2016
From: RUDMANN, HARTMUT; ROSSI, MARKUS; CESANA, MARIO; MEITAV, OHAD
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 039509/0823 →
Assignment of Assignor's Interest Sep 21, 2016
From: GEIGER, JENS; SPRING, NICOLA; LENART, ROBERT; HALLAL, BASSAM
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 039809/0123 →
Assignment of Assignor's Interest Oct 20, 2016
From: ALASIRNIÖ, JUKKA; HEIMGARTNER, STEPHAN
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 040078/0878 →
Assignment of Assignor's Interest Oct 25, 2016
From: DORON, MOSHE; MEITAV, OHAD; ROSSI, MARKUS; RYUMA, DMITRY
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 040120/0578 →
Assignment of Assignor's Interest Dec 12, 2016
From: PÉREZ CALERO, DANIEL; ENGELHARDT, KAI; RUDMANN, HARTMUT; SENN, TOBIAS
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 040708/0983 →
Assignment of Assignor's Interest Feb 1, 2017
From: FURRER, DANIEL; BEER, STEPHAN; BUETTGEN, BERNHARD
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 041142/0190 →
Assignment of Assignor's Interest Mar 24, 2017
From: TIAN, YIBIN; VOLKERINK, HENDRIK
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 041734/0627 →
Assignment of Assignor's Interest Sep 28, 2017
From: RIEL, PETER; ROSSI, MARKUS; PÉREZ CALERO, DANIEL; GLOOR, MATTHIAS
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 044049/0293 →
Assignment of Assignor's Interest Oct 20, 2017
From: GEIGER, JENS; ROSSI, MARKUS; RUDMANN, HARTMUT
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 043909/0206 →
Assignment of Assignor's Interest Nov 28, 2017
From: GANCARZ, RADOSLAW MARCIN; FURRER, DANIEL; VAELLO PAÑOS, MIGUEL BRUNO; BEER, STEPHAN
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 044231/0347 →
Assignment of Assignor's Interest Aug 3, 2018
From: YU, QICHUAN; RUDMANN, HARTMUT; WANG, JI; NG, KIAN SIANG
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 046549/0389 →
Assignment of Assignor's Interest Aug 6, 2018
From: BOYTARD, MAI-LAN ELODIE; MÜLLER, PHILIPP; BALIMANN, MARTIN LUKAS
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 046565/0210 →
Corrective Assignment to Correct the 7TH Assignor's Name Previously Recorded at Reel: 046549 Frame: 0389. Assignor(S) Hereby Confirms the Assignment. Oct 23, 2018
From: YU, QICHUAN; RUDMANN, HARTMUT; WANG, JI; NG, KIAN SIANG
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 047289/0895 →
Change of Name Feb 8, 2019
From: HEPTAGON MICRO OPTICS PTE. LTD.
To: AMS SENSORS SINGAPORE PTE. LTD.
Reel/Frame 048289/0147 →
Change of Name Feb 8, 2019
From: HEPTAGON MICRO OPTICS PTE. LTD.
To: AMS SENSORS SINGAPORE PTE. LTD.
Reel/Frame 049222/0062 →
Change of Name Nov 11, 2024
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 069337/0965 →
Change of Name Nov 3, 2025
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 073476/0659 →