Assembly of wafer stacks
A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.
1. A wafer stack comprising:
a substrate wafer having an upper surface on which are mounted a plurality of light emitting or light sensing components;
a spacer wafer attached to the substrate wafer and having first openings such that each of the light emitting or light sensing components is laterally surrounded by the spacer wafer, the spacer wafer further having second openings; and
an optics wafer attached to the spacer wafer, the optics wafer including a plurality of optical elements on at least one of its surfaces, the optics wafer further including solid UV-transparent windows;
wherein each of the solid UV-transparent windows is disposed directly over the respective second opening in the spacer wafer at an interface between the spacer wafer and the optics wafer, each of the second openings being filled with UV-cured adhesive that locally bonds the spacer wafer and the optics wafer together,
wherein each of the solid UV-transparent windows in the optics wafer is disposed adjacent a periphery of the optics wafer.
2. The wafer stack of claim 1 wherein the substrate wafer, spacer wafer, and optics wafer are made of materials substantially non-transparent to UV-radiation.
3. The wafer stack of claim 1 wherein the optics wafer is attached to the spacer wafer by thermal adhesive.
4. The wafer stack of claim 1 wherein the spacer wafer is attached to the substrate wafer by thermal adhesive.
5. The wafer stack of claim 1 wherein the solid UV-transparent windows in the optics wafer are equally spaced from one another.
6. The wafer stack of claim 1 wherein each of the solid UV-transparent windows in the optics wafer has a diameter in a range of 2-4 mm.
7. A wafer stack comprising:
a substrate wafer having an upper surface on which are mounted a plurality of light emitting or light sensing components;
a spacer wafer bonded to the substrate wafer and having first openings such that each of the light emitting or light sensing components is laterally surrounded by the spacer wafer, the spacer wafer further having second openings filled with UV-cured adhesive; and
an optics wafer bonded to the spacer wafer, the optics wafer including a plurality of optical elements on at least one of its surfaces, the optics wafer having through-holes containing UV-cured adhesive, wherein each of the through-holes containing UV-cured adhesive is disposed directly over a respective one of the second openings in the spacer wafer, at an interface between the spacer wafer and the optics wafer, that is filled with UV-cured adhesive, and
wherein the UV-cured adhesive in the through-holes and in the second openings locally bond the spacer wafer and the optics wafer together,
wherein each of the through-holes containing UV-cured adhesive in the optics wafer is disposed adjacent a periphery of the optics wafer.
8. The wafer stack of claim 7 wherein the substrate wafer, spacer wafer, and optics wafer are made of materials substantially non-transparent to UV-radiation.
9. The wafer stack of claim 7 wherein the optics wafer is attached to the spacer wafer by thermal adhesive.
10. The wafer stack of claim 7 wherein the spacer wafer is attached to the substrate wafer by thermal adhesive.
11. The wafer stack of claim 7 wherein the through-holes containing UV-cured adhesive in the optics wafer are equally spaced from one another.
12. The wafer stack of claim 7 wherein each of the through-holes containing UV-cured adhesive in the optics wafer has a diameter in a range of 2-4 mm.