Thin optoelectronic modules with apertures and their manufacture
The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.
1. An optical device comprising:
a substrate member;
one or more active optical components operable to emit or sense light of a particular range of wavelengths;
a clear encapsulation material translucent to light of the particular range of wavelengths, wherein the clear encapsulation material establishes an overmold for the one or more active optical components;
a spectral filter layer material structured on a face of the clear encapsulation material so as to define one or more apertures over and associated with the one or more active optical components each;
an opaque encapsulation material opaque to light of the particular range of wavelengths establishing an opaque wall structure;
an opaque coating opaque to light of the particular range of wavelengths and which abuts the opaque encapsulation material, wherein the opaque coating establishes one or more aperture stops, wherein the one or more aperture stops delimit the one or more apertures defined by the spectral filter layer material;
wherein the one or more active optical components are attached to the substrate member;
wherein the clear encapsulation material is laterally surrounded by the opaque wall structure, wherein the opaque coating is disposed above the clear encapsulation material;
wherein each aperture is between walls defined by the opaque wall structure smaller than a spacing between the walls; and
wherein the substrate member is disposed below the clear encapsulation material.
2. The optical device according to claim 1 , wherein the spectral filter layer material is translucent for light of the particular range of wavelengths.
3. The optical device according to claim 1 , wherein the spectral filter layer material is opaque for light of a range of wavelengths outside the particular range of wavelengths.
4. The optical device according to claim 1 , wherein the opaque wall structure comprises at least one wall having a top end facing away from the substrate member, wherein at least one of
the opaque encapsulation material of the wall at the top end is split;
a cut is present in the top end of the wall.
5. The optical device according to claim 1 , comprising one or more passive optical components made of the clear encapsulation material.
6. The optical device according to claim 1 , wherein a thickness of the substrate member in a first region in which the opaque wall structure abuts the substrate member is smaller than a thickness of the substrate member in a second region encircled by the first region.
7. The optical device according to claim 1 , comprising a resilient encapsulation material establishing an overmold for the one or more active optical components, wherein the clear encapsulation material establishes an overmold for the resilient encapsulation material.
8. The optical device according to claim 1 , wherein the opaque wall structure comprises at least one wall exhibiting an L-shape in a cross-section.
9. The optical device according to claim 1 , wherein the opaque wall structure comprises at least one wall exhibiting substantially a T-shape in a cross-section.
10. The optical device according to claim 1 , wherein the substrate member is opaque to light of the particular range of wavelengths, and wherein the optical device comprises an enclosure which is light-tight for light of the particular range of wavelengths with the exception of the one or more apertures, the enclosure comprising at least a portion of the substrate member and at least a portion of the opaque encapsulation material, and wherein the one or more active optical components are located inside the enclosure.
11. The optical device according to claim 1 , wherein the optical device is a proximity sensor.