Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
An optical module comprising: a plurality of active optoelectronic components each one mounted on a respective printed circuit board (PCB), wherein each active optoelectronic component is associated with a respective different optical channel; a plurality of optical assemblies, each one is substantially aligned over a different respective optical channel; and a spacer separating the active optoelectronic components and PCBs from the optical assemblies, wherein the optical assemblies are attached by adhesive directly to an optical assembly-side surface of the spacer. A first active optoelectronic component is separated, by the spacer, from a first optical assembly by a first distance and a second active optoelectronic component is separated, by the spacer, from a second optical assembly by a different second distance. Also contemplated is a method for fabricating an optical module that comprises: modifying a height of one or more extensions on a spacer to adjust for at least one of a focal length or tilt of at least one optical channel.
1. An optical module comprising:
a plurality of active optoelectronic components each of which is mounted on a respective printed circuit board, wherein each of the active optoelectronic components is associated with a respective different optical channel;
a plurality of optical assemblies, each of which is substantially aligned over a different respective one of the optical channels; and
a spacer separating the active optoelectronic components and printed circuit boards from the optical assemblies,
wherein the optical assemblies are attached by adhesive directly to an optical assembly-side surface of the spacer,
wherein the spacer includes first edge features in contact with top surfaces of the active optoelectronic components and second edge features attached to top surfaces of the printed circuit boards, and
wherein a first one of the active optoelectronic components is separated, by the spacer, from a first one of the optical assemblies by a first distance and wherein a second one of the active optoelectronic components is separated, by the spacer, from a second one of the optical assemblies by a different second distance.
2. The optical module of claim 1 wherein the second edge features are attached to the top surfaces of the printed circuit boards by adhesive.
3. The optical module of claim 1 wherein the spacer is a single monolithic piece.
4. The optical module of claim 1 wherein the spacer has trenches that provide space for electrical connections from the active optoelectronic components to the printed circuit boards.
5. The optical module of claim 4 wherein the trenches are formed as spaces about a periphery of each respective active optoelectronic component.
6. The optical module of claim 1 wherein the active optoelectronic components comprise image sensors, and wherein each of the optical assemblies is aligned over a respective one of the image sensors.
7. The optical module of claim 6 wherein the spacer has through-holes each of which allows light to pass from a respective one of the optical assemblies to a respective one of the image sensors.
8. The optical module of claim 7 further including at least one optical filter supported by the optical assembly-side surface of the spacer.
9. The optical module of claim 8 wherein each optical filter is disposed over a respective one of the through-holes of the spacer.
10. The optical module of claim 1 further including at least one optical filter supported by the optical assembly-side surface of the spacer.
11. The optical module of claim 1 wherein the optical assembly-side surface of the spacer includes an indented region shaped and sized to receive an optical filter.
12. A method of fabricating an optical module, the method comprising:
providing a spacer plate including respective through-holes each of which corresponds to a respective optical channel, the spacer further including first extensions to provide respective sensor-edge features for contact with respective image sensors and second extensions to provide respective PCB-edge features for attachment to respective PCBs, the first and second extensions being present on a first side of the spacer;
modifying a height of one or more of the extensions to adjust for at least one of a focal length or tilt of at least one of the optical channels;
subsequently bringing respective active optoelectronic components into contact with respective ones of the sensor-edge features, and attaching respective PCBs on which the respective active optoelectronic components are mounted to respective ones of the PCB-edge features;
the method further including attaching optical assemblies by adhesive directly to a second side of the spacer, the second side of the spacer being on an opposite side of the spacer from the first side.
13. The method of claim 12 further including:
measuring a respective focal length for each of the optical channels; and
comparing each of the measured focal lengths to a specified value;
wherein modifying a height of one or more of the extensions is based on the comparing.
14. The method of 12 wherein modifying the height of one or more of the extensions includes micromachining one or more of the extensions to reduce its height.
15. The method of claim 12 wherein each respective PCB is attached to a respective one of the PCB-edge features via adhesive.
16. The method of claim 12 further including placing an optical filter on the second side of the spacer such that the optical filter is supported by the spacer and covers one of the through-holes of the spacer.