Optoelectronic modules including overmold supporting an optical assembly
Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer-level fabrication methods for making the modules.
1. An optoelectronic module comprising:
an image sensor mounted on a substrate;
electrical connections coupling the image sensor to electrical contacts on the substrate;
an overmold laterally encircling the image sensor and in contact with a side edge of the image sensor;
an optical assembly disposed over the image sensor; and
a spacer having:
a first surface in direct contact with an optical assembly-side surface of the image sensor, wherein the optical assembly-side surface of the image sensor faces the optical assembly; and
a second surface in contact, by way of adhesive, with the optical assembly-side surface of the overmold, wherein the optical assembly-side surface of the overmold faces a same direction as the optical assembly-side surface of the image sensor.
2. The optoelectronic module of claim 1 wherein the overmold partially overlaps the optical assembly-side surface of the image sensor adjacent the side edge of the image sensor.
3. The optoelectronic module of claim 1 wherein the overmold encases the electrical connections.
4. The optoelectronic module of claim 1 wherein the overmold is composed of a resin having less than 0.1% water absorption.
5. The optoelectronic module of claim 1 wherein the overmold is composed of a molding resin.
6. The optoelectronic module of claim 1 wherein the optical assembly includes a threaded lens barrel operable to adjust the distance between the image sensor and an optical element in the optical assembly.
7. The optoelectronic module of claim 1 wherein the optical assembly includes an autofocus lens barrel operable to adjust the distance between the image sensor and an optical element in the optical assembly.
8. The optoelectronic module of claim 1 wherein the second surface of the spacer is further from the optical assembly-side surface of the image sensor than is the first surface of the spacer.
9. An optoelectronic module comprising:
an image sensor mounted on a substrate;
electrical connections coupling the image sensor to electrical contacts on the substrate;
an overmold encasing the electrical connections; and
an optical assembly disposed over the image sensor, the optical assembly including:
a first surface in direct contact with a surface of the image sensor; and
a second surface in contact, by way of adhesive, with a surface of the overmold, wherein the surface of the overmold faces a same direction as the surface of the image sensor.
10. The optoelectronic module of claim 8 wherein the overmold partially overlaps an optical assembly-side surface of the image sensor adjacent a side edge of the image sensor.
11. The optoelectronic module of claim 9 wherein the overmold is composed of a resin having less than 0.1% water absorption.
12. The optoelectronic module of claim 9 wherein the overmold is composed of a molding resin.
13. The optoelectronic module of claim 9 wherein the second surface of the spacer is further from the surface of the image sensor than is the first surface of the spacer.