Non-volatile memory structures having multi-layer conductive channels
Conductive channel technology is disclosed. In one example, a memory component can include a source line, a conductive channel having first and second conductive layers electrically coupled to the source line and memory cells adjacent to the conductive channel. In one aspect, channel conductivity and reliability is improved over a single layer conductive channel formation scheme by preventing unwanted oxide formation, increasing the interface contact area, and by modulating material grain size and boundaries via multiple thin channel integration scheme. Associated systems and methods are also disclosed.
1. A memory component, comprising:
a source line;
a conductive channel having first and second conductive layers electrically coupled to the source line, said first and second conductive layers directly interfacing one another along at least a portion thereof, and wherein a portion of the conductive channel is in direct contact with the source line; and
memory cells adjacent to the conductive channel.
2. The memory component of claim 1 , wherein the first conductive layer is spaced apart from the source line.
3. The memory component of claim 2 , wherein a portion of the second conductive layer is disposed between and interfaces with the source line and the first conductive layer.
4. The memory component of claim 3 , wherein an interface of the second conductive layer and the source line is substantially free of an oxide material.
5. The memory component of claim 3 , wherein an interface of the second conductive layer and the source line is planar.
6. The memory component of claim 5 , wherein the interface of the second conductive layer and the source line has a diameter greater than or equal to 25 nm.
7. The memory component of claim 2 , wherein portions of the second conductive layer surround a portion of the first conductive layer.
8. The memory component of claim 1 , wherein the first and second conductive layers each comprise a doped polysilicon material.
9. The memory component of claim 8 , wherein the doped polysilicon materials of the first and second conductive layers are different.
10. The memory component of claim 9 , wherein the first conductive layer is P-type or N-type doped, and the second conductive layer is the other of P-type or N-type doped.
11. The memory component of claim 1 , further comprising an insulative material disposed within the conductive channel.
12. The memory component of claim 1 , further comprising a dielectric layer adjacent to the conductive channel.
13. The memory component of claim 12 , wherein the dielectric layer forms a tunnel dielectric.
14. The memory component of claim 1 , wherein each memory cell comprises:
a tunnel dielectric adjacent to the conductive channel;
a charge storage structure adjacent to the tunnel dielectric;
a control gate; and
a blocking dielectric between the charge storage structure and the control gate.
15. The memory component of claim 1 , further comprising a source select gate adjacent to the conductive channel.
16. A memory device, comprising:
a substrate; and
a memory component as recited in claim 1 operably coupled to the substrate.
17. The memory device of claim 16 , wherein each memory cell comprises:
a tunnel dielectric adjacent to the conductive channel;
a charge storage structure adjacent to the tunnel dielectric;
a control gate; and
a blocking dielectric between the charge storage structure and the control gate.
18. The memory device of claim 16 , further comprising a source select gate adjacent to the conductive channel.