Stacked silicon package assembly having enhanced stiffener
A chip package assembly and method for fabricating the same are provided which utilize a stiffener to improve a package substrate against out of plane deformation. In one example, a chip package assembly is provided that includes a package substrate, at least one integrated circuit (IC) die and a stiffener. The package substrate has a first surface and a second surface coupled by a side wall. The at least one IC die is disposed on the first surface of the package substrate. The stiffener is disposed outward of the at least one IC die. The stiffener has a first surface disposed outward of and bonded to the side wall of the package substrate. The stiffener has a second surface bonded to at least one of the first and second surfaces of the package substrate.
1. A chip package assembly, comprising:
a package substrate having a first surface and a second surface coupled by a side wall;
at least one integrated circuit (IC) die disposed on the first surface of the package substrate;
a stiffener having a first surface disposed outward of and bonded to the side wall of the package substrate, the stiffener having a second surface bonded to at least one of the first and second surfaces of the package substrate, the stiffener circumscribing the IC die, the stiffener including a third surface disposed opposite the first surface of the stiffener and parallel thereto;
an adapter, not integral with the package substrate and the stiffener, coupled to the stiffener, the adapter including an outer wall substantially aligned with the third surface of the stiffener; and
a plurality of solder balls disposed on the second surface of the package substrate.
2. The chip package assembly of claim 1 , wherein the stiffener is bonded to the adapter and the first surface of the package substrate.
3. The chip package assembly of claim 1 , wherein the stiffener is bonded to the adapter and the second surface of the package substrate.
4. The chip package assembly of claim 1 , wherein the stiffener further comprises:
a standoff portion projecting below the second surface of the package substrate.
5. The chip package assembly of claim 4 , wherein the solder balls extend a distance from the second surface of the package substrate beyond the standoff portion.
6. The chip package assembly of claim 1 , further comprising:
a lid coupled to the stiffener and extending across the IC die.
7. The chip package assembly of claim 6 , wherein the stiffener is bonded to the first surface of the package substrate and to the lid.
8. The chip package assembly of claim 6 , wherein the stiffener is bonded to the second surface of the package substrate and to the lid.
9. The chip package assembly of claim 6 , wherein the stiffener further comprises:
a standoff portion projecting below the second surface of the package substrate.
10. The chip package assembly of claim 9 , wherein the solder balls extend a distance from the second surface of the package substrate beyond the standoff portion.
11. The chip package assembly of claim 1 , wherein the stiffener is bonded to the side wall and the second surface of the package substrate.
12. A chip package assembly comprising:
a package substrate having a first surface and a second surface coupled by a side wall;
at least one integrated circuit (IC) die disposed on the first surface of the package substrate;
a stiffener circumscribing the IC die and having:
a first surface disposed outward of and bonded to the side wall of the package substrate;
a second surface bonded to at least one of the first and second surfaces of the package substrate and including:
a first portion covering a first corner of the package substrate; and
a second portion covering a second corner of the package substrate, wherein the second surface of the stiffener is discontinuous between the first and second portions; and
a third surface disposed opposite the first surface of the stiffener and parallel thereto; and
an adapter, not integral with the package substrate and the stiffener, coupled to the stiffener, the adapter including an outer wall substantially aligned with the third surface of the stiffener.
13. The chip package assembly of claim 1 , wherein the second surface of the stiffener covers only a portion of the first surface or the second surface of the package substrate.
14. The chip package assembly of claim 1 , wherein the stiffener comprises:
a plurality of stiffener segments, each segment bonded to a different portion of the package substrate.
15. The chip package assembly of claim 1 , wherein a material of the adapter and a material of the stiffener are the same.
16. The chip package assembly of claim 1 , wherein the adapter is bonded to the stiffener.
17. The chip package assembly of claim 1 , wherein the adapter is mechanically coupled to the stiffener.
18. The chip package assembly of claim 1 , wherein the adapter includes a top wall, a bottom wall parallel to the top wall, an inner wall perpendicular to the top wall, the outer wall parallel to the inner wall, an outer mounting surface parallel to the inner wall, and a bottom mounting surface parallel to the top wall, and wherein at least one of the outer mounting surface and the bottom mounting surface is bonded to the stiffener.
19. The chip package assembly of claim 1 , wherein the adapter includes a top wall, a bottom wall parallel to the top wall, an inner wall perpendicular to the top wall, an outer wall parallel to the inner wall, an inner mounting surface parallel to the outer wall, and a bottom mounting surface parallel to the top wall, and wherein at least one of the inner mounting surface and the bottom mounting surface is bonded to the stiffener.
20. The chip package assembly of claim 19 , wherein the outer wall of the adapter is spaced apart from the stiffener by a length of the bottom wall.
21. A chip package assembly, comprising:
a package substrate having a first surface and a second surface coupled by a side wall;
at least one integrated circuit (IC) die disposed on the first surface of the package substrate;
a stiffener circumscribing the IC die and having:
a first surface disposed outward of and bonded to the side wall of the package substrate;
a second surface bonded to at least one of the first and second surfaces of the package substrate;
a third surface disposed opposite the first surface of the stiffener and parallel thereto; and
a standoff portion projecting below the second surface of the package substrate; and
an adapter, not integral with the package substrate and the stiffener, coupled to the stiffener, the adapter including an outer wall substantially aligned with the third surface of the stiffener.