Manufacturing method for EMI shielding structure

1. A manufacturing method of an electromagnetic interference (EMI) shielding structure, the method comprising:

forming a shielding dam on a printed circuit board by continuously discharging an electroconductive material through a nozzle, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board;

forming an insulating member on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions;

forming a shielding member by covering an upper surface of the insulating member with the electroconductive material; and

prior to the forming the shielding dam, disposing at least one dummy member on a corner of a moving path of the nozzle,

wherein, in the forming the shielding dam, the nozzle moves, while discharging the electroconductive material, toward one surface of the dummy member wherein, in the forming the shielding dam, when the one surface of the dummy member is a sloped surface, the nozzle moves upwardly along the slope surface of the dummy member, while discharging the electroconductive material toward the sloped surface of the dummy member.

2. The manufacturing method of claim 1 , wherein the forming the shielding dam comprises forming a border portion and a partition portion of the shielding dam of the shielding dam continuously by one material discharge process, the border portion surrounding the adjacent shielding regions, and the partition portion being disposed between the adjacent shielding regions and within the border portion.

3. The manufacturing method of claim 1 , wherein the forming the shielding dam comprises:

moving the nozzle while the nozzle discharges the electroconductive material;

stopping the nozzle at a position that is a certain distance apart from a previously formed portion of the shielding dam;

while the nozzle is stopped, filling a space between the previously formed portion and the position of the nozzle by discharging the electroconductive material toward the previously formed portion; and

resuming moving the nozzle while the nozzle discharges the electroconductive material.

4. The manufacturing method of claim 1 , wherein the forming the shielding dam comprises:

moving the nozzle while the nozzle discharges the electroconductive material;

stopping the nozzle at a position that is a certain distance apart from a previously formed portion of the shielding dam;

moving the nozzle to a position adjacent to the previously formed portion so that the electroconductive material previously discharged from the nozzle is pushed toward and contacts the previously formed portion; and

resuming moving the nozzle while the nozzle discharges the electroconductive material toward the previously formed portion.

5. The manufacturing method of claim 1 , wherein the forming the shielding dam comprises:

while the nozzle discharges the electroconductive material, moving the nozzle at a first speed to a first position adjacent to a previously formed portion of the shielding dam; and

while the nozzle discharges the electroconductive material, moving the nozzle upwardly at a second speed from the first position to a second position that is higher than the previously formed portion, wherein the second speed is slower than the first speed.

6. The manufacturing method of claim 1 , wherein, in the forming the shielding dam, the nozzle discharges the electroconductive material to contact at least two portions of a previously formed portion of the shielding dam while moving from a starting point to an ending point of the shielding dam.