Electronic component
An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.
1. An electronic component comprising:
an element body in which a plurality of insulator layers are stacked;
a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other;
an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer, the outer electrode being connected to one of the plurality of inner conductors;
a connection conductor included in the inner conductor connected to the outer electrode, the connection conductor electrically connecting the baked electrode layer to the inner conductor; and
a protruding portion included in the connection conductor, the protruding portion protruding from the outer surface of the element body to the outer electrode and including a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer,
wherein the inner conductors have a lower electric resistance value than the protruding portion including the metal.
2. The electronic component according to claim 1 , wherein
the metal of the main component included in the baked electrode layer is Ag, and
the metal included in the protruding portion is Pd.
3. The electronic component according to claim 1 , wherein
the outer surface of the element body is covered with a glass layer, and
the protruding portion is electrically connected to the baked electrode layer by penetrating the glass layer.