Enhanced Spatial ALD Of Metals Through Controlled Precursor Mixing
Methods of depositing a film by atomic layer deposition are described. The methods comprise exposing a substrate surface to a first process condition comprising a first reactive gas and a second reactive gas and exposing the substrate surface to a second process condition comprising the second reactive gas. The first process condition comprises less than a full amount of the second reactive gas for a CVD process.
1 . A method comprising:
exposing a substrate surface to a first process condition comprising a first reactive gas and a second reactive gas; and
exposing the substrate surface to a second process condition comprising the second reactive gas,
wherein the first process condition comprises less than a full amount of the second reactive gas for CVD.
2 . The method of claim 1 , wherein the first reactive gas comprises WF 6 .
3 . The method of claim 2 , wherein the second reactive gas comprises H 2 .
4 . The method of claim 1 , wherein the second reactive gas is pulsed into the first reactive gas in the first process condition.
5 . The method of claim 1 , wherein the second reactive gas is continuously flowed into the first reactive gas in the first process condition.
6 . The method of claim 1 , wherein the first reactive gas and the second reactive gas in the first process condition are mixed prior to flowing into a process region of a processing chamber.
7 . The method of claim 1 , wherein the second reactive gas comprises in the range of about 1 to about 10% of the first reactive gas in the first process condition.
8 . The method of claim 1 , wherein a film is deposited with a deposition rate in the range of about 0.2 to about 1 Å/cycle.
9 . The method of claim 1 , further comprising repeated exposure to the first process condition and the second process condition.
10 . The method of claim 1 , further comprising laterally moving the substrate surface through a gas curtain from the first process condition to the second process condition.
11 . A method comprising:
exposing a substrate surface to a first process condition comprising a first reactive gas and a second reactive gas, the first reactive gas and the second reactive gas are spontaneously reactive; and
exposing the substrate surface to a second process condition consisting essentially of the second reactive gas,
wherein the first process condition comprises less than a full amount of the second reactive gas for CVD.
12 . The method of claim 11 , wherein the first reactive gas comprises WF 6 .
13 . The method of claim 12 , wherein the second reactive gas consists essentially of H 2 .
14 . The method of claim 11 , wherein the second reactive gas is pulsed into the first reactive gas in the first process condition.
15 . The method of claim 11 , wherein the second reactive gas is continuously flowed into the first reactive gas in the first process condition.
16 . The method of claim 11 , wherein the first reactive gas and the second reactive gas in the first process condition are mixed prior to flowing into a process region of a processing chamber.
17 . The method of claim 11 , wherein the second reactive gas comprises in the range of about 1 to about 10% of the first reactive gas in the first process condition.
18 . The method of claim 11 , wherein a film is deposited with a deposition rate in the range of about 0.2 to about 1 Å/cycle.
19 . The method of claim 11 , further comprising repeated exposure to the first process condition and the second process condition.
20 . A method comprising:
exposing a substrate surface to a first process condition in a first process region of a processing chamber, the first process condition comprising a constant flow of a first reactive gas comprising WF 6 and a pulsed flow of a second reactive gas consisting essentially of H 2 , the second reactive gas pulsed so that there is less than a full amount of the second reactive gas for CVD;
laterally moving the substrate through a gas curtain from the first process region to a second process region of the processing chamber, the gas curtain comprising one or more of a purge gas stream and/or a vacuum region;
exposing the substrate surface to a second process condition in the second process region, the second process condition consisting essentially of the H 2 ;
laterally moving the substrate through a gas curtain from the second process region, the gas curtain comprising one or more of a purge gas stream and/or a vacuum region; and
repeating exposures to the first process condition and the second process condition to deposit a film of a predetermined thickness.