Integrated circuit cell library for multiple patterning
A method is disclosed for defining a multiple patterned cell layout for use in an integrated circuit design. A layout is defined for a level of a cell in accordance with a dynamic array architecture so as to include a number of layout features. The number of layout features are linear-shaped and commonly oriented. The layout is split into a number of sub-layouts for the level of the cell. Each of the number of layout features in the layout is allocated to any one of the number of sub-layouts. Also, the layout is split such that each sub-layout is independently fabricatable. The sub-layouts for the level of the cell are stored on a computer readable medium.
1. A semiconductor chip, comprising:
a gate electrode level including a plurality of linear-shaped conductive structures defined to extend lengthwise in a first direction, the plurality of linear-shaped conductive structures positioned in accordance with a fixed pitch such that a distance as measured in a second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the fixed pitch,
wherein the plurality of linear-shaped conductive structures includes a first set of linear-shaped conductive structures corresponding to a first sub-layout and a second set of linear-shaped conductive structures corresponding to a second sub-layout, the second set of linear-shaped conductive structures interleaved with the first set of linear-shaped conductive structures such that each linear-shaped conductive structure of the second set of linear-shaped conductive structures is separated from at least one adjacently located linear-shaped conductive structure of the first set of linear-shaped conductive structures by the fixed pitch as measured in the second direction between their first-direction-oriented-lengthwise-centerlines,
wherein each of the plurality of linear-shaped conductive structures has a respective total length as measured in the first direction along its first-direction-oriented-lengthwise-centerline, and wherein the total length of each linear-shaped conductive structure of the first set of linear-shaped conductive structures is equal,
wherein the first set of linear-shaped conductive structures is manufactured using a first mask, and wherein the second set of linear-shaped conductive structures is manufactured using a second mask different from the first mask, and wherein the first set of linear-shaped conductive structures is manufactured separately from the second set of linear-shaped conductive structures.
2. A semiconductor chip as recited in claim 1 , wherein the integer multiple of the fixed pitch is equal to the fixed pitch multiplied by a whole number selected from a set of whole numbers including zero.
3. A semiconductor chip as recited in claim 2 , wherein some of the plurality of linear-shaped conductive structures are substantially co-aligned such that the distance as measured in the second direction between their first-direction-oriented-lengthwise-centerlines is substantially equal to zero.
4. A semiconductor chip as recited in claim 1 , wherein a spacing between at least one of the linear-shaped conductive structures of the first set of linear-shaped conductive structures and an adjacent one of the linear-shaped conductive structures of the second set of linear-shaped conductive structures is outside a fabrication capability of a semiconductor fabrication process.
5. A semiconductor chip as recited in claim 1 , wherein the first set of linear-shaped conductive structures correspond to a first plurality of linear-shaped conductive structures, and
wherein the second set of linear-shaped conductive structures correspond to a second plurality of linear-shaped conductive structures, and
wherein the fixed pitch of the gate electrode level corresponds to a first pitch, and
wherein the semiconductor chip further comprises a first interconnect level including a third plurality of linear-shaped conductive structures defined to extend lengthwise in the first direction, the third plurality of linear-shaped conductive structures positioned in accordance with a second pitch such that a distance as measured in the second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the third plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the second pitch,
the first interconnect level including a fourth plurality of linear-shaped conductive structures defined to extend lengthwise in the first direction, the fourth plurality of linear-shaped conductive structures positioned in accordance with a third pitch such that a distance as measured in the second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the fourth plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the third pitch.
6. A semiconductor chip as recited in claim 5 , wherein at least one of the second and third pitches is equal to the first pitch.
7. A semiconductor chip as recited in claim 5 , wherein at least one of the second and third pitches is equal to the first pitch multiplied by a ratio of integers.
8. A semiconductor chip as recited in claim 1 , wherein some linear-shaped conductive structures of the second set of linear-shaped conductive structures are co-aligned such that the distance as measured in the second direction perpendicular to the first direction between their first-direction-oriented-lengthwise-centerlines is equal to zero, and wherein adjacently positioned co-aligned linear-shaped conductive structures of the second set of linear-shaped conductive structures are separated from each other by a uniform end-to-end spacing as measured in the first direction.
9. A semiconductor chip as recited in claim 1 , wherein the total length of each linear-shaped conductive structure of the second set of linear-shaped conductive structures is equal.
10. A semiconductor chip, comprising:
a gate electrode level including a plurality of linear-shaped conductive structures defined to extend lengthwise in a first direction, the plurality of linear-shaped conductive structures positioned in accordance with a fixed pitch such that a distance as measured in a second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the fixed pitch,
wherein the plurality of linear-shaped conductive structure includes a first set of linear-shaped conductive structures corresponding to a first sub-layout and a second set of linear-shaped conductive structures corresponding to a second sub-layout, the second set of linear-shaped conductive structures interleaved with the first set of linear-shaped conductive structures such that each linear-shaped conductive structure of the second set of linear-shaped conductive structures is separated from at least one adjacently located linear-shaped conductive structure of the first set of linear-shaped conductive structures by the fixed pitch as measured between their first-direction-oriented-lengthwise-centerlines,
wherein the total length of each linear-shaped conductive structure of the first set of linear-shaped conductive structures is equal to a first total length, and wherein the total length of each linear-shaped conductive structure of the second set of linear-shaped conductive structures is equal to a second total length, and wherein the first total length is different than the second total length,
wherein the first set of linear-shaped conductive structures is manufactured using a first mask, and wherein the second set of linear-shaped conductive structures is manufactured using a second mask different from the first mask, and wherein the first set of linear-shaped conductive structures is manufactured separately from the second set of linear-shaped conductive structures.
11. A semiconductor chip as recited in claim 10 , wherein some linear-shaped conductive structures of the second set of linear-shaped conductive structures are co-aligned such that the distance as measured in the second direction perpendicular to the first direction between their first-direction-oriented-lengthwise-centerlines is equal to zero, and wherein adjacently positioned co-aligned linear-shaped conductive structures of the second set of linear-shaped conductive structures are separated from each other by a uniform end-to-end spacing as measured in the first direction.
12. A semiconductor chip, comprising:
a gate electrode level including a plurality of linear-shaped conductive structures defined to extend lengthwise in a first direction, the plurality of linear-shaped conductive structures positioned in accordance with a fixed pitch such that a distance as measured in a second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the fixed pitch,
wherein the plurality of linear-shaped conductive structure includes a first set of linear-shaped conductive structures corresponding to a first sub-layout and a second set of linear-shaped conductive structures corresponding to a second sub-layout and a third set of linear-shaped conductive structures corresponding to a third sub-layout,
the first, second, and third sets of linear-shaped conductive structures positioned in a sequential manner in the second direction, wherein each linear-shaped conductive structure of the second set of linear-shaped conductive structures is positioned between at least one adjacently located linear-shaped conductive structure of the first set of linear-shaped conductive structures and at least one adjacently located linear-shaped conductive structure of the third set of linear-shaped conductive structures, and wherein each linear-shaped conductive structure of the third set of linear-shaped conductive structures is positioned between at least one adjacently located linear-shaped conductive structure of the second set of linear-shaped conductive structures and at least one adjacently located linear-shaped conductive structure of the first set of linear-shaped conductive structures,
wherein the first set of linear-shaped conductive structures is manufactured using a first mask, and wherein the second set of linear-shaped conductive structures is manufactured using a second mask different from the first mask, and wherein the third set of linear-shaped conductive structures is manufactured using a third mask different from both the first mask and the second mask, and
wherein the first set of linear-shaped conductive structures is manufactured separately from both the second and third sets of linear-shaped conductive structures, and wherein the second set of linear-shaped conductive structures is manufactured separately from both the first and third sets of linear-shaped conductive structures, and wherein the third set of linear-shaped conductive structures is manufactured separately from both the first and second sets of linear-shaped conductive structures.
13. A semiconductor chip as recited in claim 12 , wherein the integer multiple of the fixed pitch is equal to the fixed pitch multiplied by a whole number selected from a set of whole numbers including zero.
14. A semiconductor chip as recited in claim 13 , wherein some of plurality of linear-shaped conductive structures are substantially co-aligned such that the distance as measured in the second direction perpendicular to the first direction between their first-direction-oriented-lengthwise-centerlines is substantially equal to zero.
15. A semiconductor chip as recited in claim 12 , wherein a spacing between at least one of the linear-shaped conductive structures of the first set of linear-shaped conductive structures and an adjacent one of the linear-shaped conductive structures of the second set of linear-shaped conductive structures is outside a fabrication capability of a semiconductor fabrication process.
16. A semiconductor chip as recited in claim 15 , wherein a spacing between at least one of the linear-shaped conductive structures of the first set of linear-shaped conductive structures and an adjacent one of the linear-shaped conductive structures of the third set of linear-shaped conductive structures is outside a fabrication capability of a semiconductor fabrication process.
17. A semiconductor chip as recited in claim 16 , wherein a spacing between at least one of the linear-shaped conductive structures of the second set of linear-shaped conductive structures and an adjacent one of the linear-shaped conductive structures of the third set of linear-shaped conductive structures is outside a fabrication capability of a semiconductor fabrication process.
18. A semiconductor chip as recited in claim 12 , wherein the first set of linear-shaped conductive structures correspond to a first plurality of linear-shaped conductive structures, and
wherein the second set of linear-shaped conductive structures correspond to a second plurality of linear-shaped conductive structures, and
wherein the third set of linear-shaped conductive structures correspond to a third plurality of linear-shaped conductive structures, and
wherein the fixed pitch of the gate electrode level corresponds to a first pitch, and
wherein the semiconductor chip further comprises a first interconnect level including a fourth plurality of linear-shaped conductive structures defined to extend lengthwise in the first direction, the fourth plurality of linear-shaped conductive structures positioned in accordance with a second pitch such that a distance as measured in the second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the fourth plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the second pitch,
the first interconnect level including a fifth plurality of linear-shaped conductive structures defined to extend lengthwise in the first direction, the fifth plurality of linear-shaped conductive structures positioned in accordance with a third pitch such that a distance as measured in the second direction perpendicular to the first direction between first-direction-oriented-lengthwise-centerlines of any two of the fifth plurality of linear-shaped conductive structures is substantially equal to an integer multiple of the third pitch.
19. A semiconductor chip as recited in claim 18 , wherein at least one of the second and third pitches is equal to the first pitch.
20. A semiconductor chip as recited in claim 18 , wherein at least one of the second and third pitches is equal to the first pitch multiplied by a ratio of integers.
21. A semiconductor chip as recited in claim 12 , wherein each of the plurality of linear-shaped conductive structures has a total length as measured in the first direction along its first-direction-oriented-lengthwise-centerline, and wherein the total length of each linear-shaped conductive structure of the first set of linear-shaped conductive structures is equal.
22. A semiconductor chip as recited in claim 21 , wherein the second set of linear-shaped conductive structures includes linear-shaped conductive structures of different total length.
23. A semiconductor chip as recited in claim 22 , wherein the third set of linear-shaped conductive structures includes linear-shaped conductive structures of different total length.
24. A semiconductor chip as recited in claim 12 , wherein some linear-shaped conductive structures of the second set of linear-shaped conductive structures are co-aligned such that the distance as measured in the second direction perpendicular to the first direction between their first-direction-oriented-lengthwise-centerlines is equal to zero, and wherein adjacently positioned co-aligned linear-shaped conductive structures of the second set of linear-shaped conductive structures are separated from each other by a uniform end-to-end spacing as measured in the first direction.
25. A semiconductor chip as recited in claim 24 , wherein some linear-shaped conductive structures of the third set of linear-shaped conductive structures are co-aligned such that the distance as measured in the second direction perpendicular to the first direction between their first-direction-oriented-lengthwise-centerlines is equal to zero, and wherein adjacently positioned co-aligned linear-shaped conductive structures of the third set of linear-shaped conductive structures are separated from each other by the uniform end-to-end spacing as measured in the first direction.