Dual channel silicon/silicon germanium complementary metal oxide semiconductor performance with interface engineering

1. A method of forming fin structures comprising:

providing at least one silicon germanium containing fin structure;

forming a fin liner on said at least one silicon germanium containing fin structure by deposition using atomic layer deposition (ALD), wherein the fin liner includes a silicon germanium and oxygen containing layer; and

annealing said at least one silicon germanium containing fin structure having said fin liner present thereon, wherein said silicon germanium oxygen containing layer reacts with said silicon germanium containing fin structure to provide surface formation of a silicon rich layer on the silicon germanium containing fin structure.

2. The method of claim 1 , wherein said at least one silicon germanium containing fin structure is silicon germanium (SiGe).

3. The method of claim 1 , wherein forming the fin liner comprises forming said silicon germanium and oxygen containing layer on said at least one silicon germanium containing fin structure, and forming a nitride containing layer on said silicon germanium and oxygen containing layer.

4. The method of claim 3 , wherein said silicon germanium and oxygen containing layer of silicon germanium oxide (SiGeOx), and said nitride containing layer is silicon nitride.

5. The method of claim 4 , wherein the fin liner has a total thickness ranging from 1 nm to 10 nm.

6. The method of claim 1 , wherein the silicon rich layer comprises greater than 95 at. % silicon.

7. The method of claim 1 , wherein the silicon rich layer has a thickness ranging from 1 monolayer to 7 monolayers of silicon atoms.

8. The method of claim 1 , wherein when said silicon germanium oxygen containing layer reacts with said silicon germanium containing fin structure there is a desorption of germanium oxide.

9. The method of claim 1 , wherein the surface formation of the silicon rich layer on the silicon germanium containing fin structure substantially eliminated germanium pile on a surface of the silicon and germanium containing fin structure.

10. The method of claim 1 , wherein said annealing comprises a temperature ranging from 900° C. to 1100° C.

11. A method of forming a semiconductor device comprising:

providing at least one silicon germanium containing fin structure and at least one silicon containing fin structure;

forming a fin liner on each of said at least one silicon germanium containing fin structure and said at least one silicon containing fin structure, wherein the fin liner includes a silicon germanium and oxygen containing layer by deposition using atomic layer deposition (ALD);

annealing said at least one silicon germanium containing fin structure having said fin liner present thereon, wherein said silicon germanium oxygen containing layer reacts with said silicon germanium containing fin structure to provide surface formation of a silicon rich layer on the silicon germanium containing fin structure;

recessing a portion of the fin liner on said at least one silicon germanium containing fin structure and at least one silicon containing fin structure; and

forming a first conductivity field effect transistor with the at least one silicon germanium containing fin structure and a second conductivity field effect transistor with the at least one silicon germanium containing fin structure.

12. The method of claim 11 , wherein said providing at least one silicon germanium containing fin structure and the at least one silicon containing fin structure comprises:

providing a semiconductor substrate comprised of silicon;

epitaxially forming a silicon and germanium containing material layer on a first region of a semiconductor substrate, wherein a second region of the semiconductor substrate remains silicon;

patterning the silicon germanium containing material layer in the first region of the semiconductor substrate to provide the at least one silicon germanium containing fin structure; and

patterning the silicon in the second region of the semiconductor substrate to provide the at least one silicon containing fin structure.

13. The method of claim 11 , wherein said recessing the portion of the fin liner comprises:

forming a dielectric fill material between adjacent fin structures of said at least one silicon germanium containing fin structure and at least one silicon containing fin structure;

recessing the dielectric fill material to expose a reveal portion of the at least one silicon germanium containing fin structure and the at least one silicon containing fin structure; and

etching an exposed portion of said fin liner on said reveal portion of the at least one silicon germanium containing fin structure and the at least one silicon containing fin structure.

14. The method of claim 11 , wherein the first conductivity field effect transistor is a p-type FinFET including a first gate structure of a first gate dielectric stack on a channel portion of the silicon germanium containing fin structure, a p-type work function layer on the first gate dielectric stack and a first gate conductor on the p-type work function layer, and wherein the second conductivity field effect transistor is an n-type FinFET including a second gate structure of a second gate dielectric stack on a channel portion of the silicon containing fin structure, an n-type work function layer on the second gate dielectric stack and a second gate conductor on the n-type work function layer.

15. The method of claim 14 further comprising forming epitaxial p-type source and drain regions on opposing sides of the channel portion of the silicon germanium containing fin structure, and forming epitaxial n-type source and drain regions on the opposing sides of the channel portion of the silicon containing fin structure.