On-chip MIM capacitor
View Patent ↗A method for forming an on-chip capacitor with complementary metal oxide semiconductor (CMOS) devices includes forming a first capacitor electrode between gate structures in a capacitor region while forming contacts to source and drain (S/D) regions in a CMOS region. Gate structures are cut in the CMOS region and the capacitor region by etching a trench across the gate structures and filling the trench with a dielectric material. The gate structures and the dielectric material in the trench in the capacitor region are removed to form a position for an insulator and a second electrode. The insulator is deposited in the position. Gate metal is deposited to form gate conductors in the CMOS region and the second electrode in the capacitor region.
1. A method for forming an on-chip capacitor with complementary metal oxide semiconductor (CMOS) devices, comprising:
forming a first capacitor electrode between gate structures in a capacitor region while forming contacts to source and drain (S/D) regions in a CMOS region;
cutting gate structures in the CMOS region and the capacitor region by etching at least one trench across the gate structures and forming a dielectric material in the at least one trench; and
forming an insulator and a second electrode in the at least one trench in the capacitor region.
2. The method as recited in claim 1 , wherein the CMOS region includes fin field effect transistors.
3. The method as recited in claim 1 , wherein the gate structures include a dummy gate and spacers, and wherein gate metal is deposited to form gate conductors in the CMOS region by removing the dummy gate and replacing the dummy gate with the gate metal.
4. The method as recited in claim 1 , wherein cutting the gate structures in the CMOS region includes cutting the gate structures at longitudinal end portions and midspan.
5. The method as recited in claim 1 , further comprising removing the gate structures and the dielectric material in the at least one trench in the capacitor region to form a position for the insulator and the second electrode.
6. The method as recited in claim 5 , further comprising:
depositing the insulator in the position; and
depositing gate metal to form gate conductors in the CMOS region and the second electrode in the capacitor region.
7. The method as recited in claim 6 , wherein depositing the insulator in the position includes depositing a dielectric spacer and a gate dielectric layer, wherein the gate dielectric layer is employed in the CMOS regions in the gate structures.
8. The method as recited in claim 1 , further comprising masking the CMOS region to remove the gate structures and the dielectric material in the at least one trench.
9. The method as recited in claim 1 , further comprising forming dummy gates for the gate structures in the CMOS region and the capacitor region, concurrently.
10. The method as recited in claim 9 , further comprising forming sidewall spacers on the dummy gates for the gate structures in the CMOS region and the capacitor region, concurrently.
11. The method as recited in claim 1 , wherein the on-chip capacitor includes a metal-insulator-metal (MIM) capacitor.
12. A method for forming an on-chip capacitor with complementary metal oxide semiconductor (CMOS) devices, comprising:
forming a first capacitor electrode between gate structures in a capacitor region while forming contacts to source and drain (S/D) regions in a CMOS region;
etching at least one trench across the gate structures; and
forming an insulator and a second electrode in the at least one trench in the capacitor region.
13. The method as recited in claim 12 , wherein the CMOS region includes fin field effect transistors.
14. The method as recited in claim 12 , wherein the gate structures include a dummy gate and spacers, and wherein a gate metal is deposited to form gate conductors in the CMOS region by removing the dummy gate and replacing the dummy gate with the gate metal.
15. The method as recited in claim 12 , wherein etching at least one trench across the gate structures includes cutting the gate structures at longitudinal end portions and midspan.
16. The method as recited in claim 12 , further comprising removing the gate structures in the at least one trench in the capacitor region to form a position for the insulator and the second electrode.
17. The method as recited in claim 16 , further comprising:
depositing the insulator in the position; and
depositing gate metal to form gate conductors in the CMOS region and the second electrode in the capacitor region.
18. The method as recited in claim 17 , wherein depositing the insulator in the position includes depositing a dielectric spacer and a gate dielectric layer, wherein the gate dielectric layer is employed in the CMOS regions in the gate structures.
19. The method as recited in claim 12 , further comprising forming dummy gates for the gate structures in the CMOS region and the capacitor region, concurrently.
20. The method as recited in claim 12 , further comprising forming sidewall spacers on the dummy gates for the gate structures in the CMOS region and the capacitor region, concurrently.