MEMS mircophone with increased back volume
A micro-electro-mechanical system (MEMS) microphone assembly including an enclosure having a top side and a bottom side that define a first chamber having a first volume and an acoustic inlet port formed through one of the top side or the bottom side. The assembly further including a MEMS microphone mounted within the first chamber, the MEMS microphone defining a second chamber having a second volume and a diaphragm having a first side interfacing with the first chamber and a second side interfacing with the second chamber. The assembly also including an acoustically absorbent material within one of the first chamber or the second chamber, the acoustically absorbent material to cause a simulated acoustic enlargement of the first volume or the second volume, respectively.
1. A micro-electro-mechanical system (MEMS) microphone assembly comprising:
an enclosure having a top side and a bottom side that is opposite the top side, wherein the top side and the bottom side define a first chamber having a first volume, and an acoustic inlet port is formed through the bottom side;
a MEMS microphone mounted within the first chamber, the MEMS microphone defining a second chamber having a second volume and a diaphragm having a first side interfacing with the first chamber and a second side interfacing with the second chamber;
an application-specific integrated circuit (ASIC) mounted in the enclosure and electrically connected to the MEMS microphone by a wire; and
an acoustically and thermally absorbent material layer comprising zeolite, wherein the acoustically absorbent material layer is within the first chamber and on an inner surface of a portion of the top side that is opposite the acoustic inlet port, and wherein the acoustically and thermally absorbent material layer is formed over the ASIC and a portion of the wire.
2. The MEMS microphone assembly of claim 1 wherein the acoustic inlet port is acoustically coupled to the second side of the diaphragm.
3. The MEMS microphone assembly of claim 1 wherein the acoustically and thermally absorbent material layer is on an inner surface of a side wall that connects the top side to the bottom side and occupies less than an entire volume of the first volume of the first chamber.
4. The MEMS microphone assembly of claim 1 wherein the acoustically and thermally absorbent material layer is a coating of zeolite formed directly on the top side of the enclosure.
5. The MEMS microphone assembly of claim 1 wherein the acoustically and thermally absorbent material layer causes a simulated acoustic enlargement of the first volume or the second volume by a factor of at least 3.
6. A micro-electro-mechanical system (MEMS) microphone assembly comprising:
an enclosure having a top side and a bottom side, and an acoustic inlet port formed through the bottom side;
a MEMS microphone mounted within the enclosure, the MEMS microphone having a diaphragm that divides the enclosure into a front volume chamber open to the acoustic inlet port and a first side of the diaphragm, and a back volume chamber that is open to a second side of the diaphragm;
an application-specific integrated circuit (ASIC) mounted within the back volume chamber of the enclosure and electrically connected to the MEMS microphone by a wire; and
an acoustically and thermally absorbent surface coating formed within the back volume chamber, the acoustically and thermally absorbent surface coating is exposed to the second side of the diaphragm and formed over the ASIC and a portion of the wire, and wherein the acoustically and thermally absorbent surface coating causes a simulated acoustic enlargement of the back volume chamber and minimizes temperature changes within the enclosure.
7. The MEMS microphone assembly of claim 6 wherein the MEMS microphone is mounted to the bottom side of the enclosure, and the acoustic inlet port is formed through the bottom side.
8. The MEMS microphone assembly of claim 6 wherein the MEMS microphone is mounted to the bottom side of the enclosure, and the acoustic inlet port is formed through the top side.
9. The MEMS microphone assembly of claim 6 wherein the front volume chamber surrounds the back volume chamber.
10. The MEMS microphone assembly of claim 6 wherein the simulated acoustic enlargement of the back volume chamber simulates a volume that is at least three times an actual volume of the back volume chamber.
11. The MEMS microphone assembly of claim 6 wherein the acoustically absorbent surface coating comprises zeolite.
12. A method of manufacturing a micro-electro-mechanical system (MEMS) microphone module, the method comprising:
providing a MEMS microphone enclosure having a top side and a bottom side that is opposite the top side, wherein the top side and the bottom side define a first chamber having a first volume, and an acoustic inlet port is formed through the bottom side, a MEMS microphone mounted within the first chamber, the MEMS microphone defining a second chamber having a second volume and a diaphragm having a first side interfacing with the first chamber and a second side interfacing with the second chamber, and an application-specific integrated circuit (ASIC) mounted in the MEMS microphone enclosure and electrically connected to the MEMS microphone by a wire; and
forming a surface coating within the first chamber and on an inner surface of a portion of the top side that is opposite the acoustic inlet port, the ASIC and a portion of the wire, wherein the surface coating is an acoustically and thermally absorbent material comprising zeolite, and the surface coating is exposed to the first side of the diaphragm and simulates an acoustic enlargement of the first chamber.
13. The method of claim 12 wherein the surface coating is formed using a screen printing process.
14. The method of claim 12 wherein the surface coating is formed using a freeze drying surface deposition process.