Method of manufacturing a signal transition component having a C-shaped conducting frame
The present invention relates to a microwave signal transition component ( 1 ) having a first signal conductor side ( 2 ) and a second signal conductor side ( 3 ). The signal transition component ( 1 ) is arranged for transfer of microwave signals from the first signal conductor side ( 2 ) to the second signal conductor side ( 3 ). The transfer component ( 1 ) comprises at least one, at least partly circumferentially running, electrically conducting frame ( 4 ), a dielectric filling ( 5 ) positioned at least partly within said conducting frame ( 4 ), at least one filling aperture ( 6; 6 a, 6 b ) miming through the dielectric filling, and, for each filling aperture ( 6; 6 a, 6 b ), an electrically conducting connection ( 7; 7 a, 7 b ) that at least partly is positioned within said filling aperture ( 6; 6 a, 6 b ). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.
1. A method of manufacturing a signal transition component, comprising:
providing an electrically conducting plate having a thickness between a first signal conductor side and a second signal conductor side;
machining a plate aperture in the electrically conducting plate so as to form a first at least partly circumferentially extending electrically conducting frame;
filling the plate aperture with a dielectric material;
machining a first filling aperture in the dielectric material;
plating the first filling aperture with an electrically conducting plating that at least partly covers the inner surface of the first filling aperture;
wherein the transition component comprises a single conducting frame which is the first conducting frame;
wherein the first conducting frame has a C-shape.
2. The method of claim 1 , wherein the electrically conducting plating covers a part of the dielectric filling on the first signal conductor side and/or the second signal conductor side.
3. The method of claim 1 , further comprising:
machining a second filling aperture in the dielectric material;
plating the second filling aperture with an electrically conducting plating that at least partly covers the inner surface of the second filling aperture.
4. The method of claim 1 , wherein the electrically conducting plating solidly occupies all of the first filling aperture.