Structure for radio-frequency applications
A structure for radiofrequency applications includes: a support substrate of high-resistivity silicon comprising a lower part and an upper part having undergone a p-type doping to a depth D; a mesoporous trapping layer of silicon formed in the doped upper part of the support substrate. The depth D is less than 1 micron and the trapping layer has a porosity rate of between 20% and 60%.
1. A structure for radiofrequency applications comprising:
a support substrate of high-resistivity silicon comprising a non-doped lower part and a p-type doped upper part, the p-typed doped upper part formed to a depth D of less than 1 micro in the support substrate; and
a mesoporous trapping layer of silicon formed in the p-type doped upper part of the support substrate, the mesoporous trapping layer having a porosity rate of between 20% and 60% such that the mesoporous trapping layer traps inversion charges susceptible to be generated in the non-doped lower part and the non-doped lower part retains a high and stable resistivity level.
2. The structure of claim 1 , wherein the mesoporous trapping layer has pores with a diameter of between 2 nm and 50 nm.
3. The structure of claim 2 , wherein the resistivity of the non-doped lower part of the support substrate is greater than 1000 ohm·cm.
4. The structure of claim 1 , wherein an active layer is disposed over the mesoporous trapping layer.
5. The structure of claim 4 , wherein the active layer compromises a semiconductive material.
6. The structure of claim 4 , wherein the active layer compromises a piezoelectric material.
7. The structure of claim 4 , wherein the active layer comprises at least one material selected from the group consisting of: silicon, silicon carbide, silicon germanium, lithium niobate, lithium tantalate, quartz, and aluminum nitride.
8. The structure of claim 4 , wherein the thickness of the active layer is between 10 nm and 50 μm.
9. The structure of claim 4 , wherein a dielectric layer is disposed between the mesoporous trapping layer and the active layer.
10. The structure of claim 9 , wherein the dielectric layer comprises at least one material selected from the group consisting of: silicon dioxide, silicon nitride, and aluminum oxide.
11. The structure of claim 10 , wherein the dielectric layer is between 10 nm and 6 μm.
12. The structure of claim 4 , wherein at least one microelectronic device is present on or in the active layer, the microelectronic device being a switching circuit or an antenna tuning circuit or a radiofrequency power amplification circuit.
13. The structure of claim 4 , wherein at least one microelectronic device is present on or in the active layer, the microelectronic device comprising a plurality of active components and a plurality of passive components.
14. The structure of claim 4 , wherein at least one microelectronic device is present on or in the active layer, the microelectronic device comprising at least one control element and one MEMS switching element comprising a microswitch with ohmic contact or a capacitive microswitch.
15. The structure of claim 4 , wherein at least one microelectronic device is present on or in the active layer, the microelectronic device comprising a radiofrequency filter operating by bulk or surface acoustic wave propagation.
16. The structure of claim 1 , wherein the resistivity of the non-doped lower part of the support substrate is greater than 1000 ohm·cm.
17. The structure of claim 1 , wherein an active layer is arranged on the mesoporous trapping layer.
18. The structure of claim 9 , wherein the dielectric layer is between 10 nm and 6 μm.