IP Library Granted Patent US 10,128,025
Granted Patent B2
US 10,128,025 · App. 15/501,248 · Granted Nov 13, 2018

Oxide superconducting wire, superconducting device, and method for producing oxide superconducting wire

Inventor: Chihaya Kurihara (Sakura, JP)
Assignee: FUJIKURA LTD.
H01B12/06H01B12/02H01B13/0026H01B13/22H01F2006/001
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Quick Facts
Patent No.
US 10,128,025
App. No.
15/501,248
Granted
Nov 13, 2018
Kind
B2
Abstract

An oxide superconducting wire includes: a laminate which is formed by laminating a tape-shaped base, an intermediate layer, and an oxide superconducting layer; a first protective layer which is formed of Ag or an Ag alloy and is laminated on a main surface of the oxide superconducting layer of the laminate; a second protective layer which is formed of Cu or a Cu alloy, is laminated on a main surface of the first protective layer by performing film formation one or more times, and has a thickness of 0.3 μm to 10 μm; and a stabilization layer which is bonded to a main surface of the second protective layer with a solder layer interposed therebetween, wherein the second protective layer is formed to have a thickness of equal to or less than 2.1 μm per film formation.

Claims (26)

1. An oxide superconducting wire comprising:

a laminate which is formed by laminating a tape-shaped base, an intermediate layer, and an oxide superconducting layer;

a first protective layer which is formed of Ag or an Ag alloy and is laminated on a main surface of the oxide superconducting layer of the laminate;

a second protective layer which is formed of Cu or a Cu alloy, is laminated on a main surface of the first protective layer by performing film formation one or more times, and has a thickness of 0.3 μm to 10 μm, the second protective layer being formed of a plurality of laminated layers where each of the laminated layers has a thickness of equal to or less than 2.1 μm; and

a stabilization layer which is bonded to a main surface of the second protective layer with a solder layer interposed therebetween,

wherein the second protective layer is formed to have a thickness of equal to or less than 2.1 μm per film formation in each of the laminated layers.

2. The oxide superconducting wire according to claim 1 ,

wherein the oxide superconducting layer is formed to include a neutral surface in a thickness direction of an entire of the oxide superconducting wire.

3. The oxide superconducting wire according to claim 1 , further comprising:

a rear surface layer which is laminated on a rear surface of the base of the laminate and is formed of Cu or a Cu alloy,

wherein the stabilization layer is arranged to wrap around both side surfaces from a main surface of the laminate and to reach a rear surface, and is bonded to the rear surface layer with a solder layer interposed therebetween.

4. The oxide superconducting wire according to claim 1 ,

wherein the stabilization layer is formed of one of a group consisting of a Ni—Cr alloy, a Ni alloy, stainless steel, and brass.

5. The oxide superconducting wire according to claim 1 ,

wherein the second protective layer has a thickness of equal to or less than 2.1 μm.

6. A superconducting device comprising:

the oxide superconducting wire according to claim 1 .

7. A method of producing an oxide superconducting wire, the method comprising:

preparing a laminate in which an intermediate layer and an oxide superconducting layer are formed on a tape-shaped base;

forming a first protective layer formed of Ag or an Ag alloy on a main surface of the oxide superconducting layer of the laminate using a sputtering method;

forming a second protective layer formed of Cu or a Cu alloy to have a thickness of 0.3 μm to 2.1 μm on a main surface of the first protective layer using a sputtering method; and

forming a stabilization layer by bonding a metal tape to a main surface of the second protective layer with a solder layer interposed therebetween,

wherein, when forming the second protective layer, film formation is performed one or more times, and the second protective layer is formed to have a thickness of equal to or less than 2.1 μm per film formation, such that the second protective layer is formed of a plurality of laminated layers where each of the laminated layers has a thickness of equal to or less than 2.1 μm.

8. The method of producing an oxide superconducting wire according to claim 7 ,

wherein, before forming the stabilization layer, a rear surface layer formed of Cu or a Cu alloy is formed on a rear surface of the base of the laminate using a sputtering method, and

when forming the stabilization layer, the metal tape is arranged to wrap around the rear surface by way of both side surfaces from a main surface of the laminate, and the metal tape is bonded to the rear surface layer with a solder layer interposed therebetween.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2017
From: KURIHARA, CHIHAYA
To: FUJIKURA LTD.
Reel/Frame 041582/0456 →
Priority Claims (1)
JP 2014-159685 · Aug 5, 2014 · national
Continuity (1)
Related Publication 20170221609A1 · Aug 3, 2017
Cited By (1)
US 12,412,681