Solid state image sensor and electronic device
The present disclosure relates to a solid-state imaging device and an electronic device that are configured to suppress the occurrence of noise and white blemishes in an amplification transistor having an element separation region which is formed by ion implantation. An amplification transistor has an element separation region formed by ion implantation. A channel region insulating film which is at least a part of a gate insulating film above a channel region of the amplification transistor is thin compared to a gate insulating film of a selection transistor, and an element separation region insulating film which is at least a part of a gate insulating film above the element separation region of the amplification transistor is thick compared to the channel region insulating film. The present disclosure can be applied to, for example, a CMOS image sensor, etc.
1. A solid-state imaging device comprising:
an amplification transistor having an element separation region formed by ion implantation, wherein a channel region insulating film of the amplification transistor is thin as compared to a gate insulating film of the amplification transistor, an element separation region insulating film of the amplification transistor is thick as compared to the channel region insulating film of the amplification transistor, the channel region insulating film of the amplification transistor being at least a part of the gate insulating film of the amplification transistor above a channel region of the amplification transistor, and the element separation region insulating film being at least a part of the gate insulating film of the amplification transistor above the element separation region of the amplification transistor; and
a transistor,
wherein a gate insulating film of the transistor is thick as compared to the gate insulating film of the amplification transistor, and
wherein the amplification transistor and the transistor share one source/drain region.
2. The solid-state imaging device according to claim 1 , wherein an element separation region insulating film and the gate insulating film of the transistor have a same film thickness.
3. The solid-state imaging device according to claim 1 , wherein an element separation region insulating film and the gate insulating film of the transistor are of a same type.
4. The solid-state imaging device according to claim 1 , wherein a width in a W direction of the channel region insulating film is narrow as compared to a channel width of the amplification transistor.
5. The solid-state imaging device according to claim 1 , wherein a width in a W direction of the channel region insulating film is wide compared to a channel width of the amplification transistor, and is narrow as compared to a gate width of the amplification transistor.
6. The solid-state imaging device according to claim 1 , wherein a part of the element separation region is formed of an insulating film.
7. The solid-state imaging device according to claim 1 , wherein the element separation region insulating film is formed by thermal oxidation.
8. The solid-state imaging device according to claim 1 , wherein the amplification transistor is a depression type transistor.
9. The solid-state imaging device according to claim 1 , further comprising a selection transistor, a reset transistor, and a transfer transistor, each of the selection transistor, the reset transistor, and the transfer transistor having an element separation region formed by ion implantation,
wherein a channel region insulating film of the transistor is thin as compared to the gate insulating film of the transistor, and an element separation region insulating film of the transistor is thick as compared to the channel region insulating film of the transistor.
10. An electronic device comprising:
an amplification transistor having an element separation region formed by ion implantation, wherein a channel region insulating film of the amplification transistor is thin as compared to a gate insulating film of the amplification transistor, an element separation region insulating film of the amplification transistor is thick as compared to the channel region insulating film of the amplification transistor, the channel region insulating film of the amplification transistor being at least a part of the gate insulating film of the amplification transistor above a channel region of the amplification transistor, and the element separation region insulating film being at least a part of the gate insulating film of the amplification transistor above the element separation region of the amplification transistor; and
a transistor,
wherein a gate insulating film of the transistor is thick as compared to the gate insulating film of the amplification transistor, and
wherein the amplification transistor and the transistor share one source/drain region.