Fabrication of crystalline magnetic films for PSTTM applications
A method including forming a device stack including a dielectric layer between a fixed magnetic layer and a free magnetic layer on a fully-crystalline sacrificial film or substrate including a crystal lattice similar to the crystal lattice of the dielectric material; and transferring the device stack from the sacrificial film to a device substrate. An apparatus including a device stack including a dielectric layer between a fixed magnetic layer and a free magnetic layer on a device substrate wherein the fixed magnetic layer and the free magnetic layer each have a crystalline lattice conforming to a crystalline lattice of the sacrificial film or substrate on which they were formed prior to transfer to the device substrate.
1. A method comprising:
forming a device stack including a dielectric layer between a fixed magnetic layer and a free magnetic layer on a fully-crystalline sacrificial film or substrate comprising a crystal lattice conforming to the crystal lattice of the dielectric layer, wherein forming the device stack comprises forming an electrode of an electrically conductive material on the fully-crystalline sacrificial film or substrate, and forming one of the fixed magnetic layer and the free magnetic layer on the electrode; and
transferring the device stack from the sacrificial film to a device substrate.
2. The method of claim 1 , wherein forming the device stack comprises forming a synthetic antiferromagnet between the electrode and the one of the fixed magnetic layer and the free magnetic layer.
3. The method of claim 1 , wherein the electrically conductive material of the electrode has a crystal lattice conforming to the crystal lattice of the sacrificial film or substrate.
4. The method of claim 1 , wherein the device stack comprises a spin transfer torque memory stack.
5. The method of claim 4 , wherein the dielectric layer and the fully crystalline sacrificial film or substrate each comprises magnesium oxide (MgO).
6. The method of claim 4 , wherein the device stack is formed on a fully-crystalline sacrificial film on a substrate of a material different than a material of the film.
7. The method of claim 4 , wherein the device stack is formed on a fully-crystalline sacrificial substrate.
8. The method of claim 4 , wherein the device stack comprises a multi-ferroic device stack.
9. A method comprising:
forming a spin transfer torque memory stack on a fully-crystalline sacrificial film or substrate, the spin transfer torque memory stack comprising a dielectric layer between a fixed magnetic layer and a free magnetic layer wherein the fixed magnetic layer and the free magnetic layer each have a crystalline lattice conforming to the crystalline lattice of the fully-crystalline sacrificial film or substrate, wherein forming the spin transfer torque memory stack comprises forming an electrode of an electrically conductive material on the fully-crystalline sacrificial film or substrate, and forming one of the fixed magnetic layer and the free magnetic layer on the electrode; and
transferring the memory stack from the sacrificial film to a device substrate.
10. The method of claim 9 , wherein forming the device stack comprises forming a synthetic antiferromagnet between the electrode and the one of the fixed magnetic layer and the free magnetic layer.
11. The method of claim 9 , wherein the electrically conductive material of the electrode has a crystal lattice similar to the crystal lattice of the sacrificial film or substrate.
12. The method of claim 9 , wherein the dielectric layer and the fully crystalline sacrificial film or substrate each comprises magnesium oxide (MgO).
13. The method of claim 12 , wherein the device stack is formed on a fully-crystalline sacrificial film on a substrate of a material different than a material of the film.
14. The method of claim 12 , wherein the device stack is formed on a fully-crystalline sacrificial substrate.
15. An apparatus comprising:
a device stack including a dielectric layer between a fixed magnetic layer and a free magnetic layer on a device substrate, wherein the device stack further comprises an electrode of an electrically conductive material connected to the device substrate through a glue layer, wherein one of the fixed magnetic layer and the free magnetic layer is formed on the electrode, and wherein the fixed magnetic layer, the free magnetic layer, and the electrically conductive material each have a same crystalline lattice.
16. The apparatus of claim 15 , wherein the device stack comprises a spin transfer torque memory stack.
17. The apparatus of claim 16 , wherein the dielectric layer comprises magnesium oxide (MgO).
18. The apparatus of claim 17 , wherein the fixed magnetic layer and the free magnetic layer each comprise CoFeB.