Amorphous seed layer for improved stability in perpendicular STTM stack
A material layer stack for a magnetic tunneling junction, the material layer stack including a fixed magnetic layer; a dielectric layer; a free magnetic layer; and an amorphous electrically-conductive seed layer, wherein the fixed magnetic layer is disposed between the dielectric layer and the seed layer. A non-volatile memory device including a material stack including an amorphous electrically-conductive seed layer; and a fixed magnetic layer juxtaposed and in contact with the seed layer. A method including forming an amorphous seed layer on a first electrode of a memory device; forming a material layer stack on the amorphous seed layer, the material stack including a dielectric layer disposed between a fixed magnetic layer and a free magnetic layer, wherein the fixed magnetic layer.
1. A material layer stack for a magnetic tunneling junction, the material layer stack comprising:
a fixed magnetic layer;
a dielectric layer;
a free magnetic layer;
an amorphous electrically-conductive seed layer, wherein the dielectric layer is disposed between the fixed magnetic layer and the free magnetic layer and the fixed magnetic layer is disposed between the dielectric layer and the seed layer, and wherein the fixed magnetic layer is in direct contact with the dielectric layer and is in direct contact with the seed layer; and
a synthetic antiferromagnet (SAF) layer, wherein the amorphous electrically-conductive seed layer is on and in direct contact with the SAF layer, and wherein the SAF layer is separate and distinct from the amorphous electrically-conductive seed layer.
2. The material layer stack of claim 1 , wherein the fixed magnetic layer comprises cobalt-iron-boron (CoFeB).
3. The material layer stack of claim 1 , wherein the stack has perpendicular magnetic anisotropy.
4. The material layer stack of claim 3 , wherein the fixed magnetic layer comprises CoFeB and a thickness of less than 2 nanometers.
5. The material layer stack of claim 1 , wherein the seed layer comprises a first material and a second material.
6. The material layer stack of claim 5 , wherein the first material comprises CoFeB and the second material comprises tantalum disposed between the first material and fixed magnetic layer.
7. The material layer stack of claim 1 , wherein the seed layer comprises carbon.
8. The material layer stack of claim 1 , wherein the seed layer comprises a metal glass material.
9. A non-volatile memory device comprising:
a material stack comprising:
an amorphous electrically-conductive seed layer;
a fixed magnetic layer juxtaposed and in direct contact with the seed layer;
a dielectric layer disposed between the fixed magnetic layer and a free magnetic layer, the dielectric layer in direct contact with the fixed magnetic layer;
a synthetic antiferromagnet (SAF) layer, wherein the amorphous electrically-conductive seed layer is on and in direct contact with the SAF layer, and wherein the SAF layer is separate and distinct from the amorphous electrically-conductive seed layer;
a first electrode disposed on a first side of the material stack;
a second electrode disposed on a second side of the material stack; and
a transistor device coupled to one of the top electrode or the bottom electrode.
10. The memory device of claim 9 , wherein the fixed magnetic layer comprises cobalt-iron-boron (CoFeB).
11. The memory device of claim 10 , wherein the stack has perpendicular magnetic anisotropy.
12. The memory device of claim 11 , wherein the fixed magnetic layer comprises a thickness less than 2 nanometers.
13. The memory device of claim 9 , wherein the seed layer comprises a first material and a second material.
14. The memory device of claim 13 , wherein the first material comprises CoFeB and the second material comprises tantalum disposed between the first material and fixed magnetic layer.
15. The memory device of claim 9 , wherein the seed layer comprises carbon or a metal glass material.
16. The memory device of claim 9 , wherein the second side of the material stack is opposite the first side.
17. A method comprising:
forming an amorphous seed layer on and in direct contact with a synthetic antiferromagnet (SAF) layer on a first electrode of a memory device, wherein the SAF layer is separate and distinct from the amorphous electrically-conductive seed layer;
forming a material layer stack on the amorphous seed layer, the material stack comprising a dielectric layer disposed between a fixed magnetic layer and a free magnetic layer, the dielectric layer in direct contact with the fixed magnetic layer, wherein the fixed magnetic layer is juxtaposed and in direct contact with the seed layer; and
forming a second electrode on the material stack.
18. The method of claim 17 , wherein the stack has perpendicular magnetic anisotropy.
19. The method of claim 18 , wherein forming the material stack comprises forming the fixed magnetic layer to a thickness less than 2 nanometers.
20. The method of claim 19 , wherein the fixed magnetic layer comprises cobalt-iron-boron (CoFeB).