IP Library Granted Patent US 10,155,889
Granted Patent B2
US 10,155,889 · App. 15/505,493 · Granted Dec 18, 2018

Hot melt adhesive composition including a block composite compatibilizer

Inventors: Yi Jin (Missouri City, TX); Kim L. Walton (Lake Jackson, TX); Gary R. Marchand (Gonzales, LA); Selim Yalvac (Pearland, TX); Allan Walter Mclennaghan (Lachen, CH); Burcak Conley (Zurich, CH); Dean Lee (Midland, MI); Rongjuan Cong (Lake Jackson, TX); Colin Li Pi Shan (Pearland, TX)
Assignee: Dow Global Technologies LLC
C09J153/00C08L23/06C08L91/06C09J7/35C08L23/14C08L23/142C08L53/00C08L2201/00C09J123/142C09J123/20C09J2453/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,155,889
App. No.
15/505,493
Granted
Dec 18, 2018
Kind
B2
Abstract

A hot melt adhesive (HMA) composition includes (A) from 1-60 wt % of a block composite compatibilizer comprising (i) a hard polymer that includes propylene, (ii) a soft polymer that includes ethylene, and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer; (B) from 1-70 wt % of a tackifier; (C) from 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) Optionally, from greater than zero to 97 wt % of a polymer component that includes an ethylene-based polymer and/or a propylene-based polymer.

Claims (40)

1. A hot melt adhesive composition, comprising:

(A) 1-60 wt % of a block composite compatibilizer comprising:

(i) a hard polymer that includes propylene;

(ii) a soft polymer that includes ethylene; and

(iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer;

(B) 1-70 wt % of a tackifier;

(C) 1-40 wt % of at least one selected from the group of a wax and an oil; and

(D) from greater than zero to 97 wt % of a polymer component that includes an ethylene-based polymer having a density from 0.86 g/cc to 0.885 g/cc, a melt index (I 2 ) from 5 g/10 min to 3,000 g/10 min, and a Brookfield viscosity of less than 50,000 centipoise (cP).

2. The hot melt adhesive composition as claimed in claim 1 , wherein the soft block of the block copolymer includes from 50 wt % to 84 wt % of units derived from ethylene with a remainder derived from propylene.

3. The hot melt adhesive composition as claimed in claim 2 , wherein the hard block of the block copolymer includes from 0 wt % to 20 wt % of units derived from ethylene and a remainder derived from propylene.

4. The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatibilizer has a microstructure index of greater than 1 to less than 20.

5. The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatibilizer has a block composite index of greater than 0 and less than 1.0.

6. The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatabilizer has a modified block composite index of greater than 0 and less than 1.0.

7. The hot melt adhesive composition as claimed in claim 1 , further comprising from 1-5 wt % of an antioxidant.

8. The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatabilizer has a melt index (I 2 ) from 300 g/10 min to 700 g/10 min.

9. The hot melt adhesive composition as claimed in claim 1 , further comprising a propylene based polymer and an ethylene based wax.

10. The hot melt adhesive composition as claimed in claim 1 , wherein the composition has a peel adhesion failure temperature of from 50° C. to 70° C.

11. The holt melt adhesive composition as claimed in claim 1 , wherein the composition has a fiber tear greater than 60% at a temperature of from −40° C. to 60° C.

12. The hot melt adhesive composition as claimed in claim 1 , wherein the composition has a set time of less than or equal to 3 seconds.

13. A hot melt adhesive composition, comprising:

(A) 1-60 wt % of a block composite compatibilizer comprising:

(i) a hard polymer that includes propylene;

(ii) a soft polymer that includes ethylene; and

(iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer;

(B) 1-70 wt % of a tackifier;

(C) 1-40 wt % of at least one selected from the group of a wax and an oil; and

(D) from greater than zero to 97 wt % of a polymer component that includes a propylene-based polymer having a density from 0.85 g/cc to 0.90 g/cc and a Brookfield viscosity of less than 50,000 cP.

14. A hot melt adhesive composition, comprising:

(A) 1-60 wt % of a block composite compatibilizer comprising:

(i) a hard polymer that includes propylene;

(ii) a soft polymer that includes ethylene; and

(iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer;

(B) 1-70 wt % of a tackifier;

(C) 1-40 wt % of at least one selected from the group of a wax and an oil; and

(D) from greater than zero to 97 wt % of a polymer component that includes:

an ethylene-based polymer having a density from 0.86 g/cc to 0.885 g/cc, a melt index (I 2 ) from 5 g/10 min to 3,000 g/10 min, and a Brookfield viscosity of less than 50,000 centipoise (cP), and

a propylene-based polymer having a density from 0.85 g/cc to 0.90 g/cc and a Brookfield viscosity of less than 50,000 cP.

15. An article comprising:

a substrate; and

a hot melt adhesive composition as claimed in claim 1 on at least one surface of the substrate.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2018
From: JIN, YI; WALTON, KIM L.; MARCHAND, GARY R.; YALVAC, SELIM; LEE, DEAN; CONG, RONGJUAN; SHAN, COLIN LI PI
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 046750/0013 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2018
From: MCLENNAGHAN, ALLAN WALTER; CONLEY, BURCAK
To: DOW EUROPE GMBH
Reel/Frame 046750/0114 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2018
From: DOW EUROPE GMBH
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 046750/0180 →
Continuity (2)
Provisional Application 62039956 · Aug 21, 2014
Related Publication 20170240784A1 · Aug 24, 2017