Composition for heat-dissipation members, heat-dissipation member, electronic device, and method of producing heat dissipating member

1. A composition for a heat dissipating member comprising:

a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; and

a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent;

wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.

2. A composition for a heat dissipating member comprising:

a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; and

a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent;

wherein the coupling agent bonded to the first inorganic filler and the coupling agent bonded to the second inorganic filler each have a functional group for bonding coupling agents, and

wherein the other end of the coupling agent bonded to the first inorganic filler and the other end of the coupling agent bonded to the second inorganic filler are to be bonded during curing.

3. The composition for a heat dissipating member according to claim 1 ,

wherein the first inorganic filler and the second inorganic filler are a nitride or carbon material.

4. The composition for a heat dissipating member according to claim 3 ,

wherein the first inorganic filler and the second inorganic filler are at least one selected from boron nitride, boron carbide, boron nitride carbon, graphite, a carbon fiber, and a carbon nanotube.

5. The composition for a heat dissipating member according to claim 1 , further comprising

a third inorganic filler that has a different thermal expansion coefficient from those of the first inorganic filler and the second inorganic filler, wherein the third inorganic filler has thermal conductivity and is bonded to one end of a coupling agent, or the third inorganic filler has thermal conductivity and is bonded to one end of the coupling agent to which the polymerizable compound is bonded.

6. The composition for a heat dissipating member according to claim 1 , further comprising

an organic compound or a polymer compound that is not bonded to the first inorganic filler and the second inorganic filler.

7. The composition for a heat dissipating member according to claim 1 ,

wherein the bifunctional or higher polymerizable compound is a polymerizable compound having a structure containing an oxiranyl group or an oxetanyl group at both ends.

8. The composition for a heat dissipating member according to claim 7 ,

wherein the bifunctional or higher polymerizable compound is at least one polymerizable liquid crystal compound represented by the following Formula (1-1).

R a1 —Z-(A-Z) m1 —R a1   (1-1)

[in Formula (1-1),

R a1 is a polymerizable group represented by any one of the following Formulae (2-1) and (2-2);

A is 1,4-cyclohexylene, 1,4-cyclohexenylene, 1,4-phenylene, naphthalene-2,6-diyl, tetrahydronaphthalene-2,6-diyl, fluorene-2,7-diyl, bicyclo[2.2.2]oct-1,4-diyl, or bicyclo[3.1.0]hex-3,6-diyl,

in the rings, any —CH 2 — may be replaced with —O—, any —CH═ may be replaced with —N═, and any hydrogen may be replaced with a halogen, an alkyl group having 1 to 10 carbon atoms, or an alkyl halide having 1 to 10 carbon atoms,

in the alkyl, any —CH 2 — may be replaced with —O—, —CO—, —COO—, —OCO—, —CH═CH—, or —C═C—;

Z independently represents a single bond or an alkylene group having 1 to 20 carbon atoms,

in the alkylene, any —CH 2 — may be replaced with —O—, —S—, —CO—, —COO—, —OCO—, —CH═CH—, —CF═CF—, —CH═N—, —N═CH—, —N═N—, —N(O)═N—, or and any hydrogen may be replaced with a halogen; and

m1 is an integer of 1 to 6]

[Chem. 1]

[in Formulae (2-1) and (2-2), R b is hydrogen, a halogen, —CF 3 , or an alkyl group having 1 to 5 carbon atoms, and q is 0 or 1 .

9. The composition for a heat dissipating member according to claim 8 ,

wherein, in Formula (1-1), A represents 1,4-cyclohexylene, 1,4-cyclohexylene in which any hydrogen is replaced with a halogen, 1,4-phenylene, 1,4-phenylene in which any hydrogen is replaced with a halogen or a methyl group, fluorene-2,7-diyl, or fluorene-2,7-diyl in which any hydrogen is replaced with a halogen or a methyl group.

10. The composition for a heat dissipating member according to claim 8 ,

wherein, in Formula (1-1), Z represents a single bond, —(CH 2 ) a —, —O(CH 2 ) a —, —(CH 2 ) a O—, —O(CH 2 ) a O—, —CH═CH—, —COO—, —OCO—, —CH═CH—COO—, —OCO—CH═CH—, —CH 2 CH 2 —COO—, —OCO—CH 2 CH 2 —, —CH═N—, —N═CH—, —OCF 2 — or —CF 2 O—, and a is an integer of 1 to 20.

11. A heat dissipating member obtained by curing the composition for a heat dissipating member according to claim 1 .

12. An electronic apparatus comprising:

the heat dissipating member according to claim 11 ; and

an electronic device having a heating unit, and

wherein the heat dissipating member is disposed in the electronic device in contact with the heating unit.

13. A method of producing a heat dissipating member comprising:

a process in which a first inorganic filler having thermal conductivity is bonded to one end of a coupling agent;

a process in which a second inorganic filler having thermal conductivity is bonded to one end of a coupling agent;

a process in which the other end of the coupling agent bonded to the second inorganic filler is bonded to a bifunctional or higher polymerizable compound; and

a process in which the other end of the coupling agent bonded to the first inorganic filler is bonded to the bifunctional or higher polymerizable compound on the second inorganic filler.

14. A method of producing a heat dissipating member comprising:

a process in which a first inorganic filler having thermal conductivity is bonded to one end of a coupling agent;

a process in which a second inorganic filler having thermal conductivity is bonded to one end of a coupling agent; and

a process in which the other end of the coupling agent bonded to the first inorganic filler is bonded to the other end of the coupling agent bonded to the second inorganic filler.