Organopolysiloxane composition, preparation method therefor, and semiconductor component
The disclosed embodiments include an organopolysiloxane composition, a preparation method therefor, and a semiconductor component. The shore hardness of the cured product thereof is greater than A30 and less than A65. The composition comprises: (A1) solid 3D organopolysiloxane having an R 1 3 SiO 1/2 unit and an SiO 4/2 unit; (A2) liquid straight-chain organopolysiloxane having an R 1 3 SiO 1/2 unit and an R 2 2 SiO 2/2 unit; the mixing viscosity of component (A1) and (A2) is between 6,000 and 20,000 mPa·s; (B) liquid straight-chain polyorganohydrosiloxane having an R 3 3 SiO 1/2 unit and an R 4 2 SiO 2/2 unit; (C) an organosiloxane tackifier in which one molecule has on average at least one epoxy group; (D) a hydrosilylation catalyst of a volume enough to promote the curing of the composition. The composition of the present invention and the cured semiconductor component thereof have good heat resistance, good adhesiveness with aluminum having a mirror finish and ceramic substrate, and good resistance to humidity.
1. A organopolysiloxane composition, wherein, in its cured state, a cured product thereof has a shore hardness greater than A30 and less than A65, and the composition comprises:
(A1) solid three-dimensional structured organopolysiloxane comprising an R 1 3 SiO 1/2 unit and a SiO 4/2 unit, wherein R 1 is selected from similar or different alkenyl groups, univalent substituted or unsubstituted hydrocarbyls which do not contain any aromatic hydrocarbon and aliphatic unsaturated bond; wherein the number-average molecular weight of organopolysiloxane is 2500-3500;
(A2) liquid straight-chain organopolysiloxane comprising an R 1 3 SiO 1/2 unit and an R 2 2 SiO 2/2 unit, wherein R 1 and R 2 are selected from similar or different alkenyl groups, univalent substituted or unsubstituted hydrocarbyls which do not contain any aromatic hydrocarbon and aliphatic unsaturated bond; wherein component (A1) and (A2) have a mixing viscosity of 6000 to 20000 mPa·s;
(B) liquid straight-chain polyorganohydrosiloxane comprising an R 3 3 SiO 1/2 unit and an R 4 2 SiO 2/2 unit, wherein R 3 and R 4 are selected from similar or different, univalent substituted or unsubstituted hydrocarbyls and hydrogen atoms, which do not contain any aromatic hydrocarbon and aliphatic unsaturated bond; wherein the molar ratio of silicon-bonded hydrogen atoms in the component (B) to the alkenyl groups in the component (A1) and (A2) is 1.1-2.0;
(C) an organosiloxane tackifier in which one molecule has on average at least one epoxy group;
(D) a hydrosilylation catalyst of a volume enough to promote the curing of the composition.
2. The organopolysiloxane composition according to claim 1 , wherein, the viscosity of component (A2) is 5000 to 22000 mPa·s, and the content of the alkenyl groups is 0.0001-0.01.
3. The organopolysiloxane composition according to claim 1 , wherein, the sum of the weight of the component (A1) and (A2) represents 70 wt %-95 wt % of the total weight of the composition, the component (B) represents 5 wt %-30 wt % of the total weight of the composition, and component (C) represents 0.01 wt %-10 wt % of the total weight of the composition.
4. The organopolysiloxane composition according to claim 1 , wherein, the component (A1) and (A2) have a mixing viscosity of 6000 to 18000 mPa·s.
5. The organopolysiloxane composition according to claim 1 , wherein, the weight ratio of the component (A1) to the component (A2) ranges from 10:100 to 150:100.
6. The organopolysiloxane composition according to claim 1 , wherein, the component (A1) has the following average unit formula,
(SiO 4/2 ) a1 (R 5 R 6 2 SiO 1/2 ) a2 ,
wherein R 5 is selected from similar or different alkenyl groups, the content of the alkenyl groups is 0.01-0.30 mol/100 g, R 6 is selected from alkenyl groups and similar or different alkyl groups that are univalent substituted or unsubstituted, wherein 0.5<a1<0.99, 0.01<a2<0.5, and a1+a2=1.
7. The organopolysiloxane composition according to claim 1 , wherein, the component (A2) has the following average unit formula,
R 5 R 6 2 SiO(R 6 2 SiO) a3 SiR 6 2 R 5 ,
wherein R 5 is selected from similar or different alkenyl groups, the content of the alkenyl groups is 0.0001-0.01 mol/100 g, R 6 is selected from similar or different alkyl groups that are univalent substituted or unsubstituted, wherein 10<a3<10000.
8. The organopolysiloxane composition according to claim 1 , wherein, the component (B) has the following average unit formula,
R 8 3 SiO(R 8 2 SiO) b1 (R 8 HSiO) b2 SiR 8 3 ,
Wherein, R 8 is selected from similar or different alkyl groups that are univalent substituted or unsubstituted, wherein 0.2<b1<0.8, 0.2<b2<0.8, and b1+b2=1.
9. The organopolysiloxane composition according to claim 1 , wherein, the component (C) has the following average unit formula:
wherein, the R represents
or a hydrogen atom.
10. A preparation method for an organopolysiloxane composition of claim 1 , comprising the following steps:
blending the components (A1) and (A2) to obtain a mixed solution having a mixing viscosity of 6000 to 20000 mPa·s;
blending the components (B), (C) and (D) with the mixed solution; and
obtaining the composition.
11. A semiconductor component comprising a light-emitting component and a support configured to fix the light-emitting component, wherein the support is any one of a copper support, a mirror finish aluminum support, a ceramic substrate support, a COB support or an integrated support, and wherein the light-emitting component is coated with the cured substance of the organopolysiloxane composition of claim 1 .