METHOD AND DEVICE FOR DETERMINING THE CURING BEHAVIOR OF AN ADHESIVE- OR SEALANT BEAD
A method for determining the curing behavior of an adhesive- or sealant bead, the adhesive- or sealant bead being applied to a workpiece, places multiple test bodies on the adhesive- or sealant bead at different, pre-defined placement times, and deformations of the adhesive- or sealant bead, caused by the test bodies, are measured at a pre-defined end time.
1 . Method for determination of the curing behavior of an adhesive bead or sealant bead ( 10 ), wherein the adhesive bead or sealant bead ( 10 ) is applied to a workpiece ( 12 ), wherein multiple test bodies ( 26 ) are set onto the adhesive bead or sealant bead ( 10 ) at different, predetermined set-down time points, and wherein deformations of the adhesive bead or sealant bead ( 10 ) caused by the test bodies ( 26 ) are measured at a predetermined end time.
2 . Method according to claim 1 , wherein multiple test bodies ( 26 ) and preferably all the test bodies ( 26 ) are configured identically.
3 . Method according to claim 1 wherein at the end time point, sink-in depths of the test bodies ( 26 ) into the adhesive bead or sealant bead ( 10 ) are measured.
4 . Method according to claim 1 , wherein the test bodies ( 26 ) are set down onto the adhesive bead or sealant bead ( 10 ) at constant time intervals.
5 . Method according to claim 1 , wherein a holding device ( 22 ) is se't down onto the workpiece ( 12 ), which device has linear guides ( 24 ) for the test bodies ( 26 ), in which these can be linearly guided in the direction toward the workpiece ( 12 ), and that wherein the test bodies ( 26 ) are introduced into the linear guides ( 24 ) at the set-down time points to impact the adhesive bead or sealant bead ( 10 ) with their weight, and are set down onto the adhesive bead or sealant bead ( 10 ).
6 . Method according to claim 1 , wherein metal pins are used as test bodies ( 26 ).
7 . Apparatus for determination of the curing behavior of an adhesive bead or sealant bead ( 10 ) applied to a workpiece ( 12 ), having a holding device ( 22 ) for being set onto the workpiece ( 12 ), which device has linear guides ( 24 ) for displaceable guidance of test bodies ( 26 ) in a direction toward the workpiece ( 12 ), and having a plurality of identical test bodies ( 26 ) for insertion into the linear guides ( 24 ) and for impacting the adhesive bead or sealant bead ( 10 ) with their weight.
8 . Apparatus according to claim 7 , wherein multiple test bodies ( 26 ) and preferably all the test bodies ( 26 ) are configured to be identical.
9 . Apparatus according to claim 7 , wherein the holding device ( 22 ) is a perforated plate and wherein the test bodies ( 26 ) are pins, particularly metal pins, guided in the holes ( 24 ) of the plate ( 22 ) with play.
10 . Apparatus according to claim 9 , wherein the thickness of the pins ( 26 ) decreases toward an underside set-down surface ( 28 ).