Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

1. A method for producing an optoelectronic semiconductor component comprising the following steps in the given sequence:

A) arranging at least one semiconductor chip on a carrier,

B) applying an electrically insulating photoresist to a top side of the carrier and to the semiconductor chip,

C) curing the photoresist with a baking step,

D) patterning the photoresist by exposure,

F) developing the photoresist, wherein the photoresist is removed at least from a radiation passage surface of the semiconductor chip,

G) further curing the photoresist with a baking step with a final baking of the photoresist at a temperature of at least 200° C., which is higher than a temperature during step C), and

H) applying an electrically conductive contact layer to the photoresist,

wherein the electrically conductive contact layer is in places at a distance from a marginal surface of the photoresist which faces the semiconductor chip, wherein the marginal surface facing the semiconductor chip is exposed in places.

2. The method for producing an optoelectronic semiconductor component according to claim 1 ,

in which after step C) and before step D) a step C1) is carried out, wherein a further application of the photoresist takes place according to step B).

3. The method for producing an optoelectronic semiconductor component according to claim 2 ,

in which the photoresist is applied in a total thickness of at least 25 μm.

4. The method for producing an optoelectronic semiconductor component according to claim 2 ,

in which after step C1) and before step D) a further curing of the photoresist takes place according to step C).

5. The method for producing an optoelectronic semiconductor component) according to claim 1 ,

in which after step D) and before step F) a further method step E) is carried out, in which the photoresist is polymerized with a baking step.

6. The method for producing an optoelectronic semiconductor component according to claim 1 ,

in which after step F) a step F1) is performed, wherein a photocuring of the photoresist takes place with UV light.

7. The method for producing an optoelectronic semiconductor component according to claim 6 ,

in which the photocuring of the photoresist takes place with an illuminance of the UV light of at least 2000 mJ/cm 2 .

8. The method for producing an optoelectronic semiconductor component according to claim 1 ,

in which after step F1) a polymerization of the photoresist takes place by a baking step.

9. The method for producing an optoelectronic semiconductor component according to claim 1 ,

in which the method step G) takes place for at least 30 minutes at a temperature of at least 200° C.

10. The method for producing an optoelectronic semiconductor component according to claim 1 ,

in which the photoresist is a dielectric negative resist, which comprises a cresol resin with a melamine cross-linker or consists of a cresol resin with a melamine cross-linker.

11. The method for producing an optoelectronic semiconductor component according to claim 1 ,

in which the photoresist is a dielectric positive resist, which comprises a novolac resin or consists of a novolac resin.

12. The method for producing an optoelectronic semiconductor component according to claim 1 ,

in which in step D) and in step F) marginal surfaces of the photoresist are configured such that they run obliquely relative to the top side of the carrier.

13. The method for producing an optoelectronic semiconductor component according to claim 1 ,

in which the steps A) to H) take place with a plurality of semiconductor chips in a wafer composite, wherein after step H) the wafer is singulated into individual components.

14. The method for producing an optoelectronic semiconductor component according to claim 1 ,

in which the photoresist and the electrically conductive contact layer arranged thereon extend over an electrical contact surface of the semiconductor chip, partially covering this, and the electrically conductive contact layer is in contact with the electrical contact surface at least in places.

15. The method for producing an optoelectronic semiconductor component according to claim 1 , comprising

providing an ESD protection diode, and

forming at least one via through the carrier, wherein the ESD protection diode and the via are in electrical contact with the electrically conductive contact layer.

16. The method for producing an optoelectronic semiconductor component according to claim 1 ,

in which the semiconductor chip is at least partially embedded in the carrier and the radiation passage surface is flush with the top side of the carrier or protrudes above this in a vertical direction on the carrier.

17. A method for producing an optoelectronic semiconductor component comprising the following steps in the given sequence:

A) arranging at least one semiconductor chip on a carrier,

B) applying an electrically insulating photoresist to a top side of the carrier and to the semiconductor chip,

C) curing the photoresist with a baking step,

D) patterning the photoresist by exposure,

F) developing the photoresist, wherein the photoresist is removed at least from a radiation passage surface of the semiconductor chip,

G) further curing the photoresist with a baking step with a final baking of the photoresist at a temperature of at least 200° C., which is higher than a temperature during step C), and

H) applying an electrically conductive contact layer to the photoresist, wherein the electrically conductive contact layer is in places at a distance from a marginal surface of the photoresist which faces the semiconductor chip, wherein the marginal surface facing the semiconductor chip is exposed in places.