IP Library › Granted Patent US 10,381,626
Granted Patent B2
US 10,381,626 · App. 15/522,797 · Granted Aug 13, 2019

Heat-resistant synthetic resin microporous film and method for producing the same

Inventors: Junichi Nakadate (Osaka, JP); Taehyung Cho (Osaka, JP); Takahiko Sawada (Osaka, JP); Yuki Kanaoka (Osaka, JP); Masahiko Gotoh (Saitama, JP)
Assignee: ASAHI KASEI KABUSHIKI KAISHA
H01M2/1686C08F2/00C08F2/46C08J7/06C08J7/08C08J7/123C08J7/18C08J9/36H01M2/145H01M2/16H01M2/1653H01M10/0525C08J2323/12C08J2435/02H01M2220/30
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Quick Facts
Patent No.
US 10,381,626
App. No.
15/522,797
Granted
Aug 13, 2019
Kind
B2
Abstract

Provided are a heat-resistant synthetic resin microporous film that has both good heat resistance and good mechanical strength and exhibits a suppressed decrease in mechanical strength over time, and a method for producing the heat-resistant synthetic resin microporous film. The heat-resistant synthetic resin microporous film of the present invention includes a synthetic resin microporous film, and a coating layer formed on at least part of the surface of the synthetic resin microporous film and containing a polymer of a polymerizable compound having two or more radically polymerizable functional groups per molecule. The maximum thermal shrinkage rate of the heat-resistant synthetic resin microporous film when heated from 25° C. to 180° C. at a temperature rising rate of 5° C./min is 15% or less. The piercing strength thereof is 0.6 N or more. The rate of retention of the piercing strength after heating at 70° C. for 168 hours is 85% or more.

Claims (24)

1. A heat-resistant synthetic resin microporous film comprising:

a synthetic resin microporous film; and

a coating layer formed on at least part of a surface of the synthetic resin microporous film and containing a polymer of a polymerizable compound having two or more radically polymerizable functional groups per molecule,

the heat-resistant synthetic resin microporous film having a maximum thermal shrinkage rate of 15% or less when heated from 25° C. to 180° C. at a temperature rising rate of 5° C./min, a piercing strength of 0.6 N or more and a rate of retention of the piercing strength of 85% or more after heating at 70° C. for 168 hours.

2. The heat-resistant synthetic resin microporous film according to claim 1 , wherein the heat-resistant synthetic resin microporous film has an air permeability of 50 to 600 sec/100 mL.

3. The heat-resistant synthetic resin microporous film according to claim 1 , wherein the heat-resistant synthetic resin microporous film has a surface porosity of 25 to 55%.

4. The heat-resistant synthetic resin microporous film according to claim 1 , wherein a radical quantity determined by an electron spin resonance method is 2.0×10 16 spins/100 mg or less.

5. The heat-resistant synthetic resin microporous film according to claim 1 , wherein the coating layer contains the polymer obtained by polymerizing the polymerizable compound with irradiation of active energy rays.

6. The heat-resistant synthetic resin microporous film according to claim 2 , wherein the heat-resistant synthetic resin microporous film has a surface porosity of 25 to 55%.

7. The heat-resistant synthetic resin microporous film according to claim 2 , wherein a radical quantity determined by an electron spin resonance method is 2.0×10 16 spins/100 mg or less.

8. The heat-resistant synthetic resin microporous film according to claim 3 , wherein a radical quantity determined by an electron spin resonance method is 2.0×10 16 spins/100 mg or less.

9. The heat-resistant synthetic resin microporous film according to claim 6 , wherein a radical quantity determined by an electron spin resonance method is 2.0×10 16 spins/100 mg or less.

10. The heat-resistant synthetic resin microporous film according to claim 2 , wherein the coating layer contains the polymer obtained by polymerizing the polymerizable compound with irradiation of active energy rays.

11. The heat-resistant synthetic resin microporous film according to claim 3 , wherein the coating layer contains the polymer obtained by polymerizing the polymerizable compound with irradiation of active energy rays.

12. The heat-resistant synthetic resin microporous film according to claim 6 , wherein the coating layer contains the polymer obtained by polymerizing the polymerizable compound with irradiation of active energy rays.

13. The heat-resistant synthetic resin microporous film according to claim 4 , wherein the coating layer contains the polymer obtained by polymerizing the polymerizable compound with irradiation of active energy rays.

14. The heat-resistant synthetic resin microporous film according to claim 7 , wherein the coating layer contains the polymer obtained by polymerizing the polymerizable compound with irradiation of active energy rays.

15. The heat-resistant synthetic resin microporous film according to claim 8 , wherein the coating layer contains the polymer obtained by polymerizing the polymerizable compound with irradiation of active energy rays.

16. The heat-resistant synthetic resin microporous film according to claim 9 , wherein the coating layer contains the polymer obtained by polymerizing the polymerizable compound with irradiation of active energy rays.

17. A method for producing a heat-resistant synthetic resin microporous film comprising:

an applying step of applying a polymerizable compound having two or more radically polymerizable functional groups per molecule to at least part of a surface of a synthetic resin microporous film;

an irradiating step of irradiating, with active energy rays at an irradiation dose of 40 to 70 kGy, the synthetic resin microporous film to which the polymerizable compound has been applied; and

a heating step of heating, in an atmosphere having an oxygen concentration of 300 ppm or less, the synthetic resin microporous film irradiated with the active energy rays.

18. The method for producing a heat-resistant synthetic resin microporous film according to claim 17 , wherein, in the irradiating step, the synthetic resin microporous film to which the polymerizable compound has been applied is irradiated with the active energy rays in an atmosphere having an oxygen concentration of 300 ppm or less.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2019
From: SEKISUI CHEMICAL CO., LTD.
To: ASAHI KASEI KABUSHIKI KAISHA
Reel/Frame 049447/0693 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2017
From: NAKADATE, JUNICHI; CHO, TAEHYUNG; SAWADA, TAKAHIKO; KANAOKA, YUKI; GOTOH, MASAHIKO
To: SEKISUI CHEMICAL CO., LTD.
Reel/Frame 042172/0386 →
Priority Claims (1)
JP 2014-225066 · Nov 5, 2014 · national
Continuity (1)
Related Publication 20170317329A1 · Nov 2, 2017