Leadframe for a semiconductor component
The present disclosure relates to semiconductor components. The teachings thereof may be embodied in a lead frame for a semiconductor component including: a frame having a recess; an electrically conductive connecting element for establishing an electrical connection to the semiconductor component arranged in the recess; and an insulating element arranged in the recess and mechanically connecting the connecting element to the frame and electrically insulating it from the frame.
1. A lead frame for a semiconductor component, the lead frame comprising:
a frame having a recess;
an insulating element arranged in the recess, the insulating element including a cavity;
an electrically conductive insertion element arranged in the cavity of the insulating element and insulated from the lead frame by the insulating element, the electrically conductive insertion element having a cavity;
an electrically conductive connecting element arranged in and extending longitudinally out from the cavity of the electrically conductive insertion element; and
a wire bond attached to a surface of the electrically conductive insertion element and to the semiconductor component.
2. The lead frame as claimed in claim 1 , wherein the cavity in the insulating element in which the electrically conductive insertion element is arranged comprises an essentially cylindrical cavity.
3. The lead frame as claimed in claim 1 , wherein the cavity in the insulating element in which the electrically conductive insertion element is arranged comprises a non-cylindrical cavity.
4. The lead frame as claimed in claim 1 , wherein the insulating element comprises a base region bounding the cavity on one side and electrically insulating the electrically conductive insertion element and the electrically conductive connecting element from the frame.
5. The as claimed in claim 2 , wherein the electrically conductive connecting element is electrically and mechanically connected to the insertion element.
6. The lead frame as claimed in claim 1 , further comprising the electrically conductive connecting element connected to the electrically conductive insertion element in a positively or frictionally locking fashion.
7. The lead frame as claimed in claim 1 , wherein the electrically conductive insertion element comprises a molded on element.
8. A circuit arrangement comprising:
a semiconductor component mounted on a lead frame; and
the lead frame comprising:
a frame having a recess;
an insulating element arranged in the recess, the insulating element including a cavity; and
an electrically conductive insertion element arranged in the cavity of the insulating element and insulated from the lead frame by the insulating element, the electrically conductive insertion element having a cavity;
an electrically conductive connecting element arranged in and extending longitudinally out from the cavity in the electrically conductive insertion element;
wherein the semiconductor component is electrically connected to the electrically conductive insertion element via a wire-bonded connection attached to a surface of the electrically conductive insertion element.
9. The circuit arrangement as claimed in claim 8 , further comprising:
a second lead frame for at least one further semiconductor component, the second lead frame having a frame with a recess;
the electrically conductive insertion element establishing an electrical connection to at least one of the at least two semiconductor components arranged in a respective one of the two recesses; and
the insulating element being arranged in the two recesses and electrically insulating the electrically conductive insertion element from the two lead frames.
10. The circuit arrangement as claimed in claim 9 , wherein the insertion element is inserted into both of the two recesses and connects the two lead frames to one another mechanically.
11. The lead frame as claimed in claim 1 , wherein the wire bond is directly attached to a planar surface of the electrically conductive insertion element.
12. The lead frame as claimed in claim 1 , wherein the wire bond is directly attached to the electrically conductive insertion element, but not directly attached to the electrically conductive connecting element.
13. The circuit arrangement as claimed in claim 9 , wherein the semiconductor component is electrically connected to a planar surface of the electrically conductive insertion element via the wire-bonded connection.
14. The circuit arrangement as claimed in claim 9 , wherein the wire-bonded connection is directly attached to the electrically conductive insertion element, but not directly attached to the electrically conductive connecting element.