Compositionally matched molecular solders for semiconductors
Chalcogenidometallates of group IIB, IV and V elements and, particularly, alkali metal-containing chalcogenidometallates of cadmium, lead and bismuth are provided. Also provided are methods of using the chalcogenidometallates as molecular solders to form metal chalcogenide structures, including thin films, molded objects and bonded surfaces composed of metal chalcogenides.
1. A method of forming a structure comprising a metal chalcogenide, the method comprising:
coating a surface of a substrate with a dispersion comprising metal chalcogenide particles, a compositionally matched metal chalcogenide precursor and a solvent, wherein the metal chalcogenide precursor is a chalcogenidometallate of a group IIB, group IV or group V element; and
annealing the coating to form the structure comprising the metal chalcogenide.
2. The method of claim 1 , wherein the metal chalcogenide precursor is an alkali metal-containing chalcogenidometallate.
3. The method of claim 2 , wherein the metal chalcogenide particles are cadmium chalcogenide particles, bismuth chalcogenide particles or lead chalcogenide particles and the metal chalcogenide precursor is an alkali metal-containing chalcogenidometallate of cadmium, bismuth or lead.
4. The method of claim 3 , further comprising reacting an alkali metal chalcogenide with a chalcogenide of cadmium, bismuth or lead in a solvent to form the metal chalcogenide precursor.
5. The method of claim 4 , further comprising reacting an alkali metal hydride with an elemental chalcogen in a solvent to form the alkali metal chalcogenide.
6. The method of claim 3 , further comprising reacting an alkali metal hydride with an elemental chalcogen and cadmium oxide, lead oxide or bismuth oxide in a solvent to form the metal chalcogenide precursor.
7. The method of claim 3 , wherein the alkali metal-containing chalcogenidometallate is selected from the group consisting of A 2 CdTe 2 , A 2 PbTe 2 , A 2 PbSe 2 , A 2 Cd 2 Se 3 , A 4 Bi 2 Te 5 , A 4 Bi 2 Se 5 , and A 6 Bi 0.5 Sb l.5 Te 6 , where A is K, Na or Cs.
8. The method of claim 1 , wherein the metal chalcogenide precursor is an alkylammonium-containing metal chalcogenide precursor.
9. The method of claim 8 , further comprising forming the alkylammonium-containing metal chalcogenide precursor by forming an alkali metal-containing chalcogenidometallate of a group IIB, group IV or group V element; and replacing the alkali metal with an alkylammonium cation via ion exchange to provide the alkylammonium-containing metal chalcogenide precursor.
10. The method of claim 1 , wherein the metal chalcogenide precursor is an organic cation-containing metal chalcogenide precursor or an ammonium cation-containing metal chalcogenide precursor.
11. The method of claim 10 , further comprising forming the metal chalcogenide precursor by forming an alkali metal-containing chalcogenidometallate of a group IIB, group IV or group V element; and replacing the alkali metal with a cation selected from ammonium, alkylammonium, hydrazinium, alkylhydrazinium, sulfonium, and iodonium cations, via ion exchange to provide the metal chalcogenide precursor.
12. The method of claim 1 , wherein the metal chalcogenide particles are core-shell particles comprising a core comprising a first material and a shell comprising the metal chalcogenide surrounding the core.
13. The method of claim 12 , wherein the first material is a group III-V semiconductor.
14. A method of molding a three-dimensional object of a metal chalcogenide, the method comprising:
filling a mold with a dispersion comprising metal chalcogenide particles, a compositionally matched metal chalcogenide precursor and a solvent;
evaporating excess solvent to form a dried composite; and
annealing the dried composite to form a molded three-dimensional object of a metal chalcogenide.
15. The method of claim 14 , wherein the metal chalcogenide precursor is an alkali metal-containing chalcogenidometallate of a group IIB, group IV or group V element.
16. The method of claim 15 , wherein the metal chalcogenide precursor is an alkali metal-containing chalcogenidometallate of cadmium, bismuth, lead, zinc, mercury, antimony, tin, or germanium.
17. A method of bonding metal chalcogenide surfaces, the method comprising:
coating a first metal chalcogenide surface with a dispersion comprising a compositionally matched metal chalcogenide precursor and a solvent;
contacting a second metal chalcogenide surface with the first metal chalcogenide surface; and
annealing the coating to bond the second metal chalcogenide surface to the first metal chalcogenide surface.
18. The method of claim 17 , wherein the first and second metal chalcogenide surfaces are located on two different macroscopic objects.
19. The method of claim 17 , wherein the first and second metal chalcogenide surfaces are substantially planar.
20. The method of claim 18 , wherein the first and second metal chalcogenide surfaces are located on two different metal chalcogenide wafers.
21. A method of making a field effect transistor, the method comprising:
coating a layer of a dielectric material with a dispersion comprising metal chalcogenide particles, a compositionally matched metal chalcogenide precursor and a solvent, wherein the metal chalcogenide precursor is a chalcogenidometallate of a group IIB, group IV or group V element;
annealing the coating to form a film comprising the metal chalcogenide;
forming a source electrode on the film comprising the metal chalcogenide;
forming a drain electrode on the film comprising the metal chalcogenide;
forming a gate electrode on the layer of dielectric material.
22. The method of claim 21 , wherein the dielectric material is zinc oxide and the metal chalcogenide particles are CdSe particles.