X-ray inspection method and device
View Patent ↗A method including inspecting, using an X-ray transmission image, internal defects in a TSV formed in a semiconductor wafer, and detecting the X-rays, and processing an X-ray transmission image. Therein, the detection of X-rays is configured such that: the detection azimuth of the X-rays, and the detection elevation angle of the X-rays relative to the X-ray source are determined on the basis of information on the arrangement interval, depth, and planar shape of structures formed in the sample. The angle of rotation of a rotating stage on which the sample is mounted is adjusted in accordance with the detection azimuth which has been determined, and the X-rays that have been transmitted through the sample are detected with the position of the detector set to the detection elevation angle which has been determined.
1. An X-ray inspection method comprising the steps of:
applying an X-ray emitted from an X-ray source to a sample to be inspected placed on a rotating stage and having structures formed in the sample to be inspected;
detecting an X-ray transmitted through the sample irradiated with the X-ray with an X-ray detector;
processing a signal, obtained by detecting an X-ray transmitted through the sample with the X-ray detector, to form an X-ray transmission image at an image processing unit; and
processing the X-ray transmission image formed at the image processing unit to detect any defect in the sample at a defect determination unit,
wherein detection of an X-ray transmitted through the sample at the X-ray detector is performed by: determining a detection azimuth relative to the sample of an X-ray transmitted through the sample, detected with the X-ray detector and a detection elevation angle relative to the X-ray source based on information on the arrangement interval, depth, and planar shape of structures formed in the sample; adjusting an angle of rotation of a rotating stage on which the sample is placed according to the determined detection azimuth; and setting the position of the detector to the determined detection elevation angle and detecting an X-ray transmitted through the sample.
2. The X-ray inspection method according to claim 1 ,
wherein a detection elevation angle of an X-ray transmitted through the sample, detected with the X-ray detector relative to the X-ray source is determined as an angle relative to a position in which the X-ray source emits the X-ray.
3. The X-ray inspection method according to claim 1 ,
wherein a detection azimuth relative to the sample and a detection elevation angle relative to the X-ray source are determined such that overlapping of the X-ray transmission images of the structures does not occur.
4. The X-ray inspection method according to claim 1 ,
wherein a detection azimuth relative to the sample and a detection elevation angle relative to the X-ray source are determined such that overlapping of the X-ray transmission images of structures formed in the sample is minimized.
5. The X-ray inspection method according to claim 4 ,
wherein an amount of overlapping of structures formed in the sample is calculated from an X-ray transmission image formed at the image processing unit.
6. The X-ray inspection method according to claim 1 ,
wherein the sample is a silicon (Si) substrate and the structures are a repetitively formed pattern of metal.
7. The X-ray inspection method according to claim 1 ,
wherein information on the determined detection azimuth relative to the sample and detection elevation angle relative to the X-ray source are displayed on a screen.
8. An X-ray inspection method comprising the steps of:
applying an X-ray emitted from an X-ray source to a sample to be inspected placed on a rotating stage and having structures formed in the sample to be inspected;
detecting an X-ray transmitted through the sample irradiated with an X-ray with an X-ray detector;
processing a signal, obtained by detecting an X-ray transmitted through the sample detected with the X-ray detector to from an X-ray transmission image at an image processing unit; and
processing the X-ray transmission image formed at the image processing unit to detect any defect in the sample at a defect determination unit,
wherein the X-ray transmission image formed by processing a signal, obtained by detecting an X-ray transmitted through the sample detected with the X-ray detector, at an image processing unit is displayed on a screen; and a detection azimuth of an X-ray transmitted through the sample detected with the X-ray detector relative to the sample and a detection elevation angle relative to the X-ray source are determined such that overlapping of the X-ray transmission images of the structures formed in the sample does not occur on the screen displaying the X-ray transmission images or such that overlapping of the X-ray transmission images of the structures is minimized.
9. The X-ray inspection method according to claim 8 ,
wherein the sample is a silicon (Si) substrate and the structures are a repetitively formed pattern of metal.
10. The X-ray inspection method according to claim 8 ,
wherein information on the determined detection azimuth relative to the sample and detection elevation angle relative to the X-ray source is displayed on a screen.
11. An X-ray inspection device comprising:
a rotating stage on which a sample to be inspected can be placed and which is rotatable within a plane;
an X-ray source applying an X-ray to a sample placed on the rotating stage;
an X-ray detector detecting an X-ray emitted from the X-ray source and transmitted through the sample;
a pivoting stage adjusting an elevation angle of the X-ray detector relative to a position in which the X-ray source emits the X-ray;
an image processing unit processing a signal obtained by detecting an X-ray transmitted through the sample, detected at the X-ray detector to form an X-ray transmission image;
a defect determination unit processing the X-ray transmission image, formed at the image processing unit, at the defect determination unit to detect any defect in the sample; and
a control unit controlling the rotating stage and the pivoting stage,
wherein the control unit controls an angle of rotation of a rotating stage on which the sample is placed based on information on the arrangement interval, depth, and planar shape of structures formed in the sample or the X-ray transmission image formed at the image processing unit, thereby setting a detection azimuth of the X-ray detector relative to the sample and controls a pivoting angle of the pivoting stage relative to a position in which the X-ray source emits an X-ray, thereby setting a detection elevation angle of the X-ray detector relative to the X-ray source.
12. The X-ray inspection device according to claim 11 ,
wherein the control unit determines the detection azimuth and the detection elevation angle such that overlapping of the X-ray transmission images of the structures does not occur.
13. The X-ray inspection device according to claim 11 ,
wherein the control unit determines a detection azimuth of the X-ray detector relative to the sample and a detection elevation angle relative to the X-ray source such that overlapping of the X-ray transmission images of the structures is minimized.
14. The X-ray inspection device according to claim 13 ,
wherein the control unit calculates an amount of overlapping of the structures from an X-ray transmission image formed at the image processing unit.
15. The X-ray inspection device according to claim 11 , further comprising:
a screen displaying information on the determined detection azimuth and detection elevation angle.