Film-forming ink, film formation method, device with film, and electronic apparatus
A film-forming ink includes a film-forming material and a liquid medium in which the film-forming material is dissolved or dispersed. The liquid medium contains a first component which has a viscosity of less than 20 cp and a second component which has a boiling point at an atmospheric pressure within a range of ±30° C. relative to the boiling point at an atmospheric pressure of the first component and has a viscosity of 20 cp or more, and the second component is contained in an amount of 20 parts by weight or more and 500 parts by weight or less with respect to 100 parts by weight of the first component.
1. A film-forming ink, comprising:
a film-forming material; and
a liquid medium in which the film-forming material is dissolved, the liquid medium containing:
a first component which:
(i) has a viscosity less than 20 cp at a normal temperature that is a range of 20° C.±15° C.,
(ii) has a solubility capable of dissolving the film-forming material in an amount of 1.5 wt % or more, and
(iii) has a boiling point at an atmospheric pressure of 200° C. or higher and 300° C. or lower; and
a second component which:
(i) has a viscosity of 20 cp or more at the normal temperature,
(ii) has a solubility lower than the solubility of the first component, and
(iii) has a boiling point at the atmospheric pressure within a range of ±30° C. relative to the boiling point at the atmospheric pressure of the first component; and
a third component different from the first component and the second component, wherein
the second component is contained in an amount of 20 parts by weight or more and 500 parts by weight or less with respect to 100 parts by weight of the first component.
2. The film-forming ink according to claim 1 , wherein
the viscosity of the film-forming ink is less than 20 cp at the normal temperature.
3. The film-forming ink according to claim 1 , wherein
the third component has a boiling point at the atmospheric pressure lower than a higher one of the boiling point of the first component and the boiling point of the second component, and has a viscosity of less than 20 cp at the normal temperature.
4. The film-forming ink according to claim 3 , wherein
the boiling point at the atmospheric pressure of the third component is 200° C. or higher and 270° C. or lower.
5. The film-forming ink according to claim 1 , wherein
the first component has the solubility capable of dissolving the film-forming material in the amount of 1.5 wt % or more and 4.5 wt % or less of the first component.
6. The film-forming ink according to claim 5 , wherein
the second component has the solubility capable of dissolving the film-forming material in an amount of 0.1 wt % or more and 1.0 wt % or less.
7. The film-forming ink according to claim 1 , wherein
the second component includes a hydroxy group.
8. The film-forming ink according to claim 7 , wherein
the second component includes an aromatic group.
9. The film-forming ink according to claim 7 , wherein
the second component includes an acetate group.
10. The film-forming ink according to claim 1 , wherein
the film-forming ink is supplied as a liquid droplet to an opening part included in a partition wall on a substrate, followed by drying, thereby forming a film.
11. The film-forming ink according to claim 1 , wherein
the third component has a higher volatility than the first component and the second component.
12. The film-forming ink according to claim 1 , wherein
the third component is in a liquid form at the normal temperature.
13. The film-forming ink according to claim 1 , wherein
the third component has the viscosity of 1 cp or more and 5 cp or less at the normal temperature.
14. The film-forming ink according to claim 1 , wherein:
the third component has a surface tension of 20 mN/m or more and 30 mN/m or less at the normal temperature; and
the third component is contained in the liquid medium 40 parts by weight or more and 500 parts by weight or less with respect to 100 parts by weight of the first component.
15. A film formation method, comprising:
a step of supplying the film-forming ink according to claim 1 as a liquid droplet into an opening part included in a partition wall provided on a base material, thereby forming a liquid coating film; and
a step of drying the liquid coating film by heating, thereby forming a film in the opening part.
16. A device with a film, comprising a film formed by the film formation method according to claim 15 or a film obtained by treating the film.
17. An electronic apparatus, comprising the device with a film according to claim 16 .