IP Library › Granted Patent US 11,246,498
Granted Patent B2
US 11,246,498 · App. 15/533,792 · Granted Feb 15, 2022

Sensor, sensor device, and sensor system

Inventors: Yuji Masuda (Yasu, JP); Hiroyuki Mori (Yokohama, JP)
Assignee: KYOCERA Corporation
A61B5/02416A61B5/0006A61B5/0261A61B5/0285A61B5/02427A61B5/02438A61B5/6824A61B5/7214A61B5/742H01L31/16
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Quick Facts
Patent No.
US 11,246,498
App. No.
15/533,792
Granted
Feb 15, 2022
Kind
B2
Abstract

A sensor includes a light emitting element, a photodetector element for receiving light emitted by the light emitting element, and a circuit board having the light emitting element and the photodetector element mounted thereon. A light emitting surface of the light emitting element is facing the circuit board which is provided with a light-transmitting portion for transmitting the light emitted by the light emitting element.

Claims (30)

1. A sensor comprising:

a light emitting element;

a photodetector element for receiving light emitted by the light emitting element; and

a circuit board having the light emitting element and the photodetector element mounted thereon, wherein a light emitting surface of the light emitting element is facing the circuit board provided with a light-transmitting portion for transmitting the light emitted by the light emitting element, and wherein the circuit board includes a portion for shielding the light emitted by the light emitting element, the portion penetrating through the circuit board from a position external to one surface of the circuit board to another position external to an opposite surface of the circuit board, and the portion not overlapping with the circuit board in a thickness direction of the circuit board.

2. The sensor according to claim 1 , wherein a light receiving surface of the photodetector element is facing the circuit board provided with a light-transmitting portion for transmitting light to be received by the photodetector element.

3. The sensor according to claim 1 , wherein the light-transmitting portion is provided with an optical path changing element for changing at least one of an optical path of the light emitted by the light emitting element and an optical path of the light to be received by the photodetector element.

4. The sensor according to claim 3 , wherein the optical path changing element is any one of a spherical lens, an aspherical lens, a Fresnel lens, a cylindrical lens, and a prism.

5. The sensor according to claim 3 , wherein the optical path changing element is configured to direct at least a portion of the light emitted by the light emitting element toward the photodetector element.

6. The sensor according to claim 1 , wherein the circuit board comprises a resin comprising the light-transmitting portion.

7. The sensor according to claim 3 , wherein the circuit board and the optical path changing element are integrally formed.

8. The sensor according to claim 1 , wherein the light emitting element is configured with a plurality of light emitting elements linearly arranged.

9. The sensor according to claim 1 , wherein the photodetector element is configured with a plurality of photodetector elements linearly arranged.

10. The sensor according to claim 1 , wherein the light emitting elements are arranged on both sides of the photodetector element.

11. A sensor device comprising:

a light emitting element for emitting light to a test site;

a photodetector element for receiving at least one of reflection light and scattered light from the test site; and

a circuit board having at least one of the light emitting element and the photodetector element mounted thereon, wherein a light emitting surface of the light emitting element is facing the circuit board, and wherein the circuit board includes a portion for shielding the light emitted by the light emitting element, the portion penetrating through the circuit board from a position external to one surface of the circuit board to another position external to an opposite surface of the circuit board, and the portion not overlapping with the circuit board in a thickness direction of the circuit board.

12. A sensor system comprising:

a sensor device including a light emitting element for emitting light to a test site, a photodetector element for receiving at least one of reflection light and scattered light from the test site, and a circuit board having at least one of the light emitting element and the photodetector element mounted thereon, wherein a light emitting surface of the light emitting element is facing the circuit board, and wherein the circuit board includes a portion for shielding the light emitted by the light emitting element, the portion penetrating through the circuit board from a position external to one surface of the circuit board to another position external to an opposite surface of the circuit board, and the portion not overlapping with the circuit board in a thickness direction of the circuit board; and

a display apparatus for displaying bio-information based on a sensor signal acquired by the sensor device.

13. The sensor according to claim 1 , wherein the circuit board is formed of a deformable material.

14. The sensor according to claim 1 , further comprising:

a housing which houses the light emitting element; and

wherein the portion extends into the housing.

15. The sensor device according to claim 11 , further comprising:

a housing which houses the light emitting element; and

wherein the portion extends into the housing.

16. The sensor system according to claim 12 , further comprising:

a housing which houses the light emitting element; and

wherein the portion extends into the housing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2017
From: MASUDA, YUJI; MORI, HIROYUKI
To: KYOCERA CORPORATION
Reel/Frame 042636/0183 →
Priority Claims (1)
JP JP2014-262893 · Dec 25, 2014 · national
Continuity (1)
Related Publication 20170332923A1 · Nov 23, 2017