Low-profile clip with reduced electrical noise
A reduced or low-profile mechanical clip is described. This mechanical clip may include a trench that constrains the mechanical degrees of freedom of wires, such as those between an interface circuit and an antenna in an electronic device. Moreover, the mechanical clip may have a low height (such as less than 3 mm) so it can fit in a confined space between components in the interior of the electronic device. The mechanical clip may be mountable on a surface in the interior of the electronic device, such as on a printed circuit board or on an inner surface of a chassis or external housing of the electronic device.
1. An electronic device, comprising:
one or more pads configured to couple to an antenna;
wires electrically coupled to the one or more pads;
an interface circuit, electrically coupled to the one or more pads by the wires, configured to communicate with another electronic device; and
a mechanical clip mechanically coupled to the wires, wherein the mechanical clip includes:
a housing with a base having a first surface, wherein the housing has a housing height relative to the first surface, a housing width, a housing length and a housing thickness;
wherein the housing includes a trench, defined by an edge, adjacent to the base, with a trench depth, a trench width and a trench length;
wherein the housing includes a lip, adjacent to the trench and on an opposite side of the trench from the first surface, having a second surface;
wherein the wires are positioned in the trench so that the mechanical clip mechanically constrains the wires to reduce mechanical degrees of freedom of the wires; and
wherein the housing height is less than a predefined value so that the mechanical clip has a reduced profile corresponding to a space between components within the electronic device.
2. The electronic device of claim 1 , further comprising a circuit board, wherein the first surface is mechanically coupled to the circuit board.
3. The electronic device of claim 2 , wherein the mechanical coupling of the first surface to the circuit board is remateable.
4. The electronic device of claim 1 , further comprising an external housing of the electronic device, wherein the first surface is mechanically coupled to an inner surface of the external housing.
5. The electronic device of claim 4 , wherein the mechanical coupling of the first surface to the circuit board is remateable.
6. The electronic device of claim 1 , wherein the second surface is recessed along a direction of the housing height from the first surface.
7. The electronic device of claim 1 , wherein the trench width approximately equals a sum of diameters of three of the wires.
8. The electronic device of claim 1 , wherein the housing includes a beveled edge along one side of the second surface.
9. The electronic device of claim 1 , wherein the trench is configured to have contact with the wires at two locations along the trench length.
10. The electronic device of claim 1 , wherein the reduced mechanical degrees of freedom reduce electrical noise associated with motion of the wires.
11. An electronic device, comprising:
one or more pads configured to couple to an antenna;
wires electrically coupled to the one or more pads;
means for communicating with another electronic device, wherein the means is coupled to the one or more pads by the wires; and
a mechanical clip mechanically coupled to the wires, wherein the mechanical clip includes:
a housing with a base having a first surface, wherein the housing has a housing height relative to the first surface, a housing width, a housing length and a housing thickness;
wherein the housing includes a trench, defined by an edge, adjacent to the base, with a trench depth, a trench width and a trench length;
wherein the housing includes a lip, adjacent to the trench and on an opposite side of the trench from the first surface, having a second surface;
wherein the wires are positioned in the trench so that the mechanical clip mechanically constrains the wires to reduce mechanical degrees of freedom of the wires; and
wherein the housing height is less than a predefined value so that the mechanical clip has a reduced profile corresponding to a space between components within the electronic device.