Lead-free glass and sealing material
What is disclosed is a lead-free glass, which is a V 2 O 5 —TeO 2 —RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO)—ZnO glass and has a low softening point, comprising: 5-55 wt % of V 2 O 5 , 5-75 wt % of TeO 2 , 1-25 wt % of RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO) in total, 0.1-6 wt % of ZnO, and 0.1-3 wt % of R 2 O (at least one selected from the group consisting of Li 2 O, Na 2 O, and K 2 O) in total. This glass can be used as a sealing material providing fluidity which is capable of being sealed at a temperature of 400° C. or less.
1. A lead-free glass, which is a V 2 O 5 —TeO 2 —RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO)—ZnO glass and has a low softening point, comprising:
5-55 wt % of V 2 O 5 ,
5-75 wt % of TeO 2 ,
1-25 wt % of RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO) in total,
0.1-6 wt % of ZnO, and
0.1-3 wt % of R 2 O (at least one selected from the group consisting of Li 2 O, Na 2 O, and K 2 O) in total.
2. A sealing material, comprising the lead-free glass as claimed in claim 1 and an inorganic filler, wherein a content of the inorganic filler is in a range of 1-35 volume % relative to a total volume of the lead-free glass and the inorganic filler.
3. A glass paste, comprising a glass powder composed of the lead-free glass as claimed in claim 1 and an organic vehicle.
4. A method for producing an electronic component, comprising a step of baking at a temperature exceeding a softening point in order to perform sealing after applying the glass paste as claimed in claim 3 .
5. The method for producing the electric component as claimed in claim 4 , wherein a baking temperature is 400° C. or less in the step of baking.