Anisotropic conductive film
An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.
1. An anisotropic conductive film comprising:
an insulating adhesive layer; and
conductive particles that are regularly arranged in the insulating adhesive layer in a tetragonal lattice shape, as viewed in a plan view, that is inclined with respect to a longitudinal direction of the film at an angle of 10 to 40 degrees,
wherein
one or both ends of the conductive particles along a thickness direction of the insulating adhesive layer are not exposed,
the conductive particles have a conductive particle diameter, D, of 10 μm or more and 50 μm or less,
a particle density of the conductive particles is in a range of from 150 to 850 particles/mm 2 ,
the insulating adhesive layer has a thickness, L 2 , of more than 1 times and 2.5 or less times the conductive particle diameter, D,
the thickness, L 2 , is uniform throughout the insulating adhesive layer,
positions of the conductive particles are varied in the thickness direction of the insulating adhesive layer within a variation range of less than 10% of the conductive particle diameter, D, and
D+L 3+ L 4= L 2 (1)
where in formula (1),
D and L 2 are as defined above,
L 3 is a distance between one surface of the insulating adhesive layer and one end of the conductive particles as viewed along the thickness direction of the insulating adhesive layer,
L 4 is a distance between the other surface of the insulating adhesive layer and the other end of the conductive particles as viewed along the thickness direction of the insulating adhesive layer, and
L 4 is optionally zero.
2. The anisotropic conductive film according to claim 1 , wherein L 3 is 10% or more of the conductive particle diameter, D.
3. The anisotropic conductive film according to claim 1 , further comprising:
an alignment mark for an electronic component to be anisotropically, conductively connected, the alignment mark being formed by an arrangement of alignment mark particles that are a portion of the conductive particles, and the alignment mark particles having a smaller diameter than the other conductive particles.
4. A connection structure wherein a first electronic component and a second electronic component are anisotropically, conductively connected by the anisotropic conductive film according to claim 1 .
5. The connection structure according to claim 4 , wherein the first electronic component is a wiring substrate and the second electronic component is a camera module.
6. The connection structure according to claim 4 , wherein the insulating adhesive layer in the anisotropic conductive film is formed from a plurality of resin layers.
7. The anisotropic conductive film according to claim 1 , wherein the insulating adhesive layer is a single layer.
8. The anisotropic conductive film according to claim 1 , wherein the insulating adhesive layer is formed from a plurality of resin layers.
9. The anisotropic conductive film according to claim 1 , wherein the conductive particles are metal particles or metal-coated resin particles.
10. The anisotropic conductive film according to claim 1 , wherein L 2 is more than 1 times and 1.7 or less times the conductive particle diameter, D.
11. The anisotropic conductive film according to claim 1 , wherein L 4 is less than the conductive particle diameter, D.
12. The anisotropic conductive film according to claim 1 , wherein the insulating adhesive layer contains polymerizable resin.
13. A method for manufacturing a connection structure, comprising:
anisotropically conductively connecting a first electronic component with a second electronic component via the anisotropic conductive film according to claim 1 .
14. The method according to claim 13 , wherein the first electronic component is a wiring substrate and the second electronic component is a camera module.
15. The method according to claim 13 , wherein the insulating adhesive layer in the anisotropic conductive film is formed from a plurality of resin layers.
16. The anisotropic conductive film according to claim 1 , wherein the conductive particles have a conductive particle diameter, D, of 10 μm or more and 30 μm or less.
17. The anisotropic conductive film according to claim 1 , wherein when one end of the conductive particles along the thickness direction of the insulating adhesive layer is not exposed, the other end of the conductive particles is in contact with one of the surfaces of the insulating adhesive layer.
18. The anisotropic conductive film according claim 1 , wherein
the film has a minimum capturing efficiency of more than 90%, and
both ends of the conductive particles along a thickness direction of the insulating adhesive layer are not exposed.
19. The anisotropic conductive film according to claim 18 , wherein a difference between maximum and minimum values of particle densities, as viewed in the plan view, measured at ten regions which each have an area of 1 mm×1 mm and are extracted in a longitudinal direction of the anisotropic conductive film is less than 20% of an average of the particle densities at the respective region.
20. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film has a minimum capturing efficiency of 90% or more.