Method and device for producing metal patterns on a substrate for decorative and/or functional purposes, manufacture of objects incorporating said production and set of consumables used

1. Process for producing metal patterns on a substrate, consisting of the following steps:

A. optionally preparing the surface of the substrate intended to receive the metal patterns;

B. depositing a temporary protection on the surface of the substrate corresponding to a negative of the patterns to be produced by a screen printing mask/stencil the cut-outs of which correspond to the negative of the patterns to be produced; and/or by direct printing;

C. optionally activating the surface of the substrate;

D. metallization by depositing at least one metal on the areas corresponding to the patterns to be produced;

E. eliminating the temporary protection of step B;

F. optionally rinsing the surface of the substrate carrying the metal patterns;

G. optionally drying the surface of the substrate carrying the metal patterns;

H. optionally performing a finishing treatment on the surface of the substrate carrying the metal patterns;

wherein step E of eliminating the temporary protection is carried out, during step D, or at least partly during step D and after step D, or at least partly during and after the metallization step D and partly before the metallization step D;

wherein step E consists essentially in dissolving the temporary protection with at least one solvent contained in at least one of the liquids utilized for the metallization step D;

wherein the metallic deposition step D is a non-electrolytic metallization which consists of spraying of one or more redox solutions in the form of (an) aerosol(s) according to one of the following two methods:

a. simultaneously spraying one or more solutions of metallic cations and one or more solutions of reducing agents in a continuous manner; or

b. separately spraying one solution of one or more metallic cations, and then spraying one solution of one or more reducing agents;

and wherein said process optionally comprises, before the metallization D, at least one of the following steps:

I. treatment increasing the surface area of the substrate, when the process comprises an activating step C, a step I of increasing the surface energy of the substrate can optionally be provided before the activation C;

J. wetting the surface of the substrate;

K. rinsing the surface of the substrate.

2. Process according to claim 1 , wherein the metal of step D is selected from the following group of metals:

silver, nickel, tin, iron, gold, cobalt, copper; oxides, alloys and combinations thereof.

3. Process according to claim 1 , wherein said process includes step A, which comprises the deposition of at least one layer of varnish and/or the degreasing of the surface of the substrate intended to receive the metal patterns.

4. Process according to claim 1 , wherein the treatment for increasing the surface energy of the substrate according to step I is selected from physical treatments, and/or chemical treatments, and combinations thereof.

5. Process according to claim 1 , wherein the finishing treatment H is the production of one or more coats of varnish and/or an electrolytic thickening composed of one or more metals.

6. Process according to claim 1 , wherein a solvent allowing dissolution of the temporary protection is contained in at least one of the liquids utilized for the metallization step D and in the liquids used in at least one rinsing step.

7. Process according to claim 1 , wherein the metal patterns obtained are decorative and/or functional.

8. Process according to claim 1 , wherein said process is implemented continuously/in-line on components of an industrial plant.

9. Process for the manufacture of objects comprising metal patterns, wherein it includes the process according to claim 1 .

10. Process according to claim 1 , wherein the process comprises an activating step C and a step I of increasing the surface energy of the substrate, said step I being performed before the activation C.

11. Process according to claim 1 , wherein the temporary protection is alkali-soluble.