IP Library Granted Patent US 10,395,843
Granted Patent B2
US 10,395,843 · App. 15/550,672 · Granted Aug 27, 2019

Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement

Inventors: Markus Koini (Seiersberg, AT); Christoph Auer (Graz, AT); Jürgen Konrad (Graz, AT); Franz Rinner (Deutschlandsberg, AT); Markus Puff (Graz, AT); Monika Stadlober (Graz, AT); Thomas Wippel (Stainz, AT)
Assignee: Epcos AG
H01G4/38H01G2/06H01G4/228H01G4/232H01G4/2325H01G4/248H01G4/30H01R43/26H05K1/181H05K3/3426H05K2201/10015H05K2201/10757H05K2201/10818H05K2201/10909Y02P70/613
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Quick Facts
Patent No.
US 10,395,843
App. No.
15/550,672
Granted
Aug 27, 2019
Kind
B2
Abstract

An electrical connection contact ( 5 ) for a ceramic component ( 2 ) is specified. The connection contact ( 5 ) comprises a first material (M 1 ) and a second material (M 2 ) arranged thereon, wherein the first material (M 1 ) has a high electrical conductivity and the second material (M 2 ) has a low coefficient of thermal expansion.

Claims (34)

1. A component,

comprising a main body having ceramic layers and electrode layers and

comprising an electrical connection contact,

the electrical connection contact comprising a first layer comprising a first material and a second layer comprising a second material arranged thereon, wherein the first material has a high electrical conductivity and the second material has a low coefficient of thermal expansion,

wherein the electrical conductivity of the first material is at least 40 m/Ω mm 2 and the coefficient of thermal expansion of the second material is at most 5 ppm/K, wherein a relation of the thickness of the second layer to the thickness of the first layer is 1:1 up to 5:1,

wherein the electrical connection contact is secured on the main body by a contact material, wherein the contact material is a sintering material, and

wherein the thermal coefficient of the second material is at most 2.5 ppm/K and the thermal coefficient of the connection contact as a whole is between 5 and 7 ppm/K.

2. The component according to claim 1 , wherein the first material comprises copper and the second material comprises Invar.

3. The component according to claim 1 , which is formed from a metal sheet.

4. The component according to claim 1 , comprising

a third material arranged on the second material, wherein the second material is arranged between the first material and the third material.

5. The component according to claim 4 ,

wherein the materials are arranged one above another as first, second and third layers, wherein the third material is identical to the first material, and wherein the third layer has the same thickness as the first layer.

6. The component according to claim 1 ,

wherein the electrical connection contact comprises at least one contact region for securing the connection contact on a main body of the ceramic component and at least one connection region for securing the connection contact on a carrier, wherein the connection region is arranged at an angle with respect to the contact region.

7. The component according to claim 1 , which is embodied in such a way that, upon the connection contact being secured on a carrier, the main body is spaced apart from the carrier.

8. The component according to claim 1 ,

which is embodied as a multilayer capacitor.

9. A component arrangement

comprising a component according to claim 1 and a carrier, on which the component is secured.

10. The component arrangement according to claim 9 ,

wherein the connection contact is connected to the carrier by a connecting material, wherein the connecting material is a sintering material.

11. A method for producing a component according to claim 1 , comprising the steps of

providing the electrical connection contact and the main body of the component,

securing the connection contact on the main body.

12. The method according to claim 11 ,

wherein, for securing the connection contact, a contact material is applied on the main body and/or the connection contact, then the connection contact is arranged on the main body, and then the contact material is sintered.

13. A method for producing an electrical connection contact of a component including a main body having ceramic layers and electrode layers,

the electrical connection contact including a first layer having a first material and a second layer having a second material arranged thereon, wherein the first material has a high electrical conductivity and the second material has a low coefficient of thermal expansion,

wherein the electrical conductivity of the first material is at least 40 m/Ω mm 2 and the coefficient of thermal expansion of the second material is at most 5 ppm/K, wherein a relation of the thickness of the second layer to the thickness of the first layer is 1:1 up to 5:1, and

wherein the electrical connection contact is secured on the main body by a contact material, wherein the contact material is a sintering material,

the method comprising the steps of

providing a metal sheet comprising the second material,

rolling the first material onto the second material.

Assignments (2)
CHANGE OF NAME Recorded Mar 14, 2023
From: EPCOS AG
To: TDK ELECTRONICS AG
Reel/Frame 063085/0832 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2018
From: KOINI, MARKUS; AUER, CHRISTOPH; KONRAD, JURGEN; RINNER, FRANZ; PUFF, MARKUS; STADLOBER, MONIKA; WIPPEL, THOMAS
To: EPCOS AG
Reel/Frame 044587/0125 →
Priority Claims (1)
DE 10 2015 102 866 · Feb 27, 2015 · national
Continuity (1)
Related Publication 20180047507A1 · Feb 15, 2018