IP Library Granted Patent US 10,443,148
Granted Patent B2
US 10,443,148 · App. 15/556,865 · Granted Oct 15, 2019

Methods for controlled doping of a melt including introducing liquid dopant below a surface of the melt

Inventors: Stephan Haringer (Kastelbell-Tschars, IT); Marco D'Angella (Merano, IT); Mauro Diodà (Bolzano, IT)
Assignee: GlobalWafers Co., Ltd.
C30B15/04C30B29/06
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Quick Facts
Patent No.
US 10,443,148
App. No.
15/556,865
Granted
Oct 15, 2019
Kind
B2
Abstract

A method of growing a doped monocrystalline ingot using a crystal growing system is provided. The crystal growing system includes a growth chamber, a dopant feeding device, and a feed tube. The method includes preparing a melt of semiconductor or solar-grade material in a crucible disposed within the growth chamber, introducing a solid dopant into the feed tube with the dopant feeding device, melting the solid dopant within the feed tube to a form a liquid dopant, introducing the liquid dopant into the melt below a surface of the melt, and growing a monocrystalline ingot from the melt by contacting the melt with a seed crystal and pulling the seed crystal away from the melt.

Claims (16)

1. A method of growing a doped monocrystalline ingot using a crystal growing system including a growth chamber, a dopant feeder, and a feed tube, the method comprising:

preparing a melt of semiconductor or solar-grade material in a crucible disposed within the growth chamber;

introducing a solid dopant into the feed tube with the dopant feeder;

melting the solid dopant within the feed tube to a form a liquid dopant;

introducing the liquid dopant into the melt below a surface of the melt; and

growing a monocrystalline ingot from the melt by contacting the melt with a seed crystal and pulling the seed crystal away from the melt.

2. The method of claim 1 , wherein the feed tube includes a first end defining an inlet for receiving solid dopant from the dopant feeder and a second end having a dopant outlet defined therein, the method further comprising positioning the dopant outlet below the surface of the melt.

3. The method of claim 2 , wherein positioning the dopant outlet below the surface of the melt includes positioning the dopant outlet at a depth of at least 1 cm below the surface of the melt.

4. The method of claim 2 , wherein positioning the dopant outlet below the surface of the melt includes positioning the dopant outlet at a depth of between 1 cm and 5 cm below the surface of the melt.

5. The method of claim 1 , wherein introducing a solid dopant into the feed tube includes introducing the solid dopant into the feed tube while the feed tube is positioned within the growth chamber.

6. The method of claim 1 , wherein introducing a solid dopant into the feed tube includes introducing a first charge of solid dopant into the feed tube and, after the first charge of solid dopant is melted, introducing a second charge of solid dopant into the feed tube without removing the feed tube from the growth chamber.

7. The method of claim 1 , wherein introducing a solid dopant into the feed tube includes introducing the solid dopant into the feed tube while the feed tube is removed from the growth chamber.

8. The method of claim 1 , wherein introducing the liquid dopant into the melt includes introducing the liquid dopant into the melt while the monocrystalline ingot is being grown.

9. The method of claim 1 , wherein introducing the liquid dopant into the melt includes introducing the liquid dopant into the melt at a depth of between 1 cm and 5 cm below a surface of the melt.

10. The method of claim 1 , wherein the solid dopant is selected from the group consisting of aluminum, gallium, indium, thallium, and antimony.

11. The method of claim 1 , wherein the melt is a silicon melt.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2017
From: HARINGER, STEPHAN; D'ANGELLA, MARCO; DIODA, MAURO
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 043534/0356 →
Continuity (2)
Provisional Application 62130692 · Mar 10, 2015
Related Publication 20180044814A1 · Feb 15, 2018