Semiconductor light emitting element and semiconductor light emitting element assembly
A semiconductor light emitting element has a laminated structure formed by laminating a first compound semiconductor layer, an active layer, and a second compound semiconductor layer. The semiconductor light emitting element satisfies ΔI 2 >ΔI 1 , where ΔI 1 is an operating current range when the temperature of the active layer is T 1 , and ΔI 2 is the operating current range when the temperature of the active layer is T 2 (where T 2 >T 1 ). The semiconductor light emitting element satisfies P 2 >P 1 , where P 1 is a maximum optical output emitted when the temperature of the active layer is T 1 , and P 2 is the maximum optical output emitted when the temperature of the active layer is T 2 (where T 2 >T 1 ).
1. A semiconductor light emitting element assembly comprising:
a semiconductor light emitting element having a laminated structure formed by laminating a first compound semiconductor layer, an active layer, and a second compound semiconductor layer;
the semiconductor light emitting element assembly satisfying ΔI 2 >ΔI 1 ,
wherein ΔI 1 is a first operating current range when temperature of the active layer is T 1 , and ΔI 2 is a second operating current range when the temperature of the active layer is T 2 , and T 2 >T 1 , and
wherein an operating current when an optical pulse repetition frequency changes from a fundamental frequency determined by a distance of an optical system to a frequency twice the fundamental frequency is an upper limit value of an operating current range of the semiconductor light emitting element.
2. The semiconductor light emitting element assembly according to claim 1 , wherein
the semiconductor light emitting element assembly satisfies I max-2 >I max-1 ,
wherein I max-1 is an upper limit value of the operating current range when the temperature of the active layer is T 1 , and I max-2 is the upper limit value of the operating current range when the temperature of the active layer is T 2 .
3. The semiconductor light emitting element assembly according to claim 1 , further comprising:
a heat sink; and
a sub-mount, wherein
the heat sink, the sub-mount, and the semiconductor light emitting element are sequentially laminated.
4. The semiconductor light emitting element assembly according to claim 3 , wherein
the sub-mount is formed of AlN, Si, SiC, Cu, W, Mo, Al, or diamond, or composite materials including these materials.
5. The semiconductor light emitting element assembly according to claim 3 , wherein the temperature of the active layer is controlled by the heat sink.
6. The semiconductor light emitting element assembly according to claim 5 , wherein the temperature of the active layer is controlled by heating the heat sink.
7. The semiconductor light emitting element assembly according to claim 1 , wherein
the laminated structure has a structure in which a light emitting region and a saturable absorption region are juxtaposed to each other in a resonator direction.
8. The semiconductor light emitting element assembly according to claim 7 , wherein
the saturable absorption region is disposed in an end region of the laminated structure in the resonator direction.
9. The semiconductor light emitting element assembly according to claim 7 , wherein
a current fed to the light emitting region is 1×10 2 amperes/cm 2 to 1×10 5 amperes/cm 2 per unit area of the light emitting region.
10. The semiconductor light emitting element assembly according to claim 1 , wherein
the laminated structure has a structure in which a plurality of functional regions are integrated.
11. The semiconductor light emitting element assembly according to claim 10 , wherein
at least one of the plurality of functional regions is formed by a saturable absorption region.
12. The semiconductor light emitting element assembly according to claim 1 , wherein the second compound semiconductor layer includes an InGaN light guide layer and a p-type AlGaN electronic barrier layer, and wherein the InGaN light guide layer is directly coupled to the p-type AlGaN electronic barrier layer, and the active layer is directly coupled to the InGaN light guide layer opposite the p-type AlGaN electronic barrier layer.
13. A semiconductor light emitting element assembly comprising:
a semiconductor light emitting element having a laminated structure formed by laminating a first compound semiconductor layer, an active layer, and a second compound semiconductor layer;
the semiconductor light emitting element assembly satisfying P 2 >P 1 ,
wherein P 1 is a maximum optical output emitted when temperature of the active layer is T 1 , and P 2 is the maximum optical output emitted when the temperature of the active layer is T 2 , and T 2 >T 1 , and
wherein an operating current when an optical pulse repetition frequency changes from a fundamental frequency determined by a distance of an optical system to a frequency twice the fundamental frequency is an upper limit value of an operating current range of the semiconductor light emitting element.
14. The semiconductor light emitting element assembly according to claim 13 , wherein the second compound semiconductor layer includes an InGaN light guide layer and a p-type AlGaN electronic barrier layer, and wherein the InGaN light guide layer is directly coupled to the p-type AlGaN electronic barrier layer, and the active layer is directly coupled to the InGaN light guide layer opposite the p-type AlGaN electronic barrier layer.
15. A semiconductor light emitting element comprising:
a laminated structure formed by laminating a first compound semiconductor layer, an active layer, and a second compound semiconductor layer;
the semiconductor light emitting element satisfying ΔI 2 >ΔI 1 ,
wherein ΔI 1 is a first operating current range when temperature of the active layer is T 1 , and ΔI 2 is a second operating current range when the temperature of the active layer is T 2 , and T 2 >T 1 , and
wherein an operating current when an optical pulse repetition frequency changes from a fundamental frequency determined by a distance of an optical system to a frequency twice the fundamental frequency is an upper limit value of an operating current range of the semiconductor light emitting element.
16. The semiconductor light emitting element according to claim 15 , wherein the second compound semiconductor layer includes an InGaN light guide layer and a p-type AlGaN electronic barrier layer, and wherein the InGaN light guide layer is directly coupled to the p-type AlGaN electronic barrier layer, and the active layer is directly coupled to the InGaN light guide layer opposite the p-type AlGaN electronic barrier layer.
17. A semiconductor light emitting element comprising:
a laminated structure formed by laminating a first compound semiconductor layer, an active layer, and a second compound semiconductor layer;
the semiconductor light emitting element satisfying P 2 >P 1 ,
wherein P 1 is a maximum optical output emitted when temperature of the active layer is T 1 , and P 2 is the maximum optical output emitted when the temperature of the active layer is T 2 , and T 2 >T 1 , and
wherein an operating current when an optical pulse repetition frequency changes from a fundamental frequency determined by a distance of an optical system to a frequency twice the fundamental frequency is an upper limit value of an operating current range of the semiconductor light emitting element.
18. The semiconductor light emitting element according to claim 17 , wherein the second compound semiconductor layer includes an InGaN light guide layer and a p-type AlGaN electronic barrier layer, and wherein the InGaN light guide layer is directly coupled to the p-type AlGaN electronic barrier layer, and the active layer is directly coupled to the InGaN light guide layer opposite the p-type AlGaN electronic barrier layer.