Adhesive composition
Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and an OED including the same.
1. An adhesive composition for encapsulating an organic electronic element comprising:
an olefin-based resin component;
a radical photocurable compound; and
a curable resin,
wherein the adhesive composition is a solventless liquid at 25° C.,
wherein the adhesive composition exhibits a first peak having a glass transition temperature in the range of 20° C. to 60° C. and a second peak having a glass transition temperature in the range of 80° C. to 120° C., measured by differential scanning calorimetry after curing, and has a tensile modulus in the range of 1 MPa to 300 MPa at 25° C. after curing, and
wherein the olefin-based resin component, the curable resin and the radical photocurable compound are present at 50 to 70 parts by weight, 30 to 40 parts by weight, and 1 to 25 parts by weight, respectively, based on a total weight of the adhesive composition.
2. The adhesive composition of claim 1 , wherein the olefin-based resin component has a water vapor transmission rate of 50 g/m 2 ·day or less.
3. The adhesive composition of claim 1 , wherein the curable resin comprises one or more curable functional groups.
4. The adhesive composition of claim 1 , wherein the olefin-based resin component has one or more reactive functional groups having reactivity with the curable resin.
5. The adhesive composition of claim 4 , wherein the reactive functional group is an acid anhydride group, a carboxyl group, an epoxy group, an amino group, a hydroxyl group, an isocyanate group, an oxazoline group, an oxetane group, a cyanate group, a phenol group, a hydrazide group or an amide group.
6. The adhesive composition of claim 1 , further comprising:
a curing agent in an amount of 1 to 100 parts by weight with respect to 100 parts by weight of the curable resin.
7. The adhesive composition of claim 1 , wherein the radical photocurable compound comprises a multifunctional active energy ray-polymerizable compound.
8. The adhesive composition of claim 1 , wherein the radical photocurable compound satisfies Formula 1:
where R 1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or higher, and X is a residue derived from a linear, branched or cyclic alkyl or alkenyl group having 3 to 30 carbon atoms.
9. The adhesive composition of claim 1 , further comprising:
a photoradical initiator at 0.1 to 20 parts by weight with respect to 100 parts by weight of the radical photocurable compound.
10. The adhesive composition of claim 2 , further comprising:
a moisture absorbent.
11. The adhesive composition of claim 10 , wherein the moisture absorbent is present in the adhesive composition at 5 to 100 parts by weight with respect to 100 parts by weight of the olefin-based resin component.
12. An organic electronic device, comprising:
a substrate;
an organic electronic element formed on the substrate; and
a side encapsulation layer formed on peripheral portions of the substrate to surround side surfaces of the organic electronic element, and including the adhesive composition of claim 1 .
13. The organic electronic device of claim 12 , further comprising:
an entire encapsulation layer for covering the entire surface of the organic electronic element,
wherein the entire encapsulation layer is present in the same plane as the side encapsulation layer.
14. A method of manufacturing an organic electronic device, comprising:
applying the adhesive composition of claim 1 to a peripheral portion of a substrate on which an organic electronic element is formed to surround side surfaces of the organic electronic element;
irradiating the adhesive composition with light; and
heating the adhesive composition.