IP Library › Granted Patent US 10,412,491
Granted Patent B2
US 10,412,491 · App. 15/562,410 · Granted Sep 10, 2019

Band-pass acoustic filter and acoustic sensing apparatus

Inventor: Quanbo Zou (Weifang, CN)
Assignee: GOERTEK, INC.
H04R3/04H04R19/005H04R19/04H04R29/005H04R1/227H04R3/005H04R2201/003
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Quick Facts
Patent No.
US 10,412,491
App. No.
15/562,410
Granted
Sep 10, 2019
Kind
B2
Abstract

The present invention discloses a band-pass acoustic filter and an acoustic sensing apparatus. The band-pass acoustic filter including at least two MEMS microphone chips and an ASIC chip, wherein the output signals of the MEMS microphone chips are processed in the ASIC chip after being coupled.

Claims (12)

1. A band-pass acoustic filter, including:

at least two Microelectromechanical Systems, MEMS, microphone chips, which have different resonance bandwidths; and

an Application-Specific Integrated Circuit, ASIC, chip,

wherein the output signals of the MEMS microphone chips are coupled to form and increase one resonance band pass of the band-pass acoustic filter by combining the different resonance bandwidths of the MEMS microphone chips and then are processed in the ASIC chip,

wherein the band-pass acoustic filter further includes a metal case, for forming a back cavity for the MEMS microphone chips, wherein the MEMS microphone chips are acoustically coupled through the back cavity.

2. The band-pass acoustic filter according to claim 1 , wherein each of the MEMS microphone chips is mounted above the acoustic port of a substrate.

3. The band-pass acoustic filter according to claim 1 , further including a substrate, wherein the metal case and the substrate form an enclosed back cavity together.

4. The band-pass acoustic filter according to claim 1 , wherein the output signals are coupled in series.

5. The band-pass acoustic filter according to claim 1 , wherein the resonance frequency of each of the MEMS microphone chips is adjusted by setting at least one of diaphragm resonance frequency, front-chamber size and acoustic port dimension of the MEMS microphone chip.

6. An acoustic sensing apparatus, comprising the band-pass acoustic filter according to claim 1 , for sensing a sound wave.

7. The acoustic sensing apparatus according to claim 6 , wherein the sound wave includes ultrasonic wave.

8. The acoustic sensing apparatus according to claim 6 , wherein the acoustic sensing apparatus is a microphone.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2020
From: GOERTEK, INC.
To: WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
Reel/Frame 052846/0443 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2017
From: ZOU, QUANBO
To: GOERTEK, INC.
Reel/Frame 044263/0969 →
Continuity (1)
Related Publication 20180288526A1 · Oct 4, 2018