Apparatus and method for contactless transfer and soldering of chips using a flash lamp

1. A method for soldering a chip to a substrate, the method comprising:

providing a chip carrier between a flash lamp and the substrate, wherein the chip is attached to the chip carrier on a side of the chip carrier facing the substrate, and wherein a solder material is disposed between the chip and the substrate; and

generating a light pulse with the flash lamp for heating the chip, wherein the light pulse heating of the chip causes the chip to be released from the chip carrier to transfer contactlessly towards the substrate, and wherein the solder material is melted by contact with the chip, after the chip is heated by the light pulse, for attaching the chip to the substrate.

2. The method according to claim 1 , wherein a transmitted light of the light pulse from the flash lamp continues to irradiate the chip while the chip is contactlessly in transit over a distance between the chip carrier and the substrate.

3. The method according to claim 2 , wherein an intensity of the transmitted light impinging the chip is modulated as a function of time by at least one of the group consisting of:

a controlling of the light pulse of the flash lamp, and

a masking device between the flash lamp and chip carrier,

wherein, by said modulation, an intensity of the transmitted light is higher at a moment when the chip is released from the chip carrier than during a time of transit of the chip between the chip carrier and the substrate.

4. The method according to claim 3 , wherein the transmitted light of the light pulse continues to irradiate the chip while it is positioned on the substrate, and

wherein an intensity of the transmitted light is increased after the transit when the chip contacts the solder material on the substrate.

5. The method according to claim 1 , wherein the chip carrier comprises a carrier substrate that is transparent to the light pulse, and wherein the chip is heated by the light pulse that is transmitted through carrier substrate of the chip carrier.

6. The method according to claim 1 , wherein the light of the light pulse causes decomposition of an adhesive material between the chip carrier and the chip thereby releasing the chip from the chip carrier.

7. The method according to claim 1 , wherein the chip is attached to the chip carrier at a distance from the substrate, and wherein the distance is between 50 and 500 micrometer.

8. The method according to claim 1 , wherein a masking device comprises a masking pattern, wherein the masking device is disposed between the flash lamp and the chip, and wherein the masking pattern is configured to selectively pass light of the light pulse to the chip.

9. The method according to claim 1 , wherein a plurality of chips are simultaneously transferred from the chip carrier to the substrate and soldered to the substrate.

10. The method according to claim 1 , wherein the transfer and soldering of one or more chips is effected by a single light pulse.

11. The method according to claim 1 , wherein

two or more different chips having different heating properties are attached to the chip carrier; and

a masking device is disposed between the flash lamp and the two or more different chips to cause different light intensities in different areas of the light pulse passing the masking device, and thereby heating individual ones of the two or more different chips with different light intensities, and wherein the different light intensities at least partially compensate the different heating properties to reduce a spread in temperature of the two or more different chips as a result of heating by the light pulses from the flash lamp.

12. The method according to claim 1 , wherein the substrate comprises a flexible foil in a roll-to-roll process.