MEMS pressure sensing element

1. A MEMS pressure sensing element comprising:

a substrate provided with a groove;

a pressure-sensitive film disposed on the substrate, the pressure-sensitive film sealing an opening of the groove to form a sealed cavity body; and

a pressure-sensitive beam suspended in the sealed cavity body and parallel to the pressure-sensitive film, the pressure-sensitive beam being provided with a varistor; and

wherein the pressure-sensitive beam is cross-shaped, a center of the pressure-sensitive beam is fixedly connected to that of the pressure-sensitive film by a first anchor; and a periphery of the pressure-sensitive beam is fixedly connected to a bottom wall of the groove of the substrate, such that the pressure-sensitive film drives the pressure-sensitive beam to bending deformation under an external pressure;

wherein an end of four sides of the pressure-sensitive beam away from the center of the pressure-sensitive beam is fixedly connected to the bottom wall of the groove of the substrate by an anchor ring respectively; and

wherein a limiting protrusion part is further disposed in the sealed cavity body, and the limiting protrusion is disposed on the bottom wall of the groove of the substrate and located below the center of the pressure-sensitive beam.

2. The element according to claim 1 , the element comprising four varistors, which are disposed on four sides of the pressure-sensitive beam correspondingly and form a Wheatstone bridge.

3. The element according to claim 1 , wherein the pressure-sensitive film is made of monocrystalline silicon material.

4. The element according to claim 1 , wherein a thickness of the pressure-sensitive film is 10 μm-30 μm.