IP Library Granted Patent US 10,388,456
Granted Patent B2
US 10,388,456 · App. 15/577,306 · Granted Aug 20, 2019

Dielectric composition, dielectric element, electronic component and laminated electronic component

Inventors: Tomoya Imura (Tokyo, JP); Tomohiro Terada (Tokyo, JP)
Assignee: TDK ELECTRONICS AG
H01G4/1227C04B35/462C04B35/47C04B35/475C04B35/62685C04B35/638C04B35/64C04B41/009C04B41/4578C04B41/5111C04B41/88H01G4/1218H01G4/228H01G4/30C04B2235/3201C04B2235/3203C04B2235/3206C04B2235/3213C04B2235/3224C04B2235/3225C04B2235/3227C04B2235/3236C04B2235/3262C04B2235/3277C04B2235/3281C04B2235/3284C04B2235/3298C04B2235/5445C04B2235/602C04B2235/612C04B2235/656C04B2235/6582C04B2235/768C04B2235/785
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Quick Facts
Patent No.
US 10,388,456
App. No.
15/577,306
Granted
Aug 20, 2019
Kind
B2
Abstract

A dielectric composition, a dielectric element, an electronic component and a laminated electronic component are disclosed. In an embodiment the dielectric composition includes a perovskite compound comprising a main component having Bi, Na, Sr, Ln and Ti, wherein Ln is at least one type of a rare earth element, and wherein a mean crystal grain size is between 0.1 μm and 1 μm.

Claims (29)

1. A dielectric composition comprising:

a perovskite compound comprising a main component having Bi, Na, Sr, Ln and Ti,

wherein Ln is at least one type of a rare earth element, and

wherein a mean crystal grain size is between 0.1 μm and 0.89 μm.

2. The dielectric composition according to claim 1 ,

wherein the main component is represented by (Bi a Na b Sr c Ln d )TiO 3 , and

wherein a, b, c and d satisfy the following, respectively: 0<a<0.50, 0<b<0.50, 0<c≤0.80, 0<d≤0.20 and 0.90≤a+b+c+d≤1.05.

3. The dielectric composition according to claim 1 , wherein the dielectric composition comprises between 5 molar parts and 18 molar parts of at least one from the group consisting of Li and K as an auxiliary component, with respect to 100 molar parts of Ti contained in the main component.

4. The dielectric composition according to claim 1 , wherein the dielectric composition comprises between 0.2 molar parts and 1 molar part of at least one from the group consisting of Cu, Mn, Zn, Mg and Co as an auxiliary component, with respect to 100 molar parts of Ti contained in the main component.

5. A dielectric element comprising the dielectric composition according to claim 1 .

6. An electronic component including a dielectric layer comprising the dielectric composition according to claim 1 .

7. A laminated electronic component comprising a laminated portion, wherein the laminated portion is formed by alternately laminating an internal electrode layer and a dielectric layer comprising the dielectric composition according to claim 1 .

8. The laminated electronic component according to claim 7 , wherein the internal electrode layer comprises a conductive material, and wherein the conductive material is a noble metal or a base metal that acts essentially as an electrode.

9. The laminated electronic component according to claim 8 , wherein the noble metal or base metal comprises Cu or Cu alloy.

10. The laminated electronic component according to claim 7 , wherein the laminated electronic component comprises external electrodes formed of a metal.

11. The laminated electronic component according to claim 10 , wherein the external electrodes are formed of one type of metal selected from the group consisting of Ni, Pd, Ag, Au, Cu, Pt, Rh, Ru and Ir used alone or used as an alloy of two or more metals.

12. The laminated electronic component according to claim 7 , wherein the laminated electronic component is a laminated ceramic capacitor.

13. A dielectric composition comprising:

a perovskite compound comprising a main component having Bi, Na, Sr, Ln and Ti,

wherein Ln is at least one type of a rare earth element, and

wherein a mean crystal grain size is between 0.1 μm and 0.50 μm.

14. The dielectric composition according to claim 13 ,

wherein the main component is represented by (Bi a Na b Sr c Ln d )TiO 3 , and

wherein a, b, c and d satisfy the following, respectively: 0<a<0.50, 0<b<0.50, 0<c≤0.80, 0<d≤0.20 and 0.90≤a+b+c+d≤1.05.

15. The dielectric composition according to claim 13 , wherein the dielectric composition comprises between 5 molar parts and 18 molar parts of at least one from the group consisting of Li and K as an auxiliary component, with respect to 100 molar parts of Ti contained in the main component.

16. The dielectric composition according to claim 13 , wherein the dielectric composition comprises between 0.2 molar parts and 1 molar part of at least one from the group consisting of Cu, Mn, Zn, Mg and Co as an auxiliary component, with respect to 100 molar parts of Ti contained in the main component.

17. A laminated electronic component comprising a laminated portion, wherein the laminated portion is formed by alternately laminating an internal electrode layer and a dielectric layer comprising the dielectric composition according to claim 13 .

18. The laminated electronic component according to claim 17 , wherein the internal electrode layer comprises a conductive material, and wherein the conductive material is a noble metal or a base metal that acts essentially as an electrode.

19. The dielectric composition according to claim 1 , wherein the dielectric composition is configured to provide an insulation resistivity of 10 12 Ωcm or greater at a high temperature.

Assignments (2)
CHANGE OF NAME Recorded May 13, 2019
From: EPCOS AG
To: TDK ELECTRONICS AG
Reel/Frame 049342/0370 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2018
From: IMURA, TOMOYA; TERADA, TOMOHIRO
To: EPCOS AG
Reel/Frame 047527/0542 →
Priority Claims (2)
JP 2015-107731 · May 27, 2015 · national
JP 2015-256458 · Dec 28, 2015 · national
Continuity (1)
Related Publication 20180158612A1 · Jun 7, 2018